TI CD74ACT00E Quadruple 2-input positive-nand gate Datasheet

CD54ACT00, CD74ACT00
QUADRUPLE 2-INPUT POSITIVE-NAND GATES
SCHS308B – JANUARY 2001 – REVISED JUNE 2002
D
D
D
D
D
D
CD54ACT00 . . . F PACKAGE
CD74ACT00 . . . E OR M PACKAGE
(TOP VIEW)
Inputs Are TTL-Voltage Compatible
Speed of Bipolar F, AS, and S, With
Significantly Reduced Power Consumption
Balanced Propagation Delays
±24-mA Output Drive Current
– Fanout to 15 F Devices
SCR-Latchup-Resistant CMOS Process and
Circuit Design
Exceeds 2-kV ESD Protection Per
MIL-STD-883, Method 3015
1A
1B
1Y
2A
2B
2Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4B
4A
4Y
3B
3A
3Y
description
The ‘ACT00 devices contain four independent 2-input NAND gates. Each gate performs the Boolean function
of Y = A S B or Y = A + B in positive logic.
ORDERING INFORMATION
PDIP – E
–55°C
55°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC – M
Tube
CD74ACT00E
Tube
CD74ACT00M
Tape and reel
CD74ACT00M96
TOP-SIDE
MARKING
CD74ACT00E
ACT00M
CDIP – F
Tube
CD54ACT00F3A
CD54ACT00F3A
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
FUNCTION TABLE
(each gate)
INPUTS
OUTPUT
Y
A
B
H
H
L
L
X
H
X
L
H
logic diagram, each gate (positive logic)
A
Y
B
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
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1
CD54ACT00, CD74ACT00
QUADRUPLE 2-INPUT POSITIVE-NAND GATES
SCHS308B – JANUARY 2001 – REVISED JUNE 2002
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
TA = 25°C
–40°C TO
85°C
–55°C TO
125°C
MIN
MAX
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
High-level output current
–24
IOL
∆t/∆v
Low-level output current
Input transition rise or fall rate
High-level input voltage
2
2
0.8
UNIT
2
V
0.8
V
VCC
VCC
V
–24
–24
mA
24
24
24
mA
10
10
10
ns/V
VCC
VCC
0.8
V
0
0
VCC
VCC
0
0
V
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
TEST CONDITIONS
VI = VIH or VIL
VOL
VI = VIH or VIL
II
ICC
VI = VCC or GND
VI = VCC or GND,
∆ICC
Ci
VI = VCC – 2.1 V
VCC
TA = 25°C
–40°C TO
85°C
–55°C TO
125°C
MIN
MIN
MIN
MAX
MAX
UNIT
MAX
IOH = –50 µA
IOH = –24 mA
IOH = –50 mA‡
4.5 V
4.4
4.4
4.5 V
3.94
3.8
IOH = –75 mA‡
IOL = 50 µA
5.5 V
4.5 V
0.1
0.1
0.1
IOL = 24 mA
IOL = 50 mA‡
IOL = 75 mA‡
4.5 V
0.36
0.44
0.5
4.4
3.7
5.5 V
3.85
5.5 V
1.65
5.5 V
5.5 V
IO = 0
5.5 V
4.5 V to 5.5 V
V
3.85
V
1.65
±0.1
±1
±1
µA
4
40
80
µA
2.4
2.8
3
mA
10
10
10
pF
‡ Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize
power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CD54ACT00, CD74ACT00
QUADRUPLE 2-INPUT POSITIVE-NAND GATES
SCHS308B – JANUARY 2001 – REVISED JUNE 2002
ACT INPUT LOAD TABLE
INPUT
UNIT LOAD
A or B
0.15
Unit load is ∆ICC limit specified
in electrical characteristics
table (e.g., 2.4 mA at 25°C).
switching characteristics over recommended operating free-air
VCC = 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
FROM
(INPUT)
TO
(OUTPUT)
A or B
Y
temperature
–40°C TO
85°C
–55°C TO
125°C
MIN
MAX
MIN
MAX
3.4
9.5
3.2
10.8
2.8
8
2.7
13.2
range,
UNIT
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TYP
Power dissipation capacitance
45
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
pF
3
CD54ACT00, CD74ACT00
QUADRUPLE 2-INPUT POSITIVE-NAND GATES
SCHS308B – JANUARY 2001 – REVISED JUNE 2002
PARAMETER MEASUREMENT INFORMATION
S1
R1 = 500 Ω
From Output
Under Test
2 × VCC
Open
GND
CL = 50 pF
(see Note A)
R2 = 500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
tw
3V
1.5 V
Input
LOAD CIRCUIT
1.5 V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
CLR
Input
3V
Reference
Input
3V
1.5 V
1.5 V
0V
0V
trec
Data
Input
3V
1.5 V
CLK
th
tsu
1.5 V
10%
90%
90%
tr
0V
VOLTAGE WAVEFORMS
RECOVERY TIME
3V
1.5 V
10% 0 V
tf
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
3V
Input
1.5 V
1.5 V
0V
tPLH
In-Phase
Output
50%
10%
90%
90%
tr
90%
1.5 V
1.5 V
0V
tPHL
tPHL
Out-of-Phase
Output
3V
Output
Control
VOH
50% VCC
10%
VOL
tf
tPLH
50% VCC
10%
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLZ
tPZL
20% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
≈VCC
20% VCC
VOL
80% VCC
VOH
80% VCC
≈0 V
VOLTAGE WAVEFORMS
OUTPUT ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
Phase relationships between waveforms are arbitrary.
D. For clock inputs, fmax is measured with the input duty cycle at 50%.
E. The outputs are measured one at a time with one input transition per measurement.
F. tPLH and tPHL are the same as tpd.
G. tPZL and tPZH are the same as ten.
H. tPLZ and tPHZ are the same as tdis.
Figure 1. Load Circuit and Voltage Waveforms
4
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• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
CD54ACT00F3A
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
N / A for Pkg Type
CD74ACT00E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT00EE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT00M
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT00M96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT00M96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT00ME4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
Package
Drawing
Pins Package Eco Plan (2)
Qty
50
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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