AVAGO HLMP-AB71 High brightness material Datasheet

HLMP-AM70/AM71, HLMP-AB70/AB71
Green and Blue
5 mm Mini Oval LEDs
Data Sheet
Description
Features
The oval shaped radiation pattern and high luminous
intensity ensure that these devices are excellent for wide
field of view outdoor applications where a wide viewing
angle and readability in sunlight are essential. The
package epoxy contains both UV inhibitors to reduce the
effects of long term exposure to direct sunlight.
x Well defined spatial radiation pattern
Applications
x Superior resistance to moisture
x Mono color signs
x Standoff and non stand-off Package
Package Dimensions
x Typical viewing angle 30° x 70°
x High brightness material
x Available in green and blue color.
x Green InGaN 525nm
x Blue InGaN 470nm
x Tinted and diffused
A: No Standoff
0.8 max.
0.032
8.70 ±0.20
0.342 ±0.008
0.70 max.
0.028
3.80 ±0.200
0.150 ±0.008
0.50 ±0.10 sq. typ.
0.020 ±0.004
5.20 ±0.200
0.205 ±0.008
cathode lead
24.00 min.
0.945
1.00 min.
0.038
2.54 ±0.3
0.100 ±0.012
B: Standoff
d
1.50 ±0.15
0.0591 ±0.006
0.70 max.
0.028
0.50 ±0.10 sq. typ.
0.020 ±0.004
3.80 ±0.200
0.150 ±0.008
5.20 ±0.20
0.205 ±0.008
cathode lead
8.70 ±0.20
0.342 ±0.008
0.8 max.
0.032
24.00 min.
0.945
1.00 min.
0.038
2.54 ±0.3
0.100 ±0.012
Notes:
1. All dimensions in millimeters (inches).
2. Dimension d = 11.59 mm.
3. Tolerance is ± 0.20 mm unless otherwise specified.
CAUTION: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Luminous Intensity Iv (mcd) at 20
mA [1,2,4]
Part Number
Color and Dominant
Wavelength Od (nm)
Typ [3]
Min.
Max.
Stand-off
Package Drawing
HLMP-AB70-TWBDD
Blue 470
800
1660
No
A
HLMP-AB70-TWCDD
Blue 470
800
1660
No
A
HLMP-AB71-TWBDD
Blue 470
800
1660
Yes
B
HLMP-AB71-TWCDD
Blue 470
800
1660
Yes
B
HLMP-AM70-24BDD
Green 525
3500
6050
No
A
HLMP-AM70-24CDD
Green 525
3500
6050
No
A
HLMP-AM71-24BDD
Green 525
3500
6050
Yes
B
HLMP-AM71-24CDD
Green 525
3500
6050
Yes
B
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. Tolerance for each bin limit is ± 15%
Part Numbering System
HLMP – A x xx – x x x xx
Packaging Option
DD: Ammopack
Color Bin Selection
B : Color bin 2 and 3
C : Color bin 3 and 4
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Standoff / Non Standoff
70 : Without Standoff
71 : With Standoff
Color
B : Blue
M : Green
Package
A : 5 mm Mini Oval 30° x 70°
Note:
Please refer to AB 5337 for complete information about part numbering system.
2
Absolute Maximum Ratings
TA = 25° C
Parameter
Blue and Green
Unit
DC Forward Current [1]
30
mA
Peak Forward Current
100 [2]
mA
Power Dissipation
110
mW
LED Junction Temperature
110
°C
Operating Temperature Range
-40 to +85
°C
Storage Temperature Range
-40 to +100
°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 10%, frequency 1 KHz.
Electrical / Optical Characteristics
TA = 25° C
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
Green & blue
VF
2.8
3.1
3.6
V
IF = 20 mA
Reverse Voltage [1]
Green & blue
VR
5
V
IR = 10 PA
nm
IF = 20 mA
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Dominant Wavelength [2]
Green
Blue
Peak Wavelength
Green
Blue
520
460
525
470
OPEAK
540
480
517
461
Thermal resistance
RTJ-PIN
Luminous Efficacy [3]
Green
Blue
Kv
240
475
68
°C/W
LED Junction-to pin
lm/W
Emitted Luminous Power/
Emitted Radiant Power
Notes:
1. Indicates product final testing condition, long term reverse bias is not recommended.
2. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
3. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / KV where Iv is the luminous intensity in candela and KV is
the luminous efficacy in lumens/ watt.
3
30
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
25
Blue
430
FORWARD CURRENT - mA
RELATIVE INTENSITY
InGaN Blue and Green
Green
480
530
WAVELENGTH - nm
580
1.2
30
IF max. - MAXIMUM FORWARD
CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
35
1
0.8
0.6
0.4
0.2
5
10
15
20
25
DC FORWARD CURRENT - mA
30
NORMALIZED INTENSITY
10
8
Green
4
Blue
2
0
-2
0
5
10
15
20
FORWARD CURRENT - mA
Figure 5. Relative dominant wavelength vs Forward Current
2
FORWARD VOLTAGE - V
3
4
20
15
10
5
0
20
40
60
80
TA - AMBIENT TEMPERATURE - °C
100
Figure 4. Maximum Forward Current vs Ambient Temperature
12
6
1
25
0
35
Figure 3. Relative Intensity vs Forward Current
RELATIVE DOMINANT WAVELENGTH - nm
5
1.4
0
4
10
Figure 2. Forward Current vs Forward Voltage
0
-4
15
0
630
Figure 1. Relative Intensity vs Wavelength
20
25
30
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
Figure 6. Radiation pattern-Minor Axis
90
RELATIVE LIGHT OUTPUT
(NORMALZIED @ TJ = 25° C)
NORMALIZED INTENSITY
10
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
90
Figure 7. Radiation pattern-Major Axis
BLUE
GREEN
0.2
0.1
0
-0.1
-0.2
-0.3
-40
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE
Figure 9. Forward Voltage Shift vs Junction Temperature
-40
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE
Figure 8. Relative Light Output vs Junction Temperature
0.3
FORWARD VOLTAGE SHIFT - V
1
0.1
-90
5
BLUE
GREEN
100
120
100
120
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Intensity (mcd) at 20 mA
Bin
Min
Max
T
800
960
U
960
1150
V
1150
1380
W
1380
1660
X
1660
1990
Y
1990
2400
Z
2400
2900
1
2900
3500
2
3500
4200
3
4200
5040
4
5040
6050
Tolerance for each bin limit is ± 15%
Green Color Bin Table
Bin
Min Dom
Max Dom
1
520.0
524.0
2
524.0
528.0
3
528.0
532.0
4
5
532.0
536.0
536.0
540.0
Xmin
Ymin
Xmax
Ymax
0.0743
0.8338
0.1856
0.6556
0.1650
0.6586
0.1060
0.8292
0.1060
0.8292
0.2068
0.6463
0.1856
0.6556
0.1387
0.8148
0.1387
0.8148
0.2273
0.6344
0.2068
0.6463
0.1702
0.7965
0.1702
0.7965
0.2469
0.6213
0.2273
0.6344
0.2003
0.7764
0.2003
0.7764
0.2659
0.6070
0.2469
0.6213
0.2296
0.7543
Tolerance for each bin limit is ± 0.5 nm
Blue Color Bin Table
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
0.1818
0.0904
0.1374
0.0374
2
464.0
468.0
3
468.0
472.0
4
472.0
476.0
5
476.0
480.0
0.1374
0.0374
0.1699
0.1062
0.1766
0.0966
0.1291
0.0495
0.1291
0.0495
0.1616
0.1209
0.1699
0.1062
0.1187
0.0671
0.1187
0.0671
0.1517
0.1423
0.1616
0.1209
0.1063
0.0945
0.1063
0.0945
0.1397
0.1728
0.1517
0.1423
0.0913
0.1327
Tolerance for each bin limit is ± 0.5 nm
Note:
1. All bin categories are established for classification of products. Products may not be available in
all bin categories. Please contact your Avago representative for further information.
6
Precautions:
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
x For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ AllnGaP high brightness LED are using high
efficiency LED die with single wire bond as shown below. Customer
is advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature does not exceed 260° C and
the solder contact time does not exceeding 5 sec. Over-stressing the
LED during soldering process might cause premature failure to the
LED due to delamination.
Avago Technologies LED configuration
Soldering and Handling:
x Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
x LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59 mm. Soldering
the LED using soldering iron tip closer than 1.59 mm
might damage the LED.
1.59mm
x ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105° C Max.
–
Preheat time
60 sec Max
–
Peak temperature
260° C Max.
260° C Max.
Dwell time
5 sec Max.
5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
x Wave soldering parameters must be set and maintained according to the recommended temperature
and dwell time. Customer is advised to perform daily
check on the soldering profile to ensure that it is always
conforming to recommended soldering conditions.
7
CATHODE
ANODE
AlInGaP Device
InGaN Device
x Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
x At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
x If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
x Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
x Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
260°C Max
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
105°C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammopack Drawing
6.35 ± 1.30
0.250 ± 0.051
12.70 ± 1.00
0.500 ± 0.039
CATHODE
20.5 ± 1.00
0.8070 ± 0.0394
18.00 ± 0.50
0.7085 ± 0.0195
9.125 ± 0.625
0.3595 ± 0.0245
12.70 ± 0.30
0.500 ± 0.012
4.00 ± 0.20 TYP.
0.1575 ± 0.0075
0.70 ± 0.20
0.276 ± 0.0075
VIEW A - A
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
8
Packaging Box for Ammopack
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 260C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
9
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 260C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
OR
(ii) Color bin incorporated with VF Bin
BIN: 2VB
VB: VF bin “VB”
(Applicable for part number that have both color bin
and VF bin)
2: Color bin 2 only
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make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
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Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-3682N - June 27, 2012