MC74AC257, MC74ACT257 Quad 2-Input Multiplexer with 3-State Outputs The MC74AC257/74ACT257 is a quad 2−input multiplexer with 3−state outputs. Four bits of data from two sources can be selected using a Common Data Select input. The four outputs present the selected data in true (noninverted) form. The outputs may be switched to a high impedance state by placing a logic HIGH on the common Output Enable (OE) input, allowing the outputs to interface directly with bus−oriented systems. • • • • • OE I0c I1c Zc I0d I1d Zd 16 15 14 13 12 11 10 9 MARKING DIAGRAMS 16 Multiplexer Expansion by Tying Outputs Together Noninverting 3−State Outputs Outputs Source/Sink 24 mA ′ACT257 Has TTL Compatible Inputs These are Pb−Free Devices VCC www.onsemi.com SOIC−16 D SUFFIX CASE 751B 16 1 xxx257G AWLYWW 1 16 16 1 xxx 257 ALYWG G TSSOP−16 DT SUFFIX CASE 948F 1 1 2 3 4 5 6 7 S I0a I1a Za I0b I1b Zb xxx = AC or ACT A = Assembly Location WL or L = Wafer Lot Y = Year WW or W = Work Week G or G = Pb−Free Package 8 GND (Note: Microdot may be in either location) Figure 1. Pinout: 16−Lead Packages Conductors (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2015 March, 2015 − Rev. 8 1 Publication Order Number: MC74AC257/D MC74AC257, MC74ACT257 FUNCTIONAL DESCRIPTION PIN NAME PIN FUNCTION S Common Data Select Input OE 3−State Output Enable Input I0a−I0d Data Inputs from Source 0 I1a−I1d Data Inputs from Source 1 Za−Zd 3−State Multiplexer Outputs The MC74AC257/74ACT257 is a quad 2−input multiplexer with 3−state outputs. It selects four bits of data from two sources under control of a Common Data Select input. When the Select input is LOW, the I0x inputs are selected and when Select is HIGH, the I1x inputs are selected. The data on the selected inputs appears at the outputs in true (noninverted) form. The device is the logic implementation of a 4−pole, 2−position switch where the position of the switch is determined by the logic levels supplied to the Select input. The logic equations for the outputs are shown below: Za = OE•(I1a•S+I0a•S) Zb = OE•(I1b•S+I0b•S) Zc = OE•(I1c•S+I0c•S) Zd = OE•(I1d•S+I0d•S) When the Output Enable input (OE) is HIGH, the outputs are forced to a high impedance state. If the outputs are tied together, all but one device must be in the high impedance state to avoid high currents that would exceed the maximum ratings. Designers should ensure the Output Enable signals to 3−state devices whose outputs are tied together are designed so there is no overlap. TRUTH TABLE Output Enable Select Input Data Inputs OE S I0 I1 Z H L L L L X H H L L X X X L H X L H X X Z L H L H Outputs H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance OE I0a I1a I0b I1b I0c I1c I0d I1d S Za Zb Zc Zd Figure 2. Logic Symbol OE I0a I1a Za NOTE: I0b I1b I0c Zb I1c Zc I0d I1d Zd This diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Figure 3. Logic Diagram www.onsemi.com 2 S MC74AC257, MC74ACT257 MAXIMUM RATINGS Symbol Parameter Value Unit −0.5 to +7.0 V DC Input Voltage *0.5 ≤ VCC +0.5 V VO DC Output Voltage (Note 1) *0.5 ≤ VCC +0.5 V IIK DC Input Diode Current ±20 mA IOK DC Output Diode Current ±50 mA IO DC Output Sink/Source Current ±50 mA ICC DC Supply Current per Output Pin ±50 mA IGND DC Ground Current per Output Pin ±50 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction temperature under Bias +150 °C qJA Thermal Resistance (Note 2) SOIC TSSOP 69.1 103.8 °C/W PD Power Dissipation in Still Air at 65°C (Note 3) SOIC TSSOP 500 500 mW MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Human Body Model (Note 4) Machine Model (Note 5) Charged Device Model (Note 6) ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 7) VCC DC Supply Voltage VI Level 1 Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in > 2000 > 200 > 1000 V ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. The package thermal impedance is calculated in accordance with JESD51−7. 3. 500 mW at 65°C; derate to 300 mW by 10 mW/ from 65°C to 85°C. 4. Tested to EIA/JESD22−A114−A. 5. Tested to EIA/JESD22−A115−A. 6. Tested to JESD22−C101−A. 7. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) ′AC Devices except Schmitt Inputs Min Typ Max Unit ′AC 2.0 5.0 6.0 ′ACT 4.5 5.0 5.5 0 − VCC VCC @ 3.0 V − 150 − VCC @ 4.5 V − 40 − VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − VCC @ 5.5 V − 8.0 − −40 25 85 °C V V ns/V tr, tf Input Rise and Fall Time (Note 2) ′ACT Devices except Schmitt Inputs TA Operating Ambient Temperature Range IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. www.onsemi.com 3 MC74AC257, MC74ACT257 DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25°C TA = −40°C to +85°C Typ VIH VIL VOH VOL Unit Conditions Guaranteed Limits Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 Maximum Low Level Output Voltage IOUT = −50 mA V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA IOUT = 50 mA V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND IOZ Maximum 3−State Current 5.5 − ±0.5 ±5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 mA VIN = VCC or GND IOLD IOHD ICC †Minimum Dynamic Output Current Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. www.onsemi.com 4 MC74AC257, MC74ACT257 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) VCC* (V) Parameter Symbol 74AC 74AC TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay In to Zn 3.3 5.0 1.5 1.5 5.0 4.0 8.5 6.0 1.0 1.0 9.0 7.0 ns 3−5 tPHL Propagation Delay In to Zn 3.3 5.0 1.5 1.5 6.0 4.5 8.5 6.0 1.0 1.0 9.0 7.0 ns 3−5 tPLH Propagation Delay S to Zn 3.3 5.0 1.5 1.5 7.0 5.0 10.5 7.5 1.5 1.0 11.5 8.5 ns 3−6 tPHL Propagation Delay S to Zn 3.3 5.0 1.5 1.5 7.5 5.5 10.5 7.5 1.5 1.0 11.5 8.5 ns 3−6 tPZH Output Enable Time 3.3 5.0 1.5 1.5 6.5 5.0 9.5 7.5 1.0 1.0 10.5 8.5 ns 3−7 tPZL Output Enable Time 3.3 5.0 1.5 1.5 5.5 5.0 9.0 8.5 1.0 1.0 10.0 9.5 ns 3−8 tPHZ Output Disable Time 3.3 5.0 1.5 1.5 5.5 5.0 10.0 9.0 1.0 1.0 11.0 10.0 ns 3−7 tPLZ Output Disable Time 3.3 5.0 1.5 1.5 5.5 5.0 9.0 8.0 1.0 1.0 10.0 9.0 ns 3−8 *Voltage Range 3.3 V is 3.3 V ±0.3 V. *Voltage Range 5.0 V is 5.0 V ±0.5 V. www.onsemi.com 5 MC74AC257, MC74ACT257 DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25°C TA = −40°C to +85°C Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 − − 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 − − 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA VOL Maximum Low Level Output Voltage V V IOUT = −50 mA *VIN = VIL or VIH −24 mA IOH −24 mA IOUT = 50 mA IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mA VI = VCC, GND DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V IOZ Maximum 3−State Current 5.5 − ±0.5 ±5.0 mA VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND 5.5 − − 75 mA VOLD = 1.65 V Max 5.5 − − −75 mA VOHD = 3.85 V Min 5.5 − 8.0 80 mA VIN = VCC or GND IOLD IOHD ICC †Minimum Dynamic Output Current Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. www.onsemi.com 6 MC74AC257, MC74ACT257 AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D) VCC* (V) Parameter Symbol 74ACT 74ACT TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay In to Zn 5.0 1.5 5.0 7.0 1.0 7.5 ns 3−6 tPHL Propagation Delay In to Zn 5.0 2.0 6.0 7.5 1.5 8.5 ns 3−6 tPLH Propagation Delay S to Zn 5.0 2.0 7.0 9.5 1.5 10.5 ns 3−6 tPHL Propagation Delay S to Zn 5.0 2.5 7.0 10.5 2.0 11.5 ns 3−6 tPZH Output Enable Time 5.0 2.0 6.0 8.0 1.5 9.0 ns 3−7 tPZL Output Enable Time 5.0 2.0 6.0 8.0 1.5 9.0 ns 3−8 tPHZ Output Disable Time 5.0 2.5 6.5 9.0 1.5 10.0 ns 3−7 tPLZ Output Disable Time 5.0 2.0 6.0 7.5 1.5 8.5 ns 3−8 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 50 pF VCC = 5.0 V ORDERING INFORMATION Package Shipping† MC74AC257DG SOIC−16 (Pb−Free) 48 Units / Rail MC74AC257DR2G SOIC−16 (Pb−Free) 2500 / Tape & Reel MC74AC257DTR2G TSSOP−16 (Pb−Free) 2500 / Tape & Reel MC74ACT257DG SOIC−16 (Pb−Free) 48 Units / Rail MC74ACT257DR2G SOIC−16 (Pb−Free) 2500 / Tape & Reel MC74ACT257DTR2G TSSOP−16 (Pb−Free) 2500 / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 7 MC74AC257, MC74ACT257 PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX CASE 948F ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S S K ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. N 0.25 (0.010) 8 1 M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE H D DETAIL E G DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74AC257, MC74ACT257 PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE K −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 B M S G R K F X 45 _ C −T− SEATING PLANE J M D DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT* 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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