LM341/LM78MXX www.ti.com SNVS090E – MAY 2004 – REVISED AUGUST 2005 LM341/LM78MXX Series 3-Terminal Positive Voltage Regulators Check for Samples: LM341/LM78MXX FEATURES DESCRIPTION • • • • • • The LM341 and LM78MXX series of three-terminal positive voltage regulators employ built-in current limiting, thermal shutdown, and safe-operating area protection which makes them virtually immune to damage from output overloads. 1 2 • Output Current in Excess of 0.5A No External Components Internal Thermal Overload Protection Internal Short Circuit Current-Limiting Output Transistor Safe-Area Compensation Available in TO-220, TO, and PFM D-PAK Packages Output Voltages of 5V, 12V, and 15V With adequate heatsinking, they can deliver in excess of 0.5A output current. Typical applications would include local (on-card) regulators which can eliminate the noise and degraded performance associated with single-point regulation. Connection Diagram Figure 1. TO Metal Can Package (NDT) - Bottom View See Package Number NDT0003A Figure 2. TO-220 Power Package (NDE) - Top View See Package Number NDE0003B Figure 3. PFM - Top View See Package Number NDP0003B These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2005, Texas Instruments Incorporated LM341/LM78MXX SNVS090E – MAY 2004 – REVISED AUGUST 2005 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) Lead Temperature (Soldering, 10 seconds) TO Package (NDT) 300°C TO-220 Package (NDE) 260°C Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Power Dissipation (3) Internally Limited Input Voltage 5V ≤ VO ≤ 15V 35V ESD Susceptibility TBD (1) (2) (3) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its rated operating conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The typical thermal resistance of the three package types is: NDE (TO-220) package: θ(JA) = 60 °C/W, θ(JC) = 5 °C/W NDT (TO) package: θ(JA) = 120 °C/W, θ(JC) = 18 °C/W NDP (PFM) package: θ(JA) = 92 °C/W, θ(JC) = 10 °C/W LM341-5.0, LM78M05C ELECTRICAL CHARACTERISTICS Unless otherwise specified: VIN = 10V, CIN = 0.33 μF, CO = 0.1 μF Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the −40°C to +125°C operating temperature range. Limits are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Symbol VO Parameter Conditions Output Voltage VR LINE Min Typ Max Units IL= 500 mA 4.8 5.0 5.2 V 5 mA ≤ IL ≤ 500 mA PD ≤ 7.5W, 7.5V ≤ VIN ≤ 20V 4.75 5.0 5.25 7.2V ≤ VIN ≤ 25V Line Regulation IL = 100 mA 50 IL = 500 mA 100 VR LOAD Load Regulation 5 mA ≤ IL ≤ 500 mA IQ Quiescent Current IL = 500 mA ΔIQ Quiescent Current Change 5 mA ≤ IL ≤ 500 mA 0.5 7.5V ≤ VIN ≤ 25V, IL = 500 mA 1.0 mV 100 4 10.0 mA Vn Output Noise Voltage f = 10 Hz to 100 kHz 40 μV ΔVIN/ΔVO Ripple Rejection f = 120 Hz, IL = 500 mA 78 dB VIN Input Voltage Required to Maintain Line Regulation IL = 500 mA ΔVO Long Term Stability IL = 500 mA 2 Submit Documentation Feedback 7.2 V 20 mV/khrs Copyright © 2004–2005, Texas Instruments Incorporated Product Folder Links: LM341/LM78MXX LM341/LM78MXX www.ti.com SNVS090E – MAY 2004 – REVISED AUGUST 2005 LM341-12, LM78M12C ELECTRICAL CHARACTERISTICS Unless otherwise specified: VIN = 19V, CIN = 0.33 μF, CO = 0.1 μF Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the −40°C to +125°C operating temperature range. Limits are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Symbol VO Parameter Conditions Output Voltage VR LINE Min Typ Max Units IL= 500 mA 11.5 12 12.5 V 5 mA ≤ IL ≤ 500 mA PD ≤ 7.5W, 14.8V ≤ VIN ≤ 27V 11.4 12 12.6 14.5V ≤ VIN ≤ 30V Line Regulation IL = 100 mA 120 IL = 500 mA 240 mV VR LOAD Load Regulation 5 mA ≤ IL ≤ 500 mA IQ Quiescent Current IL = 500 mA ΔIQ Quiescent Current Change 5 mA ≤ IL ≤ 500 mA Vn Output Noise Voltage f = 10 Hz to 100 kHz 75 μV ΔVIN/ΔVO Ripple Rejection f = 120 Hz, IL = 500 mA 71 dB VIN Input Voltage Required to Maintain Line Regulation IL = 500 mA ΔVO Long Term Stability IL = 500 mA 240 4 10.0 mA 0.5 14.8V ≤ VIN ≤ 30V, IL = 500 mA 1.0 14.5 V 48 mV/khrs LM341-15, LM78M15C ELECTRICAL CHARACTERISTICS Unless otherwise specified: VIN = 23V, CIN = 0.33 μF, CO = 0.1 μF Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the −40°C to +125°C operating temperature range. Limits are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Symbol VO VR LINE Parameter Conditions Output Voltage Min Typ IL= 500 mA 14.4 5 mA ≤ IL ≤ 500 mA PD ≤ 7.5W, 18V ≤ VIN ≤ 30V 14.25 17.6V ≤ VIN ≤ 30V Line Regulation VR LOAD Load Regulation 5 mA ≤ IL ≤ 500 mA IQ Quiescent Current IL = 500 mA ΔIQ Quiescent Current Change 5 mA ≤ IL ≤ 500 mA Max Units 15 15.6 V 15 15.75 IL = 100 mA 150 IL = 500 mA 300 mV 300 4 10.0 mA 0.5 18V ≤ VIN ≤ 30V, IL = 500 mA 1.0 Vn Output Noise Voltage f = 10 Hz to 100 kHz 90 μV ΔVIN/ΔVO Ripple Rejection f = 120 Hz, IL = 500 mA 69 dB VIN Input Voltage Required to Maintain Line Regulation IL = 500 mA ΔVO Long Term Stability IL = 500 mA 17.6 V 60 mV/khrs Submit Documentation Feedback Copyright © 2004–2005, Texas Instruments Incorporated Product Folder Links: LM341/LM78MXX 3 LM341/LM78MXX SNVS090E – MAY 2004 – REVISED AUGUST 2005 www.ti.com SCHEMATIC DIAGRAM 4 Submit Documentation Feedback Copyright © 2004–2005, Texas Instruments Incorporated Product Folder Links: LM341/LM78MXX LM341/LM78MXX www.ti.com SNVS090E – MAY 2004 – REVISED AUGUST 2005 TYPICAL PERFORMANCE CHARACTERISTICS Peak Output Current Ripple Rejection Figure 4. Figure 5. Ripple Rejection Dropout Voltage Figure 6. Figure 7. Output Voltage (Normalized to 1V at TJ = 25°C) Quiescent Current Figure 8. Figure 9. Submit Documentation Feedback Copyright © 2004–2005, Texas Instruments Incorporated Product Folder Links: LM341/LM78MXX 5 LM341/LM78MXX SNVS090E – MAY 2004 – REVISED AUGUST 2005 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) 6 Quiescent Current Output Impedance Figure 10. Figure 11. Line Transient Response Load Transient Response Figure 12. Figure 13. Submit Documentation Feedback Copyright © 2004–2005, Texas Instruments Incorporated Product Folder Links: LM341/LM78MXX LM341/LM78MXX www.ti.com SNVS090E – MAY 2004 – REVISED AUGUST 2005 DESIGN CONSIDERATIONS The LM78MXX/LM341XX fixed voltage regulator series has built-in thermal overload protection which prevents the device from being damaged due to excessive junction temperature. The regulators also contain internal short-circuit protection which limits the maximum output current, and safearea protection for the pass transistor which reduces the short-circuit current as the voltage across the pass transistor is increased. Although the internal power dissipation is automatically limited, the maximum junction temperature of the device must be kept below +125°C in order to meet data sheet specifications. An adequate heatsink should be provided to assure this limit is not exceeded under worst-case operating conditions (maximum input voltage and load current) if reliable performance is to be obtained). HEATSINK CONSIDERATIONS When an integrated circuit operates with appreciable current, its junction temperature is elevated. It is important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating environment. A one-dimension steady-state model of conduction heat transfer is demonstrated in Figure 14 The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a heatsink. RθJC (Component Variables) RθCA (Application Variables) Leadframe Size & Material Mounting Pad Size, Material, & Location No. of Conduction Pins Placement of Mounting Pad Die Size PCB Size & Material Die Attach Material Traces Length & Width Molding Compound Size and Material Adjacent Heat Sources Volume of Air Air Flow Ambient Temperature Shape of Mounting Pad Submit Documentation Feedback Copyright © 2004–2005, Texas Instruments Incorporated Product Folder Links: LM341/LM78MXX 7 LM341/LM78MXX SNVS090E – MAY 2004 – REVISED AUGUST 2005 www.ti.com APPLICATION INFORMATION Note that the case temperature is measured at the point where the leads contact with the mounting pad surface Figure 14. Cross-sectional view of Integrated Circuit Mounted on a printed circuit board. The LM78MXX/LM341XX regulators have internal thermal shutdown to protect the device from over-heating. Under all possible operating conditions, the junction temperature of the LM78MXX/LM341XX must be within the range of 0°C to 125°C. A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD, must be calculated: IIN = IL + IG PD = (VIN−VOUT) IL + VINIG (1) (2) Figure 15 shows the voltages and currents which are present in the circuit. Figure 15. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise, TR(max): θJA = TR (max)/PD (3) If the maximum allowable value for θJA°C/w is found to be ≥60°C/W for TO-220 package or ≥92°C/W for PFM package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for θJA fall below these limits, a heatsink is required. As a design aid, Table 1 shows the value of the θJA of PFM for different heatsink area. The copper patterns that we used to measure these θJA are shown at the end of the Application Note Section. Figure 16 reflects the same test results as what are in the Table 1 Figure 17 shows the maximum allowable power dissipation vs. ambient temperature for the TO-252 device. Figure 18 shows the maximum allowable power dissipation vs. copper area (in2) for the TO-252 device. Please see AN-1028 (SNVA036) for power enhancement techniques to be used with TO-252 package. 8 Submit Documentation Feedback Copyright © 2004–2005, Texas Instruments Incorporated Product Folder Links: LM341/LM78MXX LM341/LM78MXX www.ti.com SNVS090E – MAY 2004 – REVISED AUGUST 2005 Table 1. θJA Different Heatsink Area Layout (1) Copper Area Thermal Resistance Top Sice (in2) (1) Bottom Side (in2) (θJA, °C/W) TO-252 1 0.0123 0 103 2 0.066 0 87 3 0.3 0 60 4 0.53 0 54 5 0.76 0 52 6 1 0 47 7 0 0.2 84 8 0 0.4 70 9 0 0.6 63 10 0 0.8 57 11 0 1 57 12 0.066 0.066 89 13 0.175 0.175 72 14 0.284 0.284 61 15 0.392 0.392 55 16 0.5 0.5 53 Tab of device attached to topside copper Figure 16. θJA vs. 2oz Copper Area for TO-252 Figure 17. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252 Submit Documentation Feedback Copyright © 2004–2005, Texas Instruments Incorporated Product Folder Links: LM341/LM78MXX 9 LM341/LM78MXX SNVS090E – MAY 2004 – REVISED AUGUST 2005 www.ti.com Figure 18. Maximum Allowable Power Dissipation vs. 2oz. Copper Area for TO-252 Typical Application *Required if regulator input is more than 4 inches from input filter capacitor (or if no input filter capacitor is used). **Optional for improved transient response. Figure 19. Typical Application 10 Submit Documentation Feedback Copyright © 2004–2005, Texas Instruments Incorporated Product Folder Links: LM341/LM78MXX PACKAGE OPTION ADDENDUM www.ti.com 8-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM341T-15/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-15 LM78M15CT LM341T-5.0 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM341T-5.0 LM78M05CT LM341T-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-5.0 LM78M05CT LM78M05CDT NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LM78M05 CDT LM78M05CDT/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM78M05 CDT LM78M05CDTX NRND TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125 LM78M05 CDT LM78M05CDTX/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM78M05 CDT LM78M05CH ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 125 ( LM78M05CH ~ LM78M05CH) LM78M05CH/NOPB ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 125 ( LM78M05CH ~ LM78M05CH) LM78M05CT NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM341T-5.0 LM78M05CT LM78M05CT/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-5.0 LM78M05CT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 8-Oct-2015 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM78M05CDTX TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM78M05CDTX/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM78M05CDTX TO-252 NDP 3 2500 367.0 367.0 35.0 LM78M05CDTX/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA NDT0003A H03A (Rev D) www.ti.com MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA NDP0003B TD03B (Rev F) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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