CD74HCU04-Q1 www.ti.com SCHS381 – JUNE 2010 HIGH-SPEED CMOS LOGIC HEX INVERTER Check for Samples: CD74HCU04-Q1 FEATURES 1 • • • • • • Qualified for Automotive Applications Wide Operating Temperature Range: -40°C to 125°C Balanced Propagation Delay and Transition Times Significant Power Reduction Compared to LSTTL Logic ICs HCU Types – 2-V to 6-V Operation CMOS Input Compatibility: Il ≤ 1mA at VOL, VOH PW PACKAGE (TOP VIEW) 1A 1Y 2A 2Y 3A 3Y GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 6A 6Y 5A 5Y 4A 4Y DESCRIPTION The CD74HCU04 unbuffered hex inverter utilizes silicon-gate CMOS technology to achieve operation speeds similar to LSTTL gates, with the low power consumption of standard CMOS integrated circuits. These devices especially are useful in crystal oscillator and analog applications. ORDERING INFORMATION TA –40°C to 125°C PACKAGE TSSOP – PW Reel of 2000 ORDERABLE PART NUMBER CD74HCU04QPWRQ1 TOP-SIDE MARKING HJU04Q 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated CD74HCU04-Q1 SCHS381 – JUNE 2010 www.ti.com Functional Diagram 1 14 2 13 1A 1Y 3 12 2A 2Y 3A 3Y GND 4 11 5 10 6 9 7 8 VCC 6A 6Y 5A 5Y 4A 4Y Logic Symbol nA nY Schematic Diagram VCC (3, 5, 9, 11, 13) 1 2 2 (4, 6, 8, 10, 12) Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CD74HCU04-Q1 CD74HCU04-Q1 www.ti.com SCHS381 – JUNE 2010 ABSOLUTE MAXIMUM RATINGS (1) (2) VCC DC supply voltage IIK DC input diode current, VI < -0.5V or VI > VCC + 0.5V ±20mA IOK DC output diode current, VO < -0.5V or VO > VCC + 0.5V ±20mA IO DC drain current per output, VO > -0.5V or VO < VCC + 0.5V ±25mA ICC DC VCC or ground current qJA Thermal impedance, junction to free air (3) TJ Maximum junction temperature TStg Storage temperature range (1) (2) (3) -0.5V to +7V ±50mA 112.6°C/W 150°C -65°C to 150°C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are referenced to ground. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS MIN MAX VCC Supply voltage 2 6 UNIT V VI Input voltage 0 VCC V VO Output voltage 0 VCC V TA Operating free-air temperature -40 125 °C ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER VIH VIL High level input voltage Low level input voltage TEST CONDITIONS VI (V) IO (mA) — — — — VCC MIN High level output voltage, CMOS loads VOH(TTL) High level output voltage, TTL loads VOL(CMOS) Low level output voltage, CMOS loads VIH or VIL VCC or GND VIH or VIL -0.02 MAX MIN 2 1.7 1.7 4.5 3.6 3.6 6 4.8 4.8 UNIT MAX V 2 0.3 0.3 4.5 0.8 0.8 6 1.1 1.1 2 VOH(CMOS) TA = -40 to 125°C TA = 25°C 4.5 1.8 V 1.8 4 4 6 5.5 5.5 V -4 4.5 3.98 3.7 -5.2 6 5.48 5.2 2 0.2 0.2 0.02 4.5 0.5 0.5 6 0.5 0.5 4 4.5 0.26 0.4 5.2 6 0.26 0.4 V V VOL(TTL) Low level output voltage, TTL loads VCC or GND II Input leakage current VCC or GND — 6 ±0.1 ±1 µA ICC Quiescent device current VCC or GND 0 6 2 40 µA Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CD74HCU04-Q1 V 3 CD74HCU04-Q1 SCHS381 – JUNE 2010 www.ti.com SWITCHING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) TEST CONDITIONS PARAMETER tPLH, tPHL Propagation delay, input to output Y (see Figure 1) TA = 25°C VCC MIN TYP MIN MAX CL = 50pF 2 70 105 CL = 50pF 4.5 14 21 CL = 50pF 6 12 18 2 75 110 CL = 50pF 4.5 15 22 13 19 tTLH, tTHL Transition times (see Figure 1) CI Input capacitance — — CPD Power dissipation capacitance (1) (2) — 5 6 (1) (2) TA = -40 to 125°C MAX UNIT ns ns See Figure 3 14 pF CPD is used to determine the dynamic power consumption, per inverter. PD = VCC2 × fi (CPD + CL), where fi = input frequency, CL = output load capacitance, VCC = supply voltage TEST WAVEFORMS tr = 6ns tf = 6ns VCC 90% 50% 10% INPUT GND tTHL tTLH 90% 50% 10% INVERTING OUTPUT tPHL tPLH Figure 1. HC and HCU Transition Times and Propagation Delay Times, Combination Logic 4 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CD74HCU04-Q1 CD74HCU04-Q1 www.ti.com SCHS381 – JUNE 2010 ICC, VCC TO GND CURRENT (mA) TYPICAL PERFORMANCE CURVES AMBIENT TEMPERATURE TA = 25o C 25.0 22.5 VCC = 6V 20.0 17.5 15.0 VCC = 4.5V 12.5 10.0 7.5 5.0 VCC = 2V 2.5 0 1 2 3 4 5 6 VI, INPUT VOLTAGE (V) CI, INPUT CAPACITANCE (pF) Figure 2. Typical Inverter Supply Current as a Function of Input Voltage 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 AMBIENT TEMPERATURE, TA = 25oC VDD = 2V, VI 0-2V INPUT PIN 5 CONDITIONS VDD = 3V, VI 0-3V VDD = 4V, VI 0-4V VDD = 5V, VI 0-5V VDD = 6V, VI 0-6V 1 2 3 4 5 6 VI , IINPUT VOLTAGE (V) Figure 3. Input Capacitance as a Function of Input Voltage Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CD74HCU04-Q1 5 PACKAGE OPTION ADDENDUM www.ti.com 15-Jul-2010 PACKAGING INFORMATION Orderable Device CD74HCU04QPWRQ1 Status (1) Package Type Package Drawing ACTIVE TSSOP PW Pins Package Qty 14 2000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) Purchase Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF CD74HCU04-Q1 : • Catalog: CD74HCU04 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74HCU04QPWRQ1 Package Package Pins Type Drawing TSSOP PW 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 12.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HCU04QPWRQ1 TSSOP PW 14 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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