MP34DT01-M MEMS audio sensor omnidirectional digital microphone Datasheet - production data • VoIP • Speech recognition • A/V eLearning devices • Gaming and virtual reality input devices • Digital still and video cameras • Antitheft systems Description The MP34DT01-M is an ultra-compact, lowpower, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. HCLGA (3 x 4 x 1.06 4LD) Features The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. • Single supply voltage • Low power consumption • 120 dBSPL acoustic overload point The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format. • 61 dB signal-to-noise ratio • Omnidirectional sensitivity • – 26 dBFS sensitivity • PDM output • HCLGA package – Top-port design – SMD-compliant – EMI-shielded – ECOPACK®, RoHS, and “Green” compliant The MP34DT01-M has an acoustic overload point of 120 dBSPL with a 61 dB signal-to-noise ratio and –26 dBFS sensitivity. The MP34DT01-M is available in a top-port, SMDcompliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. Applications • Mobile terminals • Laptop and notebook computers • Portable media players Order codes Table 1. Device summary Temperature range [°C] Package -40 to +85 HCLGA (3 x 4 x 1.06) mm 4LD MP34DT01-M Packing Tray MP34DT01TR-M September 2014 This is information on a product in full production. Tape and reel DocID026514 Rev 3 1/17 www.st.com Contents MP34DT01-M Contents 1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.3 Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.1 L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 Carrier tape mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 Process recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/17 DocID026514 Rev 3 MP34DT01-M 1 Pin description Pin description Figure 1. Pin connections *$066* /5 &/. 9GG '287 *1' %277209,(: Table 2. Pin description Pin # Pin name Function 1 Vdd Power supply 2 LR Left/Right channel selection 3 CLK Synchronization input clock 4 DOUT Left/Right PDM data output 5 (ground ring) GND 0 V supply DocID026514 Rev 3 3/17 17 Acoustic and electrical specifications MP34DT01-M 2 Acoustic and electrical specifications 2.1 Acoustic and electrical characteristics The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise noted. Table 3. Acoustic and electrical characteristics Symbol Parameter Test condition Vdd Supply voltage Idd Current consumption in normal mode IddPdn Current consumption in power-down mode (2) Scc Short-circuit current AOP Acoustic overload point So Min. Typ. (1) Max. Unit 1.64 1.8 3.6 V Mean value 0.6 mA 20 µA 1 10 120 Sensitivity -29 -26 dBSPL -23 dBFS SNR Signal-to-noise ratio A-weighted at 1 kHz, 1 Pa 61 dB PSR Power supply rejection Guaranteed by design -70 dBFS Clock Input clock frequency (3) 1 3.25 MHz 10 ms -40 +85 °C Guaranteed by design 2.4 Ton Turn-on time (4) Top Operating temperature range VIOL Low level logic input/output voltage Iout = 1 mA -0.3 0.35xVdd V VIOH High level logic input/output voltage Iout = 1 mA 0.65xVdd Vdd+0.3 V 1. Typical specifications are not guaranteed. 2. Input clock in static mode. 3. Duty cycle: min = 40% max = 60%. 4. Time from the first clock edge to valid output data. Table 4. Distortion specifications 4/17 mA Parameter Test condition Value Distortion 100 dBSPL (1 kHz) < 1% THD+N Distortion 115 dBSPL (1 kHz) < 2% THD+N Distortion 120 dBSPL (1 kHz) < 10% THD+N DocID026514 Rev 3 MP34DT01-M 2.2 Acoustic and electrical specifications Frequency response Figure 2. Typical frequency response normalized at 1 kHz DocID026514 Rev 3 5/17 17 Acoustic and electrical specifications 2.3 MP34DT01-M Timing characteristics Table 5. Timing characteristics Parameter Description fCLK Clock frequency for normal mode fPD Clock frequency for power-down mode TCLK Clock period for normal mode Data enabled on DATA line, L/R pin = 1 TR,DIS Data disabled on DATA line, L/R pin = 1 TL,DIS Max. Unit 1 3.25 MHz 0.23 MHz 1000 ns 308 TR,EN TL,EN Min. (1) 18 ns 16(1) (1) Data enabled on DATA line, L/R pin = 0 18 ns ns 16(1) Data disabled on DATA line, L/R pin = 0 ns 1. From design simulations Figure 3. Timing waveforms TCLK CLK TL,DIS TR,EN TR,DIS High Z PDM R High Z TL,EN PDM L High Z High Z AM045165v1 6/17 DocID026514 Rev 3 MP34DT01-M Application recommendations Figure 4. MP34DT01-M electrical connections (Top view) 9GG ) Q) /5 'RXW &2'(& 3 Application recommendations &/. *URXQGULQJ *$066* Figure 5. MP34DT01-M electrical connections for stereo configuration (Top view) 9GG ) Q) 'RXW 'RXW 9GG *URXQGULQJ &/. &2'(& *$066* DocID026514 Rev 3 7/17 17 Application recommendations MP34DT01-M Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as near as possible to pin 1 of the device (common design practice). The L/R pin must be connected to Vdd or GND (refer to Table 5). 8/17 DocID026514 Rev 3 MP34DT01-M 4 Sensing element Sensing element The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transducers the sound pressure into the changes of coupled capacity between those two plates. Omron Corporation supplies this element for STMicroelectronics. DocID026514 Rev 3 9/17 17 Absolute maximum ratings 5 MP34DT01-M Absolute maximum ratings Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 6. Absolute maximum ratings Symbol Ratings Vdd Supply voltage Vin Input voltage on any control pin TSTG Storage temperature range Electrostatic discharge protection ESD 3 discharges at ± 8 kV direct contact to lid when unit is grounded (IEC 61000-4-2) and 3 discharges at ± 2 kV direct contact to I/O pins. (MIL 883E, Method 3015.7) Maximum value Unit -0.3 to 6 V -0.3 to Vdd +0.3 V -40 to +125 °C 2 (HBM) kV ±8 kV This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. This device is ESD-sensitive, improper handling can cause permanent damage to the part. 10/17 DocID026514 Rev 3 MP34DT01-M Functionality 6 Functionality 6.1 L/R channel selection The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 7. The L/R pin must be connected to Vdd or GND. Table 7. L/R channel selection L/R CLK low CLK high GND Data valid High impedance Vdd High impedance Data valid DocID026514 Rev 3 11/17 17 Package mechanical data 7 MP34DT01-M Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Soldering information The HCLGA 3x4 4LD package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. Landing pattern and soldering recommendations are available at www.st.com. Figure 6. Recommended soldering profile limits tp TP CRITICAL ZONE RAMP-UP TL to T P TL TEMPERATURE TSMAX tL TSMIN ts PREHEAT RAMP-DOWN T25°C to PEAK 30 60 90 120 150 180 TIME 210 240 270 300 330 360 390 AM045166v1 Table 8. Recommended soldering profile limits Description Average ramp rate Parameter Pb free TL to TP 3 °C/sec max TSMIN TSMAX tS 150 °C 200 °C 60 sec to 120 sec Preheat Minimum temperature Maximum temperature Time (TSMIN to TSMAX) TSMAX to TL Ramp-up rate Time maintained above liquidus temperature Liquidus temperature tL TL 60 sec to 150 sec 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 12/17 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t25 °C) to peak temperature 8 minutes max DocID026514 Rev 3 MP34DT01-M Package mechanical data Figure 7. HCLGA (3 x 4 x 1.06 mm) 4-lead package outline 32$BB$ Note: The MEMS microphone metal cap can exhibit some level of variation in color when the device is subjected to thermal process. Dimensions are in millimeter unless otherwise specified. General tolerance is ± 0.15 mm unless otherwise specified. Table 9. HCLGA (3 x 4 x 1.06 mm) mechanical data Item Dimension (mm) Tolerance (mm) Length [L] 4 ± 0.1 Width [W] 3 ± 0.1 Height [H] 1.06 ± 0.1 DocID026514 Rev 3 13/17 17 Carrier tape mechanical specifications 8 MP34DT01-M Carrier tape mechanical specifications Figure 8. Carrier tape without microphone-top view Figure 9. Carrier tape with microphone-top view 14/17 DocID026514 Rev 3 MP34DT01-M 9 Process recommendations Process recommendations To ensure a consistent manufacturing process it is strongly advised to comply with following recommendations: – The recommended pick-up area for the MP34DT01-M package must be defined using the worst case (ie. no device alignment during picking process). This area has been defined considering all the tolerances of the components involved (reel, package, sound inlet). Picker tolerance shall be considered as well. – To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the component on the inlet area – For the package outline please refer to Figure 10. Nozzle shape, size, and placement accuracy are the other key factors to consider when deciding on the coordinates for the picking. – Device alignment before picking is highly recommended. – A vacuum force greater than 7 psi must be avoided – 1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm – All the recommended dimensions (device safe pick area) do not include the pick and place equipment tolerances – According to Figure 10, standard picker tool can be used to handle this device Figure 10. Recommended picking area 0.58 0.23 0.285 Radius of package corner (0.25 mm) Pocket Positional Tolerance Package Size Tolerance 1.49 1.99 2.27 Pocket Size Clearance Sound Port Positional Tolerance Safe Pick Area 0.96 1.245 GAMS3107141420SG DocID026514 Rev 3 15/17 17 Revision history 10 MP34DT01-M Revision history Table 10. Document revision history Date Revision Changes 19-Jun-2014 1 Initial release 09-Jul-2014 2 Modified Min. and Max. values So parameter Table 3 on page 4 Added: 03-Sep-2014 16/17 3 – Table 4: Distortion specifications on page 4 – Section 3: Application recommendations on page 7 – Section 9: Process recommendations on page 15 DocID026514 Rev 3 MP34DT01-M IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved DocID026514 Rev 3 17/17 17