TDK CGJ2B3X7R1H103K050BB Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : December 06, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ2B3X7R1H103K050BB
TDK item description CGJ2B3X7R1H103KT****
Applications
Feature
Series
High Reliability Grade
General General (Up to 50V)
AEC-Q200 AEC-Q200
CGJ2(1005) [EIA 0402]
Status
Production
Size
Length(L)
1.00mm ±0.05mm
Width(W)
0.50mm ±0.05mm
Thickness(T)
0.50mm ±0.05mm
Terminal Width(B)
0.10mm Min.
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
0.30mm to 0.50mm
Recommended Land Pattern (PB)
0.35mm to 0.45mm
Recommended Land Pattern (PC)
0.40mm to 0.60mm
Electrical Characteristics
Capacitance
10nF ±10%
Rated Voltage
50VDC
Temperature Characteristic
X7R(±15%)
Dissipation Factor (Max.)
5%
Insulation Resistance (Min.)
10000MΩ
Other
Soldering Method
Reflow
AEC-Q200
Yes
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
10000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : December 06, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGJ2B3X7R1H103K050BB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
CGJ2B3X7R1H103K050BB
ESR
CGJ2B3X7R1H103K050BB
Capacitance
CGJ2B3X7R1H103K050BB
CGJ2B3X7R1H103K050BB
Temperature Characteristic
CGJ2B3X7R1H103K050BB(No Bias)
DC Bias Characteristic
CGJ2B3X7R1H103K050BB(DC Bias
= 25V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Ripple Temperature Rising
CGJ2B3X7R1H103K050BB(100kHz)
CGJ2B3X7R1H103K050BB(500kHz)
CGJ2B3X7R1H103K050BB(1MHz)
Multilayer Ceramic Chip Capacitors
CGJ2B3X7R1H103K050BB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : December 06, 2017 (GMT)
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