TI1 LMR16030 Simple switcher step-down converter Datasheet

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LMR16030
SNVSAH9 – DECEMBER 2015
1 Features
3 Description
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The LMR16030 is a 60 V, 3 A SIMPLE SWITCHER®
step down regulator with an integrated high-side
MOSFET. With a wide input range from 4.5 V to 60
V, it’s suitable for various applications from industrial
to automotive for power conditioning from
unregulated sources. The regulator’s quiescent
current is 40 µA in Sleep-mode, which is suitable for
battery powered systems. An ultra-low 1 μA current in
shutdown mode can further prolong battery life. A
wide adjustable switching frequency range allows
either efficiency or external component size to be
optimized. Internal loop compensation means that the
user is free from the tedious task of loop
compensation design. This also minimizes the
external components of the device. A precision
enable input allows simplification of regulator control
and system power sequencing. The device also has
built-in protection features such as cycle-by-cycle
current limit, thermal sensing and shutdown due to
excessive power dissipation, and output overvoltage
protection.
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4.5 V to 60 V Input Range
3 A Continuous Output Current
Ultra-low 40 µA Operating Quiescent Current
155 mΩ High-Side MOSFET
Minimum Switch-On Time: 90 ns
Current Mode Control
Adjustable Switching Frequency from 200 kHz to
2.5 MHz
Frequency Synchronization to External Clock
Internal Compensation for Ease of Use
High Duty Cycle Operation Supported
Precision Enable Input
1 µA Shutdown Current
External Soft-start
Thermal, Overvoltage and Short Protection
8-Pin HSOIC with PowerPAD™ Package
2 Applications
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The LMR16030 is available in an 8-pin HSOIC
package with exposed pad for low thermal resistance.
Automotive Battery Regulation
Industrial Power Supplies
Telecom and Datacom Systems
General Purpose Wide Vin Regulation
space
(1)
Device Information
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LMR16030PDDA
(Power Good)
HSOIC (8)
4.89 mm x 3.90 mm
HSOIC (8)
4.89 mm x 3.90 mm
LMR16030SDDA
(Soft Start)
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
Efficiency vs Output Current
Vout = 5 V, fs = 300 kHz
VIN up to 60 V
CIN
100
VIN
BOOT
EN
CBOOT
VOUT
SW
D
RT
RFBT
COUT
FB
SS
CSS
GND
RFBB
Efficiency (%)
RT/SYNC
90
L
80
70
60
50
VIN = 12 V
VIN = 24 V
40
0.0001
0.001
0.01
IOUT (A)
0.1
1
3
D001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.
PRODUCT PREVIEW
LMR16030 SIMPLE SWITCHER® 60 V, 3 A Step-Down Converter
LMR16030
SNVSAH9 – DECEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Device and Documentation Support....................
6.1
6.2
6.1
6.2
6.3
1
1
1
2
3
4
7
Device Support ........................................................
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
4
4
5
5
5
Mechanical, Packaging, and Orderable
Information ............................................................. 5
4 Revision History
DATE
REVISION
NOTES
December 2015
*
Initial release.
PRODUCT PREVIEW
2
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: LMR16030
LMR16030
www.ti.com
SNVSAH9 – DECEMBER 2015
5 Pin Configuration and Functions
DDA Package
8-Pin (HSOIC)
Top View
BOOT
1
VIN
2
EN
3
RT/SYNC
4
Thermal Pad
(9)
8
SW
7
GND
6
SS or PGOOD
5
FB
Pin Functions
TYPE
(1)
DESCRIPTION
NAME
NO.
BOOT
1
P
Bootstrap capacitor connection for high-side MOSFET driver. Connect a high quality 0.1 μF
capacitor from BOOT to SW.
VIN
2
P
Connect to power supply and bypass capacitors CIN. Path from VIN pin to high frequency
bypass CIN and GND must be as short as possible.
EN
3
I
Enable pin, with internal pull-up current source. Pull below 1.2 V to disable. Float or connect
to VIN to enable. Adjust the input under voltage lockout with two resistors. See the Enable
and Adjusting Under voltage lockout section.
RT/SYNC
4
I
Resistor Timing or External Clock input. An internal amplifier holds this pin at a fixed voltage
when using an external resistor to ground to set the switching frequency. If the pin is pulled
above the PLL upper threshold, a mode change occurs and the pin becomes a
synchronization input. The internal amplifier is disabled and the pin is a high impedance clock
input to the internal PLL. If clocking edges stop, the internal amplifier is re-enabled and the
operating mode returns to frequency programming by resistor.
FB
5
I
Feedback input pin, connect to the feedback divider to set VOUT. Do not short this pin to
ground during operation.
SS
or
PGOOD
6
O
SS pin for soft-start version, connect to a capacitor to set soft-start time.
PGOOD pin for Power Good version, open drain output for power-good flag, use a 10 kΩ to
100 kΩ pull-up resistor to logic rail or other DC voltage no higher than 7 V.
GND
7
G
System ground pin.
SW
8
P
Switching output of the regulator. Internally connected to high-side power MOSFET. Connect
to power inductor.
Thermal Pad
9
G
Major heat dissipation path of the die. Must be connected to ground plane on PCB.
(1)
I = Input, O = Output, G = Ground, P = Power
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: LMR16030
3
PRODUCT PREVIEW
PIN
LMR16030
SNVSAH9 – DECEMBER 2015
www.ti.com
6 Device and Documentation Support
6.1 Device Support
6.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
6.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
PRODUCT PREVIEW
4
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: LMR16030
LMR16030
www.ti.com
SNVSAH9 – DECEMBER 2015
6.1 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
SIMPLE SWITCHER is a registered trademark of Texas Instruments.
6.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
6.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
7 Mechanical, Packaging, and Orderable Information
PRODUCT PREVIEW
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: LMR16030
5
PACKAGE OPTION ADDENDUM
www.ti.com
7-Jan-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMR16030PDDA
PREVIEW SO PowerPAD
DDA
8
75
TBD
Call TI
Call TI
-40 to 125
LMR16030PDDAR
PREVIEW SO PowerPAD
DDA
8
2500
TBD
Call TI
Call TI
-40 to 125
LMR16030SDDA
PREVIEW SO PowerPAD
DDA
8
75
TBD
Call TI
Call TI
-40 to 125
LMR16030SDDAR
PREVIEW SO PowerPAD
DDA
8
2500
TBD
Call TI
Call TI
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
7-Jan-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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