Formosa HFM205-BS Chip high effciency rectifier Datasheet

Formosa
MS
HFM201-BS THRU HFM207-BS
Chip High Effciency Rectifiers
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-121301
2011/03/10
Revised Date
-
Revision
A
Page.
7
Formosa
MS
HFM201-BS THRU HFM207-BS
Chip High Effciency Rectifiers
2.0A Surface Mount High
Effciency Rectifiers-50-1000V
Package outline
SMB-S
Features
• Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
0.220(5.6)
0.205(5.2)
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
High current capability.
Ultrafast recovery time for high efficiency.
High surge current capability.
Glass passivated chip junction.
Lead-free parts meet RoHS requirments.
Suffix "-H" indicates Halogen free parts, ex. HFM201-BS-H.
0.020(0.5) Typ.
0.083(2.1)
0.138(3.5)
0.122(3.1)
0.075(1.9)
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AA /SMB-S
• Terminals : Solder plated, solderable per
0.067(1.7)
0.060(1.5)
0.040(1.0) Typ.
0.040 (1.0) Typ.
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.072 gram
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics (AT
PARAMETER
T A=25 oC unless otherwise noted)
CONDITIONS
Forward rectified current
See Fig.2
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
V R = V RRM T J = 25 OC
Reverse current
UNIT
IO
2.0
A
I FSM
50
A
f=1MHz and applied 4V DC reverse voltage
Storage temperature
*1
V RRM
(V)
V RMS*2
(V)
*3
VR
(V)
HFM201-BS
50
35
50
HFM202-BS
100
70
100
HFM203-BS
200
140
200
HFM204-BS
400
280
400
HFM205-BS
600
420
600
HFM206-BS
800
560
800
HFM207-BS
1000
700
1000
*4
VF
(V)
Operating
temperature
T J, ( OC)
*5
t rr
(ns)
1.00
TYP.
5.0
μA
150
25
CJ
T STG
SYMBOLS
MIN.
IR
V R = V RRM T J = 125 OC
Diode junction capacitance
MAX.
Symbol
pF
O
+175
-65
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
50
*3 Continuous reverse voltage
1.30
-55 to +150
*4 Maximum forward voltage@I F=2.0A
1.70
75
*5 Maximum Reverse recovery time, note 1
Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 2
Document ID
Issued Date
DS-121301
2011/03/10
Revised Date
-
Revision
A
Page.
7
Rating and characteristic curves (HFM201-BS THRU HFM207-BS)
FIG.2-TYPICAL FORWARD CURRENT
DERATING CURVE
FIG.1-TYPICAL FORWARD
CHARACTERISTICS
3.0
AVERAGE FORWARD CURRENT,(A)
S
20
7B
S~
H
FM
20
5B
H
FM
1.0
HF
M2
04
-B
S
HF
M2
01
-B
S~
H
.1
2.5
2.0
1.5
1.0
P.C.B. Mounted on
0.2" x 0.2" (5 mm x 5 mm)
Copper Pad Areas
0.5
0
0
50
100
150
LEAD TEMPERATURE ( C)
TJ=25 C
Pulse Width 300us
1% Duty Cycle
.01
.6
.8
1.0
1.2
1.4
1.6
PEAK FORWARD SURGE CURRENT,(A)
.001
.4
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
1.8
FORWARD VOLTAGE,(V)
FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE
RECOVERY TIME CHARACTERISTICS
50W
NONINDUCTIVE
10W
NONINDUCTIVE
( )
(+)
D.U.T.
25Vdc
(approx.)
PULSE
GENERATOR
(NOTE 2)
( )
60
TJ=25 C
50
8.3ms Single Half
Sine Wave
JEDEC method
40
30
20
10
0
1
(+)
1W
NONINDUCTIVE
2
5
OSCILLISCOPE
(NOTE 1)
10
50
100
NUMBER OF CYCLES AT 60Hz
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.
2. Rise Time= 10ns max., Source Impedance= 50 ohms.
FIG.5-TYPICAL JUNCTION CAPACITANCE
140
trr
JUNCTION CAPACITANCE,(pF)
INSTANTANEOUS FORWARD CURRENT,(A)
FM
20
3-B
S
10
|
|
|
|
|
|
|
|
+0.5A
0
-0.25A
-1.0A
120
100
80
60
40
20
1cm
SET TIME BASE FOR
50 / 10ns / cm
0
.01
.05
.1
.5
1
5
10
50
100
REVERSE VOLTAGE,(V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 3
Document ID
Issued Date
DS-121301
2011/03/10
Revised Date
-
Revision
A
Page.
7
Formosa
MS
HFM201-BS THRU HFM207-BS
Chip High Effciency Rectifiers
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
1
2
2
Marking
Type number
Marking code
HFM201-BS
HFM202-BS
HFM203-BS
HFM204-BS
HFM205-BS
HFM206-BS
HFM207-BS
H21
H22
H23
H24
H25
H26
H27
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SMB-S
0.078 (2.00)
0.059 (1.50)
0.110 (2.80)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
DS-121301
2011/03/10
Revised Date
-
Revision
A
Page.
7
Formosa
MS
HFM201-BS THRU HFM207-BS
Chip High Effciency Rectifiers
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SMB-S
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.81
5.74
2.24
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
8.00
4.00
2.00
0.23
12.00
18.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
DS-121301
2011/03/10
Revised Date
-
Revision
A
Page.
7
Formosa
MS
HFM201-BS THRU HFM207-BS
Chip High Effciency Rectifiers
Reel packing
PACKAGE
REEL SIZE
SMB-S
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
4,000
8.0
8,000
337*337*37
330
CARTON
SIZE
(m/m)
350*330*360
APPROX.
GROSS WEIGHT
(kg)
CARTON
(pcs)
16.9
64,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
DS-121301
2011/03/10
Revised Date
-
Revision
A
Page.
7
Formosa
MS
HFM201-BS THRU HFM207-BS
Chip High Effciency Rectifiers
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=150 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Forward Operation Life
Rated average rectifier current at T A=25 OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
JESD22-A102
15P SIG at T A=121 OC for 4 hrs.
MIL-STD-750D
METHOD-1051
7. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
MIL-STD-750D
METHOD-4066-2
9. Humidity
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
10. High Temperature Storage Life
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 7
Document ID
Issued Date
DS-121301
2011/03/10
Revised Date
-
Revision
A
Page.
7
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