MBF2-MBF10 Schottky Surface Mount Flat Bridge Rectifier MBS .193(4.90) .177(4.50) .033(0.84) Features .022(0.56) Low profile package Ideal for automated placement Ultrafast reverse recovery time Low power losses, high efficiency Low forward voltage drop High surge capability High temperature soldering： 260℃/10 seconds at terminals .157(4.00) .142(3.60) .272(6.9) MAX .102(2.60) .087(2.20) .106(2.70) .053(1.53) .014(0.35 .090(2.30) .037(0.95) .006(0.15 .008(0.20) .114(2.9) .043(1.10) .083(2.12) MAX MAX .028(0.70) .043(1.10) Dimensions in inches and (millimeters) Mechanical Date Case: MBF molded plastic body over Schottky barrier chips Polarity: Polarity symbols marked on body Maximum Ratings & Thermal Characteristics & Electrical Characteristics (TA = 25 °C unless otherwise noted) Symbol MBF2 MBF4 MBF6 MBF8 MBF10 UNIT Maximum repetitive peak reverse voltage VRRM 20 40 60 80 100 V Maximum RMS voltage VRMS 14 28 42 56 70 V Maximum DC blocking voltage VDC 20 40 60 80 100 V Maximum average forward rectified current 0.2×0.2"(5.0×5.0mm)copper pad area Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load Maximum instantaneous forwad voltage at 1.0A Maximum DC reverse current TA = 25 ℃ at Rated DC blocking voltage TA = 100℃ Typical Junction Capacitance at 4.0V,1.0MHz Typical Thermal resistance (Note1) Operating junction temperature range Storage temperature range IF(AV) 1.0 A IFSM 30 A VF 0.50 0.55 0.85 0.5 20 IR CJ 0.70 250 mA 125 pF RθJA RθJL 85 20 ℃/ W TJ –55 to +125 ℃ TSTG – 55 to +150 ℃ Note：1.Thermal resistance from junction to ambient and from junction to lead P.C.B.mounted on 0.2×0.2"(5.0×5.0mm)copper pad areas. http://www.luguang.cn V mail:[email protected] MBF2-MBF10 Schottky Surface Mount Flat Bridge Rectifier Characteristic Curves (TA=25 ℃ unless otherwise noted) MBF2-MBF6 MBF8-MBF10 MBF2-MBF6 MBF2-MBF4 MBF6 MBF8-MBF10 MBF8-MBF10 MBF2-MBF4 MBF6 MBF8-MBF10