Material Content Data Sheet Sales Product Name BTS6143D Issued MA# MA000913726 Package PG-TO252-5-11 29. August 2013 Weight* 357.38 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material plastics noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus Polyimide silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 26023-21-2 7440-22-4 7440-31-5 7439-92-1 5.583 1.56 0.205 0.06 wire encapsulation leadfinish plating glue solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.56 15622 15622 572 0.061 0.02 204.243 57.14 57.22 571503 172 572247 2.038 0.57 0.57 5703 5703 1.365 0.38 3820 23.893 6.69 111.272 31.14 38.21 311357 66856 382033 5.072 1.42 1.42 14194 14194 0.076 0.02 213 0.000 0.00 0.02 1 214 0.143 0.04 0.04 399 399 0.086 0.02 0.069 0.02 3.272 0.92 240 192 0.96 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 9156 9588 1000000