STMicroelectronics ECMF02-2HSMX6 Esd protected common mode filter for usb3.0 interface Datasheet

ECMF02-2HSMX6
ESD protected common mode filter for USB3.0 interface
Datasheet - production data
• Save components count
• Make the application robust against ESD
strikes from external environment
Description
The ECMF02-2HSMX6 is a highly integrated
common mode filter designed to suppress
EMI/RFI common mode noise on high speed
differential serial buses like the USB3.0
transceiver.
µQFN-6L 1.7 x 1.5 mm
Figure 1. Pin out, top view
Applications
D+ connector
1
6
D+ IC
D- connector
2
5
D- IC
GND
3
4
To be left floating
Consumer and computer electronics featuring
USB3.0 such as:
• Personal computer
• Notebook
• Tablet
• Set-top boxes
• PC graphic cards
Features
• Telecom application
• High common mode attenuation:
– -10 dB @ 300 MHz
– -20 dB @ 2.4 and 5 GHz
– -15 dB from 500 MHz to 6 GHz
• Compliant with USB3.0 eye diagram
• Small and thin package 1.5 x 1.7 x 0.5 mm
• RoHS compliant.
• High reduction of parasitic elements through
integration.
• ESD protection compliant with IEC 61000-4-2
level 4 standards (8 kV contact)
Benefits
• Suppress the common mode noise but keep
signal integrity
• Low PCB space consumption.
August 2014
This is information on a product in full production.
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www.st.com
Functional description
1
ECMF02-2HSMX6
Functional description
The ECMF02-2HSMX6 is an ESD protected common mode filter especially designed for
USB3.0 Tx/Rx differential pair, for host and device. The USB3.0 is actually made of 3
differential pairs. The first differential pair supports the high speed USB mode (also called
USB2.0 mode). The 2 other differential pairs are used to support the super speed USB mode
in full duplex. Bit rate on super speed USB can reach 5 Gbps. The ECMF02-2HSMX6 is
able to filter the common mode noise from 300 MHz to 6 GHz, helping to make the
application compliant with the electromagnetic interference emission standard such as
CISPR22 or FCC part 15, or EN55022 and avoiding antenna desense on mobile phones,
WiFi/Bluetooth, GPS,/GNSS frequencies. At the same time, the ECMF02-2HSMX6 keeps
the high speed signal integrity and provides an efficient ESD protection.
More application information available in following AN:
•
Application Note AN4356: "Antenna desense on handheld equipment"
•
Application Note AN4511: "Common Mode filters"
•
Application Note AN4540: "MHL link filtering and protection"
Figure 2. Functional diagram
D+ connector
1
6
D+ IC
D- connector
2
5
D- IC
3
4
To be left floating
GND
A typical application diagram is shown in Figure 3. ST offers a global approach to USB3.0
interface by providing a comprehensive range of dedicated products.
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ECMF02-2HSMX6
Functional description
Figure 3. Typical application diagram
Host
USB 2.0
V BUS
D+
High
Speed
Driver
DGND
VBUS
GND
VBUS
GND
D-
D-
D-
D-
D+
D+
D+
D+
GND
ID
ID
GND
ECMF02-4CMX8
+
SSTX+
SSTX -
USB 3.0
D6
D1
D+
5
D+
2
I4D
+
SSRX+
SSRX -
V BUS USB 2.0
D+
High
DSpeed
GND Driver
ECMF02-4CMX8
GND
3
ECMF02-2HSMX6
Super
Speed
Driver
Hub/device
USB 3.0 cable
-1
D
-6
D
+2
D
+5D
D3
NG
4
DI
SSTX+
SSTX -
+
USB 3.0
ECMF02-2HSMX6
D6
D1
-1
D
-6
D
D+
5
D+
2
+2
D
+5D
I4D
GND
3
D3
NG
4
DI
ECMF02-2HSMX6
SSRX+
Super
Speed
Driver
+
SSRX -
ECMF02-2HSMX6
CONNECTOR
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CONNECTOR
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Electrical characteristics
2
ECMF02-2HSMX6
Electrical characteristics
Table 1. Absolute maximum ratings (limiting values)
Symbol
Parameter
VPP
ESD discharge (pins 1 and 2)
IEC 61000-4-2 level 4
IDC
Maximum DC current
TOP
Operating temperature range
Test conditions
TJ
Maximum junction temperature
Tstg
Storage temperature range
Value.
Unit
Contact discharge
±8
kV
Air discharge
±15
kV
100
mA
-40 to 85
°C
125
°C
-55 to +150
°C
Figure 4. Electrical characteristics (definitions)
Symbol
VBR =
IRM =
VRM =
VCL =
IPP =
IF =
VF =
I
Parameter
Breakdown voltage
Leakage current @ VRM
Stand-off voltage
Clamping voltage at IPP
Peak pulse current
Forward current
Forward voltage
IF
VCL
VBR VRM
VF
V
IRM
IR
IPP
Table 2. Electrical characteristics (Tamb = 25 °C)
Symbol
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Parameter
Test conditions
VBR
Breakdown voltage
IR = 1 mA
IRM
Reverse leakage
VRM = 3 V
RDC
DC serial resistance
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Min.
Typ.
Max.
6
Unit
V
7
100
nA
9
Ω
ECMF02-2HSMX6
Electrical characteristics
Figure 5 shows that USB3.0 devices and cables can interfere with radio frequency devices
operating between 700 MHz and 5 GHz.
Figure 5. USB3.0 frequency radiation measured with current loop
-70
dB
Skew
-75
-80
-85
-90
-95
-100
0
Frequency (GHz)
0,5
1
1,5
2
2,5
3
3,5
4
4,5
5
5,5
6
Figure 6. Differential attenuation versus frequency
0
SDD21 (dB)
F0 @-3 dB = 3.2 GHz
-1
-2
-3
-4
F (Hz)
-5
10M
30M
100M
300M
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1G
3G
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Electrical characteristics
ECMF02-2HSMX6
Figure 7. Common mode attenuation versus frequency
SCC21 (dB)
0
USB3.0 S21CC template
-5
-10
-15
-20
-25
-30
-35
F (Hz)
-40
10M
Note:
30M
100M
300M
1G
3G
STMicroelectronics has defined the USB3.0 SCC21 template to prevent antenna desense
between 700 MHz and 5 GHz.
Figure 8. Return loss versus frequency (Z0 COM = 50 Ω - SDD11)
SDD11 (dB)
0
-5
-10
-15
-20
-25
-30
-35
F (Hz)
40
10M
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30M
100M
300M
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1G
3G
ECMF02-2HSMX6
Electrical characteristics
Figure 9. Return loss versus frequency (Z0 COM = 50 Ω - SDD22)
SDD22 (dB)
0
-5
-10
-15
-20
-25
-30
-35
F (Hz)
-40
10M
30M
100M
300M
1G
3G
Figure 10. Differential (ZDD21) and common mode (ZCC21) impedance versus frequency
ZDD21 1E4
ZCC21
(Ω)
1E3
1E2
1E1
F
(Hz)
1E7
1E8
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1E9
6E9
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Electrical characteristics
ECMF02-2HSMX6
Figure 11. Typical ESD response to IEC 61000-4-2 +8kV contact
10 V/div
1
2
3
4
1 56.4 V
2 26.8 V
VPP: ESD peak voltage
VCL :clamping voltage @ 30 ns
VCL :clamping voltage @ 60 ns
VCL :clamping voltage @ 100 ns
3 19.0 V
4 12.5 V
20 ns/div
Figure 12. Typical ESD response to IEC 61000-4-2 -8kV contact
10 V/div
4 -6.4 V
3 -9.9 V
2 -16.0 V
1
2
3
4
VPP: ESD peak voltage
VCL :clamping voltage @ 30 ns
VCL :clamping voltage @ 60 ns
VCL :clamping voltage @ 100 ns
1 -60.2 V
20 ns/div
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ECMF02-2HSMX6
Electrical characteristics
Figure 13. USB2.0 (480 Mbps) eye diagram
without device
Figure 14. USB2.0 (480 Mbps) eye diagram with
device
Figure 15. USB3.0 (5 Gbps) eye diagram without
device
Figure 16. USB3.0 (5 Gbps) eye diagram with
device
Figure 17. USB3.1 (10 Gbps) eye diagram
without device
Figure 18. USB3.1 (10 Gbps) eye diagram with
device
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Electrical characteristics
ECMF02-2HSMX6
Figure 19. MHL (4.5 Gbps) eye diagram without
device
Figure 20. MHL (4.5 Gbps) eye diagram with
device
Figure 21. MHL (6 Gbps) eye diagram without
device
Figure 22. MHL (6 Gbps) eye diagram with
device
Figure 23. Display Port HBR2 (5.4 Gbps) eye
diagram without device
Figure 24. Display Port HBR2 (5.4 Gbps) eye
diagram with device
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ECMF02-2HSMX6
3
Package information
Package information
•
Epoxy meets UL94, V0
•
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 25. µQFN-6L dimension definitions
Top view
D
Index area
E
Side view
A1
A
Bottom view
e
b
1
3
L1
PIN # 1 ID
L2
6
4
Table 3. µQFN-6L dimension values
Dimensions
Ref.
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.45
0.50
0.55
0.018
0.020
0.022
A1
0.00
0.02
0.05
0.000
0.001
0.002
b
0.15
0.20
0.25
0.006
0.008
0.010
D
1.55
1.60
1.65
0.061
0.063
0.065
E
1.30
1.35
1.40
0.051
0.053
0.055
e
0.45
0.50
0.55
0.018
0.020
0.022
L1
0.35
0.45
0.55
0.014
0.018
0.022
L2
0.65
0.75
0.85
0.026
0.030
0.034
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Package information
ECMF02-2HSMX6
Figure 26. Footprint, dimensions in mm
(inches)
Figure 27. Marking
0.50
(0.0197)
0.65
(0.0256)
0.25
(0.0098)
x x z
y ww
0.95
(0.0374)
0.30
(0.0118)
Dot,
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Figure 28. Tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.55
4.0
8.0
3.5
1.85
1.75
0.22
xxx
yww
1.63
0.75
All dimensions are typical values in mm
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xxx
yww
xxx
yww
4.0
User direction of unreeling
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ECMF02-2HSMX6
Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
Stencil opening design
1.
General recommendation on stencil opening design
a)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 29. Stencil opening dimensions
L
T
b)
W
General design rule
Stencil thickness (T) = 75 ~ 125 µm
W
Aspect Ratio = ----- ≥ 1.5
T
L×W
Aspect Area = ---------------------------- ≥ 0.66
2T ( L + W )
2.
4.2
Reference design
a)
Stencil opening thickness: 100 µm
b)
Stencil opening for leads: Opening to footprint ratio is 90%.
Solder paste
1.
Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste recommended.
3.
Offers a high tack force to resist component displacement during PCB movement.
4.
Use solder paste with fine particles: powder particle size 20-45 µm.
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Recommendation on PCB assembly
ECMF02-2HSMX6
Figure 30. Recommended stencil window position
0.50
(0.0197)
0.30
(0.0118)
0.95
(0.0374)
0.65
(0.0256)
0.34
(0.0134)
0.90
(0.0354)
0.62
(0.0244)
0.25
(0.0098)
Stencil window
Footprint
0.50
(0.0197)
0.24
(0.0095)
4.3
4.4
14/17
mm
(inches)
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3.
Standard tolerance of ± 0.05 mm is recommended.
4.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
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ECMF02-2HSMX6
4.5
Recommendation on PCB assembly
Reflow profile
Figure 31. ST ECOPACK® recommended soldering reflow profile for PCB mounting
240-245 °C
Temperature (°C)
250
-2 °C/s
2 - 3 °C/s
60 sec
(90 max)
200
-3 °C/s
150
-6 °C/s
100
0.9 °C/s
50
Time (s)
0
30
60
90
120
150
180
210
240
270
300
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
4.6
PCB layout recommendation
Figure 32. PCB footprint recommendation
Zdiff according to the application
Via to GND plane
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Ordering information
5
ECMF02-2HSMX6
Ordering information
Figure 33. Ordering information scheme
ECMF 02 - 2
HS MX6
Function
ESD common mode filter
Number of lines
02 = 2 lines
Number of ESD protected lines
2 = 2 ESD protected lines
Version
HS = High speed lines
Package
Mx6 = µQFN-6L
Table 4. Ordering information
6
Order code
Marking
Package
Weight
Base qty
Delivery mode
ECMF02-2HSMX6
KR
µQFN-6L
3.4 mg
3000
Tape and reel
Revision history
Table 5. Document revision history
16/17
Date
Revision
Changes
13-Nov-2013
1
Initial release.
25-Aug-2014
2
Inserted Figure 10: Differential (ZDD21) and common
mode (ZCC21) impedance versus frequency.
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ECMF02-2HSMX6
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