CYSTEKEC BTB1236AK3-O-TB-S Silicon pnp epitaxial planar transistor Datasheet

CYStech Electronics Corp.
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
Page No. : 1/6
Silicon PNP Epitaxial Planar Transistor
BTB1236AK3
Description
• High BVCEO
• High current capability
• Pb-free lead plating package
Symbol
Outline
TO-92L
BTB1236AK3
B:Base
C:Collector
E:Emitter
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Base Current
Collector Power Dissipation
Junction Temperature
Storage Temperature
BTB1236AK3
Symbol
VCBO
VCEO
VEBO
IC
ICP
IB
PC
Tj
Tstg
Limits
-180
-160
-7
-1.5
-3
0.5
900
150
-55~+150
Unit
V
V
V
A
A
A
mW
°C
°C
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
Page No. : 2/6
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VCE(sat)
*VBE(on)
hFE1
hFE2
fT
Cob
Min.
-180
-160
-7
-0.45
100
30
-
Typ.
180
24
Max.
-1
-1
-0.3
-0.6
-0.75
320
-
Unit
V
V
V
µA
µA
V
V
V
MHz
pF
Test Conditions
IC=-50µA, IE=0
IC=-1mA, IB=0
IE=-50µA, IC=0
VCB=-160V, IE=0
VEB=-5V, IC=0
IC=-500mA, IB=-50mA
IC=-1A, IB=-100mA
VCE=-5V, IC=-5mA
VCE=-5V, IC=-200mA
VCE=-5V, IC=-500mA
VCE=-5V, IC=-150mA
VCB=-10V, IE=0, f=1MHz
*Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2%
Classification Of hFE1
Rank
O
Range
100~200
Y
160~320
Ordering Information
Device
HFE rank
BTB1236AK3-O-BK-S
O
BTB1236AK3-Y-BK-S
Y
BTB1236AK3-O-TB-S
O
BTB1236AK3-Y-TB-S
Y
BTB1236AK3
Package
TO-92L
(Pb-free lead plating)
TO-92L
(Pb-free lead plating)
TO-92L
(Pb-free lead plating)
TO-92L
(Pb-free lead plating)
Shipping
500 pcs / bag, 10 bags/box, 10 boxes/carton
500 pcs / bag, 10 bags/box, 10 boxes/carton
2000 pcs / Tape & Box
2000 pcs / Tape & Box
CYStek Product Specification
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
Page No. : 3/6
CYStech Electronics Corp.
Typical Characteristics
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
Saturation Voltage---(mV)
1000
Current Gain---HFE
VCE=5V
100
VCE=2V
VCESAT@IC=50IB
100
VCE=1V
VCESAT@IC=10IB
10
10
1
10
100
1000
Collector Current---IC(mA)
1
10000
10
100
1000
10000
Collector Current---IC(mA)
On Voltage vs Collector Current
Saturation Voltage vs Collector Current
1000
1000
On Voltage---VBEON(mV)
Saturation Voltage---(mV)
VBESAT@IC=10IB
VBESAT@IC=50IB
100
100
1
10
100
1000
Collector Current---IC(mA)
1
10000
10
100
1000
Collector Current---IC(mA)
10000
Power Derating Curve
Capacitance vs Reverse-biased Voltage
1000
1000
Power Dissipation---PD(mW)
Capacitance--(pF)
900
100
800
700
600
500
400
300
200
100
0
10
0.1
BTB1236AK3
1
10
Reverse-biased Voltage---VR(V)
100
0
50
100
150
200
Ambient Temperature---TA(℃)
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
Page No. : 4/6
TO-92L Taping Outline
DIM
A1
A
T
d
d1
P
P0
P2
F1, F2
△h
W
W0
W1
W2
H
H0
L1
D0
t1
t2
P1
△P
BTB1236AK3
Item
Millimeters
Component body width
Component body height
Component body thickness
Lead wire diameter
Lead wire diameter 1
Pitch of component
Feed hole pitch
Hole center to component center
Lead to lead distance
Component alignment, F-R
Tape width
Hole down tape width
Hole position
Hole down tape position
Height of component from tape center
Lead wire clinch height
Lead wire (tape portion)
Feed hole diameter
Taped lead thickness
Carrier tape thickness
Position of hole
Min.
4.70
7.80
3.70
0.40
0.62
12.40
12.50
6.05
2.20
-1.00
17.50
5.50
8.50
19.00
15.50
2.50
3.80
0.35
0.15
3.55
Max.
5.10
8.20
4.10
0.50
0.78
13.00
12.90
6.65
2.80
1.00
19.00
6.50
9.50
1.00
21.00
16.50
4.20
0.45
0.25
4.15
Component alignment
-1.00
1.00
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTB1236AK3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
Page No. : 6/6
TO-92L Dimension
Marking:
Product Name
B1236
Date Code: Year+Month
□□
Year: 7→2007, 8→2008
Month: 1→1, 2→2, ‧‧‧,
9→9, A→10, B→11, C→12
Style: Pin 1.Emitter 2.Collector 3.Base
3-Lead TO-92L Plastic Package
CYStek Package Code: K3
Inches
DIM
Min.
0.146
0.050
0.014
0.024
0.014
0.185
0.157
Max.
0.161
0.062
0.022
0.031
0.018
0.201
-
Millimeters
Min.
Max.
3.700
4.100
1.280
1.580
0.350
0.550
0.600
0.800
0.350
0.450
4.700
5.100
4.000
-
A
A1
b
b1
c
D
D1
Notes: 1.Controlling dimension: millimeters.
DIM
E
e
e1
L
ϕ
h
Inches
Min.
0.307
Max.
0.323
*0.05
0.096
0.543
0.000
0.104
0.559
0.063
0.012
*: Typical
Millimeters
Min.
Max.
7.800
8.200
*1.270
2.440
2.640
13.800
14.200
1.600
0.000
0.300
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB1236AK3
CYStek Product Specification
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