Material Content Data Sheet Sales Product Name IFX91041EJV MA# MA000981520 Package PG-DSO-8-27 Issued 29. August 2013 Weight* 84.54 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 2.728 3.23 0.009 0.01 0.036 0.04 430 0.728 0.86 8608 29.548 34.95 35.86 349522 358668 0.533 0.63 0.63 6300 6300 0.097 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.23 32269 32269 108 1152 4.479 5.30 44.106 52.17 57.59 521734 575865 0.695 0.82 0.82 8223 8223 0.725 0.86 0.86 8570 8570 0.214 0.25 0.641 0.76 52979 2526 1.01 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7579 10105 1000000