Product Folder Sample & Buy Technical Documents Tools & Software Support & Community CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 CC1201 Low-Power, High-Performance RF Transceiver 1 Device Overview 1.1 Features 1 • RF Performance and Analog Features: – High-Performance, Single-Chip Transceiver • Excellent Receiver Sensitivity: – –120 dBm at 1.2 kbps – –109 dBm at 50 kbps • Blocking Performance: 85 dB at 10 MHz • Adjacent Channel Selectivity: Up to 62 dB at 50-kHz Offset • Very Low Phase Noise: –114 dBc/Hz at 10-kHz Offset (169 MHz) – Programmable Output Power Up to +16 dBm With 0.4-dB Step Size – Automatic Output Power Ramping – Supported Modulation Formats: 2-FSK, 2-GFSK, 4-FSK, 4-GFSK, MSK, OOK – Supports Data Rate Up to 1.25 Mbps in Transmit and Receive • Low Current Consumption: – Enhanced Wake-On-Radio (eWOR) Functionality for Automatic Low-Power Receive Polling – Power Down: 0.12 μA (0.5 μA With eWOR Timer Active) • RX: 0.5 mA in RX Sniff Mode • RX: 19 mA Peak Current in Low-Power Mode • RX: 23 mA Peak Current in HighPerformance Mode • TX: 46 mA at +14 dBm • Other: – Data FIFOs: Separate 128-Byte RX and TX – Support for Seamless Integration With the CC1190 Device for Increased Range Providing up to 3-dB Improvement in RX Sensitivity and up to +27 dBm TX Output Power 1.2 • • • • • Digital Features: – WaveMatch: Advanced Digital Signal Processing for Improved Sync Detect Performance – Autonomous Image Removal – Security: Hardware AES128 Accelerator – Data FIFOs: Separate 128-Byte RX and TX – Includes Functions for Antenna Diversity Support – Support for Retransmission – Support for Auto-Acknowledge of Received Packets – Automatic Clear Channel Assessment (CCA) for Listen-Before-Talk (LBT) Systems – Built-in Coding Gain Support for Increased Range and Robustness – Digital RSSI Measurement – Improved OOK Shaping for Less Occupied Bandwidth, Enabling Higher Output Power While Meeting Regulatory Requirements • Dedicated Packet Handling for 802.15.4g: – CRC 16/32 – FEC, Dual Sync Detection (FEC and non-FEC Packets) – Whitening • General: – RoHS-Compliant 5-mm × 5-mm No-Lead QFN 32-Pin Package (RHB) – Pin-Compatible With the CC1120 Device • Regulations – Suitable for Systems Targeting Compliance With: – Europe: ETSI EN 300 220 – US: FCC CFR47 Part 15 – Japan: ARIB STD-T108 Applications Low-Power, High-Performance, Wireless Systems With Data Rate up to 1250 kbps ISM/SRD Bands: 169, 433, 868, 915, and 920 MHz Possible Support for Additional Frequency Bands: 137 to 158.3 MHz, 205 to 237.5 MHz, and 274 to 316.6 MHz Smart Metering (AMR/AMI) • • • • • • Home and Building Automation Wireless Alarm and Security Systems Industrial Monitoring and Control Wireless Healthcare Applications Wireless Sensor Networks and Active RFID IEEE 802.15.4g Applications 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 1.3 www.ti.com Description The CC1201 device is a fully integrated single-chip radio transceiver designed for high performance at very low-power and low-voltage operation in cost-effective wireless systems. All filters are integrated, thus removing the need for costly external SAW and IF filters. The device is mainly intended for the ISM (Industrial, Scientific, and Medical) and SRD (Short Range Device) frequency bands at 164–190 MHz, 410–475 MHz, and 820–950 MHz. The CC1201 device provides extensive hardware support for packet handling, data buffering, burst transmissions, clear channel assessment, link quality indication, and Wake-On-Radio. The main operating parameters of the CC1201 device can be controlled through an SPI interface. In a typical system, the CC1201 device will be used with a microcontroller and only few external passive components. The CC1201 offers the same performance as the CC1200 for channel filter bandwidths of 50 kHz or more, and therefore presents a lower cost option for applications that do not require narrowband support. Device Information (1) PART NUMBER PACKAGE BODY SIZE VQFN (32) 5.00 mm x 5.00 mm CC1201RHB (1) 1.4 For more information, see Section 8, Mechanical Packaging and Orderable Information Functional Block Diagram Figure 1-1 shows the system block diagram of the CC120x family of devices. CC120x 4 kbyte ROM MARC Main Radio Control unit ADC 256 byte FIFO RAM buffer Battery sensor / temp sensor FREQ SYNTH 0 90 RF and DSP frontend PA out PA Output power ramping and OOK / ASK modulation I +16 dBm high efficiency PA Fully integrated fractional-N frequency synthesizer XOSC BIAS LFC1 LFC0 High linearity LNA LNA_N (optional GPIO for antenna diversity) IF amp SCLK SO (serial output) SCLK (serial clock) SO (GPIO0) SI (optional GPIO3/2/0) CS_N GPIO1 GPIO2 GPIO3 (optional auto detected external XOSC / TCXO) XOSC_Q1 Data interface with signal chain access XOSC XOSC_Q2 90 dB dynamic range ADC (optional bit clock) Channel filter IF amp EXT_XOSC XOSC_Q1 LNA_P XOSC_Q2 RBIAS Q Packet handler and FIFO control Cordic Configuration and status registers Interrupt and IO handler DIGITAL INTERFACE TO MCU LNA_N TXFIFO ADC LNA RXFIFO SI (serial input) DEMODULATOR System bus LNA_P PA CSn (chip select) MCU AES-128 accelerator eWOR Enhanced ultra low power Wake On Radio timer SPI Serial configuration Ultra low power 16 bit RADIO CONTROL & POWER MANAGEMENT and data interface PACKET HANDLER Power on reset Modulator Ultra low power 40 kHz auto-calibrated RC oscillator MODULATOR (optional 40 kHz clock input) Highly flexible FSK / OOK demodulator (optional low jitter serial data output for legacy protocols) 90 dB dynamic range ADC AGC Automatic Gain Control, 60dB VGA range RSSI measurements and carrier sense detection Figure 1-1. System Block Diagram 2 Device Overview Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 Table of Contents 1 2 3 4 Device Overview ......................................... 1 4.15 40-MHz Clock Input (TCXO) ........................ 16 1.1 Features .............................................. 1 4.16 32-kHz Clock Input .................................. 17 1.2 Applications ........................................... 1 4.17 40-kHz RC Oscillator ................................ 17 1.3 Description ............................................ 2 4.18 I/O and Reset 1.4 Functional Block Diagram ............................ 2 4.19 Temperature Sensor ................................ 17 4.20 Typical Characteristics .............................. 18 Revision History ......................................... 4 Terminal Configuration and Functions .............. 5 .......................................... 5 ....................................... 17 Detailed Description ................................... 21 3.1 Pin Diagram 5 5.1 Block Diagram....................................... 21 3.2 Pin Configuration ..................................... 6 5.2 Frequency Synthesizer .............................. 21 ............................................ Absolute Maximum Ratings .......................... Handling Ratings ..................................... 7 5.3 Receiver ............................................. 22 Specifications 4.1 4.2 4.3 4.4 7 5.4 Transmitter .......................................... 22 7 5.5 Radio Control and User Interface ................... 22 Recommended Operating Conditions (General Characteristics) ....................................... 7 Thermal Resistance Characteristics for RHB Package .............................................. 7 5.6 Enhanced Wake-On-Radio (eWOR) ................ 22 5.7 RX Sniff Mode ....................................... 23 5.8 Antenna Diversity 5.9 WaveMatch .......................................... 24 4.5 RF Characteristics .................................... 8 4.6 ................................ 8 Current Consumption, Static Modes ................. 9 Current Consumption, Transmit Modes .............. 9 Current Consumption, Receive Modes.............. 10 Receive Parameters................................. 11 Transmit Parameters ................................ 14 PLL Parameters ..................................... 15 Wake-up and Timing ................................ 16 40-MHz Crystal Oscillator ........................... 16 4.7 4.8 4.9 4.10 4.11 4.12 4.13 4.14 Regulatory Standards 6 7 8 ................................... 23 Typical Application Circuit ........................... 25 Device and Documentation Support ............... 26 7.1 Device Support ...................................... 26 7.2 Documentation Support ............................. 27 7.3 Community Resources .............................. 27 7.4 Trademarks.......................................... 27 7.5 Electrostatic Discharge Caution ..................... 27 7.6 Glossary ............................................. 27 Mechanical Packaging and Orderable Information .............................................. 28 Table of Contents Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 3 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 www.ti.com 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. This data manual revision history highlights the changes made to the SWRS154A device-specific data manual to make it an SWRS154B revision. Changes from Revision A (June 2014) to Revision B • • 4 Page Added Ambient to the temperature range condition and removed Tj from Temperature range ........................... 7 Added data to TCXO table ......................................................................................................... 16 Revision History Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 3 Terminal Configuration and Functions 3.1 Pin Diagram Figure 3-1 shows pin names and locations for the CC1201 device. Figure 3-1. Package 5-mm × 5-mm QFN Terminal Configuration and Functions Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 5 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 3.2 www.ti.com Pin Configuration The following table lists the pin-out configuration for the CC1201 device. PIN NO. PIN NAME TYPE / DIRECTION DESCRIPTION 1 VDD_GUARD Power 2.0–3.6 V VDD 2 RESET_N Digital input Asynchronous, active-low digital reset 3 GPIO3 Digital I/O General-purpose I/O 4 GPIO2 Digital I/O General-purpose I/O 5 DVDD Power 2.0–3.6 VDD to internal digital regulator 6 DCPL Power Digital regulator output to external decoupling capacitor 7 SI Digital input Serial data in 8 SCLK Digital input Serial data clock 9 SO(GPIO1) Digital I/O Serial data out (general-purpose I/O) 10 GPIO0 Digital I/O General-purpose I/O 11 CSn Digital input Active-low chip select 12 DVDD Power 2.0–3.6 V VDD 13 AVDD_IF Power 2.0–3.6 V VDD 14 RBIAS Analog External high-precision resistor 15 AVDD_RF Power 2.0–3.6 V VDD 16 N.C. 17 PA Analog Single-ended TX output (requires DC path to VDD) 18 TRX_SW Analog TX and RX switch. Connected internally to GND in TX and floating (highimpedance) in RX. 19 LNA_P Analog Differential RX input (requires DC path to ground) 20 LNA_N Analog Differential RX input (requires DC path to ground) 21 DCPL_VCO Power Pin for external decoupling of VCO supply regulator 22 AVDD_SYNTH1 Power 2.0–3.6 V VDD 23 LPF0 Analog External loopfilter components 24 LPF1 Analog External loopfilter components 25 AVDD_PFD_CHP Power 2.0–3.6 V VDD 26 DCPL_PFD_CHP Power Pin for external decoupling of PFD and CHP regulator 27 AVDD_SYNTH2 Power 2.0–3.6 V VDD 28 AVDD_XOSC Power 2.0–3.6 V VDD 29 DCPL_XOSC Power Pin for external decoupling of XOSC supply regulator 30 XOSC_Q1 Analog Crystal oscillator pin 1 (must be grounded if a TCXO or other external clock connected to EXT_XOSC is used) 31 XOSC_Q2 Analog Crystal oscillator pin 2 (must be left floating if a TCXO or other external clock connected to EXT_XOSC is used) 32 EXT_XOSC Digital input Pin for external clock input (must be grounded if a regular crystal connected to XOSC_Q1 and XOSC_Q2 is used) – GND Ground pad The ground pad must be connected to a solid ground plane. 6 Not connected Terminal Configuration and Functions Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 4 Specifications All measurements performed on CC1200EM_868_930 rev.1.0.0, CC1200EM_420_470 rev.1.0.1, or CC1200EM_169 rev.1.2. Absolute Maximum Ratings (1) (2) 4.1 over operating free-air temperature range (unless otherwise noted) PARAMETER MIN Supply voltage (VDD, AVDD_x) –0.3 MAX Input RF level UNIT 3.9 V +10 dBm Voltage on any digital pin –0.3 VDD+0.3 V Voltage on any analog Pin (including DCPL pins) –0.3 2.0 V (1) (2) All supply pins must have the same voltage max 3.9 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to VSS, unless otherwise noted. 4.2 Handling Ratings Tstg Storage temperature range Electrostatic discharge (ESD) performance: VESD (1) (2) CONDITION Human body model (HBM), per ANSI/ESDA/JEDEC JS001 Charged device model (CDM), per JESD22C101 (2) (1) All pins MIN MAX UNIT –40 125 °C –2 2 kV –500 500 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V HBM allows safe manufacturing with a standard ESD control process. 4.3 Recommended Operating Conditions (General Characteristics) PARAMETER MIN MAX UNIT Voltage supply range 2.0 3.6 V 0 VDD V –40 85 °C Voltage on digital inputs Temperature range 4.4 TYP CONDITION All supply pins must have the same voltage Ambient Thermal Resistance Characteristics for RHB Package °C/W (1) AIR FLOW (m/s) (2) RθJC Junction-to-case (top) 21.1 0.00 RθJB Junction-to-board 5.3 0.00 RθJA Junction-to-free air 31.3 0.00 PsiJT Junction-to-package top 0.2 0.00 PsiJB Junction-to-board 5.3 0.00 RθJC Junction-to-case (bottom) 0.8 0.00 (1) (2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 40 mW and an ambient temperature of 25ºC is assumed. m/s = meters per second Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 7 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 4.5 www.ti.com RF Characteristics PARAMETER Frequency bands MIN MAX UNIT 820 TYP 950 MHz 410 475 MHz 164 190 MHz (274) (316.6) MHz (205) (237.5) MHz (158.3) MHz (137) Frequency resolution Data rate 4.6 Contact TI for more information about the use of these frequency bands. 30 Hz In 820–950 MHz band 15 Hz In 410–475 MHz band 6 Hz In 164–190 MHz band 0 1250 kbps Packet mode 0 625 kbps Transparent mode Regulatory Standards PERFORMANCE MODE High-performance mode FREQUENCY BAND SUITABLE FOR COMPLIANCE WITH COMMENTS Performance also suitable for systems targeting maximum allowed output power in the respective bands, using a range extender such as the CC1190 820–950 MHz ARIB STD-T108 ETSI EN 300 220 receiver categories 2 and 3 FCC PART 15.247 FCC PART 15.249 410–475 MHz Performance also suitable for systems targeting maximum ETSI EN 300 220 receiver categories allowed output power in the 2 and 3 respective bands, using a range extender 164–190 MHz ETSI EN 300 220 Performance also suitable for systems targeting maximum allowed output power in the respective bands, using a range extender 820–950 MHz ETSI EN 300 220 receiver categories 2 and 3 FCC PART 15.247 FCC PART 15.249 410–475 MHz ETSI EN 300 220 receiver categories 2 and 3 164–190 MHz ETSI EN 300 220 Low-power mode 8 CONDITION Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com 4.7 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 Current Consumption, Static Modes TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER MIN Power down with retention TYP MAX UNIT 0.12 1 µA CONDITION 0.5 µA Low-power RC oscillator running XOFF mode 180 µA Crystal oscillator / TCXO disabled IDLE mode 1.5 mA Clock running, system waiting with no radio activity 4.8 4.8.1 Current Consumption, Transmit Modes 868-, 915-, and 920-MHz Bands (High-Performance Mode) TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER MIN TYP MAX UNIT TX current consumption +14 dBm 46 mA TX current consumption +10 dBm 36 mA 4.8.2 CONDITION 433-MHz Band (High-Performance Mode) TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER MIN TYP MAX UNIT TX current consumption +15 dBm 49 mA TX current consumption +14 dBm 46 mA TX current consumption +10 dBm 35 mA CONDITION Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 9 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 4.8.3 www.ti.com 169-MHz Band (High Performance Mode) TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER MIN TYP MAX UNIT TX current consumption +15 dBm 54 mA TX current consumption +14 dBm 50 mA TX current consumption +10 dBm 39 mA 4.8.4 CONDITION Low-Power Mode TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz (unless otherwise noted) PARAMETER MIN TX Current Consumption +10 dBm 4.9 TYP MAX 33.6 UNIT CONDITION mA Current Consumption, Receive Modes 4.9.1 High-Performance Mode TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz (unless otherwise noted) PARAMETER MIN TYP MAX UNIT RX wait for sync 1.2 kbps, 4-byte preamble 0.5 mA 38.4 kbps, 12-byte preamble 3.5 mA 50 kbps, 24-byte preamble 2.1 mA 23.6 mA 8 µA RX peak current 1.2 kbps Average current consumption Check for data packet every 1 second using eWOR (1) CONDITION Using RX Sniff Mode, where the receiver wakes up at regular intervals looking for an incoming packet. Sniff mode configured to terminate on carrier sense, and is measured using RSSI_VALID _COUNT = 1 (0 for 1.2 kbps), AGC_WIN_SIZE = 0, and SETTLE_WAIT = 1. (1) Peak current consumption during packet reception 50 kbps, 5-byte preamble, 40-kHz RC oscillator used as eWOR timer See the sniff mode design note for more information (SWRA428) 4.9.2 Low-Power Mode TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz (unless otherwise noted) PARAMETER MIN TYP MAX UNIT RX Peak current low-power RX mode 50 kbps 10 19 mA Specifications CONDITION Peak current consumption during packet reception at the sensitivity limit Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 4.10 Receive Parameters All RX measurements made at the antenna connector, to a bit error rate (BER) limit of 1%. Selectivity and blocking is measured with the desired signal 3 dB above the sensitivity level. 4.10.1 General Receive Parameters (High-Performance Mode) TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz (unless otherwise noted) PARAMETER MIN Saturation Digital channel filter programmable bandwidth TYP MAX +10 50 IIP3 UNIT CONDITION dBm 1600 kHz –14 dBm ±14 % With carrier sense detection enabled ±1600 ppm With carrier sense detection disabled 1–13 GHz (VCO leakage at 3.5 GHz) < –56 dBm Radiated emissions measured according to ETSI EN 300 220, fc = 869.5 MHz 30 MHz to 1 GHz < –57 dBm Data rate offset tolerance At maximum gain Spurious emissions Optimum source impedance 868-, 915-, and 920-MHz bands 60 + j60 / 30 + j30 Ω 433-MHz band 100 + j60 / 50 + j30 Ω 169-MHz band 140 + j40 / 70 + j20 Ω (Differential or Single-Ended RX Configurations) Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 11 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 www.ti.com 4.10.2 RX Performance in 868-, 915-, and 920-MHz Bands (High-Performance Mode) TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER Sensitivity Blocking and selectivity 1.2-kbps 2-FSK, 50-kHz channel separation, 20-kHz deviation, 50-kHz channel filter Blocking and selectivity 32.768-kbps 2-GFSK, 200-kHz channel separation, 50-kHz deviation, 208-kHz channel filter Blocking and selectivity 38.4-kbps 2-GFSK, 100-kHz channel separation, 20-kHz deviation, 104-kHz channel filter Blocking and selectivity 50-kbps 2-GFSK, 200-kHz channel separation, 25-kHz deviation, 104-kHz channel filter (Same modulation format as 802.15.4g Mandatory Mode) Blocking and selectivity 100-kbps 2-GFSK, 50-kHz deviation, 208-kHz channel filter Blocking and selectivity 500-kbps GMSK, 833-kHz channel filter Blocking and selectivity 1-Mbps 4-GFSK, 400-kHz deviation, 1.6-MHz channel filter (1) 12 MIN UNIT CONDITION –119 TYP MAX dBm 1.2 kbps 2-FSK, DEV=20 kHz CHF=50 kHz (1) –113 dBm 4.8 kbps OOK CHF=128 kHz (1) –108 dBm 32.768 kbps 2-GFSK, DEV=50 kHz CHF=208 kHz (1) –110 dBm 38.4 kbps 2-GFSK, DEV=20 kHz CHF=104 kHz (1) –109 dBm 50 kbps 2-GFSK, DEV=25 kHz, CHF=104 kHz (1) –97 dBm 500 kbps 2-GMSK, CHF=833 kHz (1) –97 dBm 1 Mbps 4-GFSK, DEV=400 kHz, CHF=1.66 MHz (1) 50 dB ± 50 kHz (adjacent channel) 50 dB ± 100 kHz (alternate channel) 75 dB ± 2 MHz 80 dB ± 10 MHz 38 dB ± 200 kHz 46 dB ± 400 kHz 66 dB ± 2 MHz 70 dB ± 10 MHz 44 dB + 100 kHz (adjacent channel) 44 dB ± 200 kHz (alternate channel) 64 dB ± 2 MHz 72 dB ± 10 MHz 41 dB ± 200 kHz (adjacent channel) 46 dB ± 400 kHz (alternate channel) 65 dB ± 2 MHz 71 dB ± 10 MHz 45 dB ± 400 kHz (adjacent channel) 54 dB ± 800 kHz (alternate channel) 63 dB ± 2 MHz 68 dB ± 10 MHz 42 dB + 1 MHz (adjacent channel) 42 dB ± 2 MHz (alternate channel) 57 dB ± 10 MHz 46 dB ± 2 MHz (adjacent channel) 52 dB ± 4 MHz (alternate channel) 59 dB ± 10 MHz DEV is short for deviation, CHF is short for Channel Filter Bandwidth Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 4.10.3 RX Performance in 433-MHz Band (High-Performance Mode) TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER MIN Sensitivity Blocking and selectivity 1.2-kbps 2-FSK, 50-kHz channel separation, 20-kHz deviation, 50-kHz channel filter Blocking and selectivity 38.4-kbps 2-GFSK, 100-kHz channel separation, 20-kHz deviation, 104-kHz channel filter (1) TYP MAX UNIT CONDITION –120 dBm 1.2 kbps 2-FSK, DEV=20 kHz CHF=50 kHz (1) –111 dBm 38.4 kbps 2-GFSK, DEV=20 kHz CHF=104 kHz (1) 56 dB ± 50 kHz (adjacent channel) 56 dB ± 100 kHz (alternate channel) 79 dB ± 2 MHz 84 dB ± 10 MHz 49 dB + 100 kHz (adjacent channel) 48 dB ± 200 kHz (alternate channel) 66 dB ± 2 MHz 74 dB ± 10 MHz DEV is short for deviation, CHF is short for Channel Filter Bandwidth 4.10.4 RX Performance in 169-MHz Band (High-Performance Mode) TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER MIN Sensitivity Blocking and Selectivity 1.2 kbps 2-FSK, 50 kHz channel separation, 20 kHz deviation, 50 kHz channel filter Image rejection (Image compensation enabled) (1) UNIT CONDITION –119 TYP MAX dBm 1.2 kbps 2-FSK, DEV=20 kHz CHF=50 kHz (1) 62 dB ± 50 kHz (adjacent channel) 62 dB ± 100 kHz (alternate channel) 81 dB ± 2 MHz 85 dB ± 10 MHz 67 dB 1.2 kbps, DEV=20 kHz, CHF=50 kHz, image at –417 kHz (1) DEV is short for deviation, CHF is short for Channel Filter Bandwidth 4.10.5 RX Performance in Low-Power Mode TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz (unless otherwise noted) PARAMETER UNIT CONDITION Sensitivity –96 dBm 50 kbps 2-GFSK, DEV=25 kHz, CHF=119 kHz (1) Blocking and selectivity 50 kbps 2-GFSK, 200-kHz channel separation, 25-kHz deviation, 104-kHz channel filter (Same modulation format as 802.15.4g Mandatory Mode) 41 dB + 200 kHz (adjacent channel) 45 dB + 400 kHz (alternate channel) 62 dB ± 2 MHz 60 dB ± 10 MHz Saturation 10 dBm (1) MIN TYP MAX DEV is short for deviation, CHF is short for Channel Filter Bandwidth Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 13 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 www.ti.com 4.11 Transmit Parameters TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz (unless otherwise noted) PARAMETER Max output power Min output power MIN TYP UNIT CONDITION +14 MAX dBm At 915/920 MHz +15 dBm At 915/920 MHz with VDD = 3.6 V +15 dBm At 868 MHz +16 dBm At 868 MHz with VDD = 3.6 V +15 dBm At 433 MHz +16 dBm At 433 MHz with VDD = 3.6 V +15 dBm At 169 MHz +16 dBm At 169 MHz with VDD = 3.6 V –12 dBm Within fine step size range Within coarse step size range –38 dBm Output power step size 0.4 dB Within fine step size range Adjacent channel power –60 dBc 4-GFSK 9.6 kbps in 12.5 kHz channel, measured in 8.75 kHz bandwidth (ETSI 300 220 compliant) Spurious emissions (Excluding harmonics) 30 MHz–1 GHz < –57 dBm 1–12.75 GHz < –50 dBm Second Harm, 169 MHz (ETSI) –43 dBm Third Harm, 169 MHz (ETSI) –57 dBm Fourth Harm, 169 MHz (ETSI) –63 dBm Second Harm, 433 MHz (ETSI) –59 dBm Third Harm, 433 MHz (ETSI) –51 dBm Fourth Harm, 433 MHz (ETSI) –63 dBm Second Harm, 868 MHz (ETSI) –50 dBm Third Harm, 868 MHz (ETSI) –44 dBm Fourth Harm, 868 MHz (ETSI) –56 dBm Second Harm, 915 MHz (FCC) –58 dBm Third Harm, 915 MHz (FCC) –46 dBm Fourth Harm, 915 MHz (FCC) –62 dBm Second Harm, 920 MHz (ARIB) –65 dBm Third Harm, 920 MHz (ARIB) –60 dBm Transmission at +14 dBm Suitable for systems targeting compliance with ETSI EN 300-220, FCC part 15, ARIB STD-T108 Measured in 1 MHz bandwidth Harmonics Transmission at +14 dBm (or maximum allowed in applicable band where this is less than +14 dBm) using TI reference design Suitable for systems targeting compliance with ETSI EN 300-220, FCC part 15, ARIB STD-T108 Optimum load impedance 868-, 915-, and 920-MHz bands 35 + j35 Ω 433-MHz band 55 + j25 Ω 169-MHz band 80 + j0 Ω 14 Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 4.12 PLL Parameters 4.12.1 High Performance Mode TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER MIN Phase noise in 868-, 915-, and 920-MHz Bands 200-kHz loop bandwidth setting Phase noise in 868-, 915-, and 920-MHz Bands 300-kHz loop bandwidth setting Phase noise in 868-, 915-, and 920-MHz Bands 400-kHz loop bandwidth setting Phase noise in 868-, 915-, and 920-MHz Bands 500-kHz loop bandwidth setting Phase noise in 433-MHz band 300-kHz loop bandwidth setting Phase noise in 169-MHz band 300-kHz loop bandwidth setting TYP MAX UNIT CONDITION –94 dBc/Hz ± 10 kHz offset –96 dBc/Hz ± 100 kHz offset –123 dBc/Hz ± 1 MHz offset –137 dBc/Hz ± 10 MHz offset –100 dBc/Hz ± 10 kHz offset –102 dBc/Hz ± 100 kHz offset –121 dBc/Hz ± 1 MHz offset –136 dBc/Hz ± 10 MHz offset –103 dBc/Hz ± 10 kHz offset –104 dBc/Hz ± 100 kHz offset –119 dBc/Hz ± 1 MHz offset –133 dBc/Hz ± 10 MHz offset –104 dBc/Hz ± 10 kHz offset –106 dBc/Hz ± 100 kHz offset –116 dBc/Hz ± 1 MHz offset –130 dBc/Hz ± 10 MHz offset –106 dBc/Hz ± 10 kHz offset –107 dBc/Hz ± 100 kHz offset –127 dBc/Hz ± 1 MHz offset –141 dBc/Hz ± 10 MHz offset –114 dBc/Hz ± 10 kHz offset –114 dBc/Hz ± 100 kHz offset –132 dBc/Hz ± 1 MHz offset –142 dBc/Hz ± 10 MHz offset UNIT CONDITION 4.12.2 Low-Power Mode PARAMETER MIN Phase noise in 868-, 915-, and 920-MHz bands 200-kHz loop bandwidth setting TYP MAX –99 dBc/Hz ± 10 kHz offset –101 dBc/Hz ± 100 kHz offset –121 dBc/Hz ± 1 MHz offset –135 dBc/Hz ± 10 MHz offset Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 15 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 www.ti.com 4.13 Wake-up and Timing TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz (unless otherwise noted) The turnaround behavior to and from RX and/or TX is highly configurable, and the time it takes will depend on how the device is set up. See the CC120X user guide (SWRU346) for more information. PARAMETER MIN Powerdown to IDLE IDLE to RX/TX TYP TX-to-TX turnaround UNIT CONDITION 0.24 ms Depends on crystal 133 µs Calibration disabled 369 µs Calibration enabled 43 µs 369 µs With PLL calibration 0 µs Without PLL calibration 369 µs With PLL calibration RX/TX turnaround RX-to-RX turnaround MAX 0 µs Without PLL calibration 237 µs Calibrate when leaving RX/TX enabled 0 µs Calibrate when leaving RX/TX disabled Frequency synthesizer calibration 314 µs When using SCAL strobe Minimum required number of preamble bytes 0.5 bytes Time from start RX until valid RSSI (1) Including gain settling (function of channel bandwidth. Programmable for trade-off between speed and accuracy) 0.25 ms RX/TX to IDLE time (1) Required for RF front end gain settling only. Digital demodulation does not require preamble for settling 120-kHz channels See the design note on RSSI and response time. It is written for the CC112X devices, but the same principles apply for the CC1201 device. 4.14 40-MHz Crystal Oscillator TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER Crystal frequency MIN TYP 38.4 MAX 40 Load capacitance (CL) 10 ESR CONDITION MHz It is expected that there will be degraded sensitivity at multiples of XOSC/2 in RX, and an increase in spurious emissions when the RF channel is close to multiples of XOSC in TX. We recommend that the RF channel is kept RX_BW/2 away from XOSC/2 in RX, and that the level of spurious emissions be evaluated if the RF channel is closer than 1 MHz to multiples of XOSC in TX. pF 60 Start-up time UNIT 0.24 Ω Simulated over operating conditions ms Depends on crystal 4.15 40-MHz Clock Input (TCXO) TA = 25°C, VDD = 3.0 V if nothing else stated PARAMETER MIN Clock frequency TYP MAX UNIT 38.4 40 MHz High input voltage 1.4 VDD V Low input voltage 0 0.6 V 2 ns 1.5 V TCXO with CMOS output Rise / Fall time Clipped sine output Clock input amplitude (peak-to-peak) 16 0.8 Specifications CONDITION TCXO with CMOS output directly coupled to pin EXT_OSC TCXO clipped sine output connected to pin EXT_OSC through series capacitor Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 4.16 32-kHz Clock Input TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER MIN TYP Clock frequency 32-kHz clock input pin input high voltage MAX UNIT 32 CONDITION kHz 0.8 x VDD V 32-kHz clock input pin input low voltage 0.2 x VDD V 4.17 40-kHz RC Oscillator TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER MIN TYP MAX UNIT CONDITION 40 kHz After calibration (frequency calibrated against the 40-MHz crystal or TCXO) Frequency accuracy after calibration ±0.1 % Relative to frequency reference (that is, 40-MHz crystal or TCXO) Initial calibration time 1.32 ms Frequency 4.18 I/O and Reset TA = 25°C, VDD = 3.0 V (unless otherwise noted) PARAMETER MIN Logic input high voltage 0.8 x VDD TYP 0.2 x VDD 0.8 x VDD CONDITION V V 0.2 x VDD Logic output low voltage Power-on reset threshold UNIT V Logic input low voltage Logic output high voltage MAX 1.3 At 4-mA output load or less V V Voltage on DVDD pin 4.19 Temperature Sensor TA = 25°C, VDD = 3.0 V (unless otherwise noted). PARAMETER MIN Temperature sensor range –40 TYP MAX UNIT 85 °C CONDITION Temperature coefficient 2.66 mV / °C Change in sensor output voltage versus change in temperature Typical output voltage 794 mV Typical sensor output voltage at TA = 25°C, VDD = 3.0 V VDD coefficient 1.17 mV / V Change in sensor output voltage versus change in VDD The CC1201 device can be configured to provide a voltage proportional to temperature on GPIO1. The temperature can be estimated by measuring this voltage (see Section 4.19, Temperature Sensor). For more information, see the temperature sensor design note (SWRA415). Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 17 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 www.ti.com 4.20 Typical Characteristics TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz (unless otherwise noted) 80 Selectivity (dB) RSSI 60 40 20 0 -20 -40 -110 -90 -70 -50 -30 -10 80 70 60 50 40 30 20 10 0 -10 -20 -2 -1 0 Input Level (dBm) 1 2 Offset Frequency (MHz) 50-kbps GFSK, 25-kHz Deviation, 104-kHz Channel Filter Bandwidth 50 kbps, 25-kHz Deviation, 104-kHz Channel Filter Bandwidth Image Figure 4-1. RSSI vs Input Level Frequency at –0.28-MHz Offset Figure 4-2. Selectivity vs Offset Frequency (100-kHz Channels) 16 16 Output Power (dBm) Output Power (dBm) 15 14 13 12 11 15 14 13 12 10 2 2.5 3 -40 3.5 0 Maximum Output Power Setting (0x7F) Figure 4-4. Output Power vs Temperature Maximum Output Power Setting (0x7F) Figure 4-3. Output Power vs Supply Voltage 20 60 10 50 TX Current (mA) Output Power (dBm) 80 Temperature (ºC) Supply Voltage (V) 0 -10 -20 -30 40 30 20 -40 10 -50 0 PA power setting PA power setting Figure 4-5. Output Power at 868 MHz vs PA Power Setting 18 40 Specifications Figure 4-6. TX Current at 868 MHz vs PA Power Setting Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 Typical Characteristics (continued) 3.1 1.4 2.9 1.2 2.7 1 2.5 0.8 Output High Voltage Output Low Voltage 2.3 0.6 2.1 0.4 1.9 0.2 1.7 GPIO Output Low Voltage (V) 1 Mbps 4-GFSK, 400-kHz Deviation 300-kHz Loop Bandwidth Figure 4-8. Eye Diagram GPIO Output high Voltage (V) 1 Mbps 4-GFSK, 400-kHz Deviation 500-kHz Loop Bandwidth Figure 4-7. Eye Diagram 0 1.5 0 5 10 15 20 25 30 Current (mA) 1 kbps GFSK, 25-kHz Deviation 200-kHz Loop Bandwidth Figure 4-9. Eye Diagram Figure 4-10. GPIO Output High and Low Voltage vs Current Being Sourced and Sinked 200-kHz Loop Bandwidth Figure 4-11. Phase Noise 869.5 MHz (10-kHz to 100-MHz Offset) 300-kHz Loop Bandwidth Figure 4-12. Phase Noise 869.5 MHz (10-kHz to 100-MHz Offset) Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 19 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 www.ti.com Typical Characteristics (continued) 400-kHz Loop Bandwidth Figure 4-13. Phase Noise 869.5 MHz (10-kHz to 100-MHz Offset) 20 500-kHz Loop Bandwidth Figure 4-14. Phase Noise 869.5 MHz (10-kHz to 100-MHz Offset) Specifications Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 5 Detailed Description 5.1 Block Diagram Figure 5-1 shows the system block diagram of the CC120x family of devices. CC120x 4 kbyte ROM MARC Main Radio Control unit LNA_N ADC 256 byte FIFO RAM buffer FREQ SYNTH 0 90 RF and DSP frontend PA out PA Output power ramping and OOK / ASK modulation I +16 dBm high efficiency PA Fully integrated fractional-N frequency synthesizer XOSC BIAS IF amp LNA_N LFC1 LFC0 SCLK (serial clock) SCLK SO (GPIO0) SI (optional GPIO3/2/0) CS_N GPIO1 GPIO2 GPIO3 (optional auto detected external XOSC / TCXO) XOSC XOSC_Q2 90 dB dynamic range ADC High linearity LNA SO (serial output) XOSC_Q1 Data interface with signal chain access (optional bit clock) Channel filter IF amp EXT_XOSC XOSC_Q1 LNA_P XOSC_Q2 RBIAS Q Packet handler and FIFO control 90 dB dynamic range ADC Cordic Configuration and status registers Battery sensor / temp sensor Interrupt and IO handler DIGITAL INTERFACE TO MCU LNA TXFIFO ADC RXFIFO SI (serial input) DEMODULATOR System bus LNA_P PA CSn (chip select) MCU AES-128 accelerator eWOR Enhanced ultra low power Wake On Radio timer SPI Serial configuration Ultra low power 16 bit RADIO CONTROL & POWER MANAGEMENT and data interface PACKET HANDLER Power on reset Modulator Ultra low power 40 kHz auto-calibrated RC oscillator MODULATOR (optional 40 kHz clock input) Highly flexible FSK / OOK demodulator (optional low jitter serial data output for legacy protocols) AGC Automatic Gain Control, 60dB VGA range RSSI measurements and carrier sense detection (optional GPIO for antenna diversity) Figure 5-1. System Block Diagram 5.2 Frequency Synthesizer At the center of the CC1201 device there is a fully integrated, fractional-N, ultra-high-performance frequency synthesizer. The frequency synthesizer is designed for excellent phase noise performance, providing very high selectivity and blocking performance. The system is designed to comply with the most stringent regulatory spectral masks at maximum transmit power. Either a crystal can be connected to XOSC_Q1 and XOSC_Q2, or a TCXO can be connected to the EXT_XOSC input. The oscillator generates the reference frequency for the synthesizer, as well as clocks for the analog-to-digital converter (ADC) and the digital part. To reduce system cost, the CC1201 device has high-accuracy frequency estimation and compensation registers to measure and compensate for crystal inaccuracies. This compensation enables the use of lower cost crystals. If a TCXO is used, the CC1201 device automatically turns on and off the TCXO when needed to support low-power modes and Wake-On-Radio operation. Detailed Description Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 21 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 5.3 www.ti.com Receiver The CC1201 device features a highly flexible receiver. The received RF signal is amplified by the lownoise amplifier (LNA) and is down-converted in quadrature (I/Q) to the intermediate frequency (IF). At IF, the I/Q signals are digitized by the high dynamic-range ADCs. An advanced automatic gain control (AGC) unit adjusts the front-end gain, and enables the CC1201 device to receive strong and weak signals, even in the presence of strong interferers. High-attenuation channel and data filtering enable reception with strong neighbor channel interferers. The I/Q signal is converted to a phase and magnitude signal to support the FSK and OOK modulation schemes. NOTE A unique I/Q compensation algorithm removes any problem of I/Q mismatch, thus avoiding time-consuming and costly I/Q image calibration steps. 5.4 Transmitter The CC1201 transmitter is based on direct synthesis of the RF frequency (in-loop modulation). To use the spectrum effectively, the CC1201 device has extensive data filtering and shaping in TX mode to support high throughput data communication in narrowband channels. The modulator also controls power ramping to remove issues such as spectral splattering when driving external high-power RF amplifiers. 5.5 Radio Control and User Interface The CC1201 digital control system is built around the main radio control (MARC), which is implemented using an internal high-performance, 16-bit ultra-low-power processor. MARC handles power modes, radio sequencing, and protocol timing. A 4-wire SPI serial interface is used for configuration, strobe commands, and FIFO access. The digital baseband includes support for channel configuration, packet handling, and data buffering. The host MCU can stay in sleep mode until a valid RF packet is received. This greatly reduces power consumption. When the host MCU receives a valid RF packet, it burst-reads the data. This reduces the required computing power. The CC1201 radio control and user interface are based on the widely used CC1101 transceiver. This relationship enables an easy transition between the two platforms. The command strobes and the main radio states are the same for the two platforms. For legacy formats, the CC1201 device also supports two serial modes. • Synchronous serial mode: The CC1201 device performs bit synchronization and provides the MCU with a bit clock with associated data. • Transparent mode: The CC1201 device outputs the digital baseband signal using a digital interpolation filter to eliminate jitter introduced by digital filtering and demodulation. 5.6 Enhanced Wake-On-Radio (eWOR) eWOR, using a flexible integrated sleep timer, enables automatic receiver polling with no intervention from the MCU. When the CC1201 device enters RX mode, it listens and then returns to sleep if a valid RF packet is not received. The sleep interval and duty cycle can be configured to make a trade-off between network latency and power consumption. Incoming messages are time-stamped to simplify timer resynchronization. The eWOR timer runs off an ultra-low-power RC oscillator. To improve timing accuracy, the RC oscillator can be automatically calibrated to the RF crystal in configurable intervals. 22 Detailed Description Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com 5.7 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 RX Sniff Mode The CC1201 device supports quick start up times, and requires few preamble bits. RX Sniff Mode uses these conditions to dramatically reduce the current consumption while the receiver is waiting for data. Because the CC1201 device can wake up and settle much faster than the duration of most preambles, it is not required to be in RX mode continuously while waiting for a packet to arrive. Instead, the Enhanced Wake On Radio feature can be used to put the device into sleep mode periodically. By setting an appropriate sleep time, the CC1201 device can wake up and receive the packet when it arrives with no performance loss. This sequence removes the need for accurate timing synchronization between transmitter and receiver, and lets the user trade off current consumption between the transmitter and receiver. For more information, see the sniff mode design note (SWRA428). 5.8 Antenna Diversity Antenna diversity can increase performance in a multipath environment. An external antenna switch is required. The CC1201 device uses one of the GPIO pins to automatically control the switch. This device also supports differential output control signals typically used in RF switches. If antenna diversity is enabled, the GPIO alternates between high and low states until a valid RF input signal is detected. An optional acknowledge packet can be transmitted without changing the state of the GPIO. An incoming RF signal can be validated by received signal strength or by using the automatic preamble detector. Using the automatic preamble detector ensures a more robust system and avoids the need to set a defined signal strength threshold (such a threshold sets the sensitivity limit of the system). Detailed Description Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 23 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 5.9 www.ti.com WaveMatch Advanced capture logic locks onto the synchronization word and does not require preamble settling bytes. Therefore, receiver settling time is reduced to the settling time of the AGC, typically 4 bits. The WaveMatch feature also greatly reduces false sync triggering on noise, further reducing the power consumption and improving sensitivity and reliability. The same logic can also be used as a highperformance preamble detector to reliably detect a valid preamble in the channel. See swrc046 for more information. Figure 5-2. Receiver Configurator in SmartRF™ Studio 24 Detailed Description Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 6 Typical Application Circuit NOTE This section is intended only as an introduction. Very few external components are required for the operation of the CC1201 device. Figure 6-1 shows a typical application circuit. The board layout will greatly influence the performance of the CC1201 device. Figure 6-1 does not show decoupling capacitors for power pins. Optional VDD 25 AVDD_PFD_CHP VDD VDD_GUARD DCPL_PFD_CHP 26 VDD AVDD_SYNTH2 27 2 RESET_N VDD LPF1 24 LPF0 23 3 GPIO3 AVDD_SYNTH1 22 4 GPIO2 DCPL_VCO 21 CC1201 5 DVDD VDD LNA_N 20 6 DCPL LNA_P 19 7 SI TRX_SW 18 16 N.C. VDD 15 AVDD_RF 13 AVDD_IF VDD 14 RBIAS 12 DVDD VDD CSn 11 10 GPIO0 PA 17 9 SO (GPIO1) 8 SCLK VDD 1 AVDD_XOSC 28 VDD DCPL_XOSC 29 (optional control pin from CC1200) XOSC_Q1 30 EXT_XOSC 32 XOSC/ TCXO XOSC_Q2 31 40 MHz crystal MCU connection SPI interface and optional gpio pins Figure 6-1. Typical Application Circuit For more information, see the reference designs available for the CC1201 device in Section 7.2, Documentation Support. Typical Application Circuit Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 25 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 www.ti.com 7 Device and Documentation Support 7.1 Device Support 7.1.1 Development Support 7.1.1.1 Configuration Software The CC1201 device can be configured using the SmartRF Studio software (SWRC046). The SmartRF Studio software is highly recommended for obtaining optimum register settings, and for evaluating performance and functionality. 7.1.2 Device and Development-Support Tool Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC1201). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully qualified development-support product. X and P devices and TMDX development-support tools are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes." Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RHB), the temperature range (for example, blank is the default commercial temperature range), and the device speed range, in megahertz. provides a legend for reading the complete device name for any CC1201 device. For orderable part numbers of CC1201 devices in the QFN package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative. 26 Device and Documentation Support Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 CC1201 www.ti.com 7.2 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 Documentation Support The following documents describe the CC1201 processor. Copies of these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com. 7.3 SWRR106 CC112x IPC 868- and 915-MHz 2-layer Reference Design SWRR107 CC112x IPC 868- and 915-MHz 4-layer Reference Design SWRR122 CC1201EM 420- to 470-MHz Reference Design SWRR121 CC1201EM 868- to 930-MHz Reference Design SWRC046 SmartRF Studio Software SWRA428 CC112x/CC120x Sniff Mode Application Note Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 7.4 Trademarks SmartRF, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 7.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Device and Documentation Support Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1201 27 CC1201 SWRS154B – OCTOBER 2013 – REVISED OCTOBER 2014 www.ti.com 8 Mechanical Packaging and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 28 Mechanical Packaging and Orderable Information Submit Documentation Feedback Product Folder Links: CC1201 Copyright © 2013–2014, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 29-Sep-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CC1201RHBR ACTIVE VQFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC1201 CC1201RHBT ACTIVE VQFN RHB 32 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC1201 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Sep-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CC1201RHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 CC1201RHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC1201RHBR VQFN RHB 32 3000 338.1 338.1 20.6 CC1201RHBT VQFN RHB 32 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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