CYSTEKEC CTK24BC08P8 2-wire serial eeproms 1k/2k/4k/8k/16k Datasheet

CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 1/12
2-Wire Serial EEPROMs 1K/2K/4K/8K/16K
CTK24BC01-16P8
Description
The CTK24BC family provides 1K, 2K, 4K, 8K and 16K of serial electrically erasable and programmable
read-only memory (EEPROM). The wide Vdd range allows for low-voltage operation down to 1.8V. The
device, fabricated using traditional CMOS EEPROM technology, is optimized for many industrial and
commercial applications where low-voltage and low-power operation is essential. The device is accessed
via a 2-wire serial interface.
Features
• Internally organized as 128×8(1K), 256×8(2K)
512×8(4K), 1024×8(8K), 2048×8(16K)
• Low-voltage and standard-voltage operation :
1.8~5.5V
• 2-wire serial interface bus
• Date retention : 100 years
• High endurance : 1,000,000 write cycles
• 100kHz(1.8V)& 400kHz(5V) compatibility
• Bi-directional data transfer protocol
• Self-timed write cycle (5ms max)
• Write protect pin for hardware data protection
• 8-byte page (1K, 2K) and 16-byte page (4K, 8K, 16K)
write modes
• Allows for partial page write
Absolute Maximum Ratings
Parameter
Voltage on any pin with respect to ground
Maximum operating voltage
DC output current
Operating temperature range
Storage temperature range
Ratings
-0.8 to VCC+1.5
6.25
5.0
-55 ~ +125
-65 ~ +150
Unit
V
V
mA
℃
℃
Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of these specifications are not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
CTK24BC01-16P8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 2/12
Pin Configurations
Pin Name
A0-A2
SDA
SCL
WP
Gnd
VCC
Function
Address inputs
Serial data
Serial clock input
Write protect
Ground
Power supply
Block Diagram
CTK24BC01-16P8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 3/12
Pin Descriptions
Serial Data(SDA): The SDA pin used for sending and receiving data bits in serial mode. Since the SDA
pin is defined as an open-drain connection, a pull-up resistor is needed.
Serial Clock(SCL): The SCL input is used to synchronize data input and output with clocked out on the
falling edge of SCL.
Device/Page Addresses(A2, A1, A0): The A2, A1, and A0 pins are used to address multiple devices on a
single bus system and should be hard-wired.
● The CTK24BC01 and CTK24BC02 use the A2, A1 and A0 pins to provide the capability for
addressing up to eight 1K/2K devices on a single bus system (please see the Device Addressing
section for further details)
● The CTK24BC04 uses the A2 and A1 inputs and a total of for 4K device may be addressed on
a single bus system. The A0 pin is not used, but should be grounded if possible.
● The CTK24BC08 only uses the A2 input hardware addressing. On a single bus system, a total
of two 8K devices may be addressed. The A0 and A1 pins are not used, but should be grounded
if possible.
● The CTK24BC16 does not use the device address pins, so only one device can be connected to a
single bus system. Therefore, the A0, A1, and A2 pins are not used, but should be grounded if
possible.
Write Protect (WP): The CTK24BC01/02/04/08/16 has a Write Protect pin that provides hardware data
protection. When connected to ground, the Write Protect pin allows for normal read/write
operations. If the WP pin is connected to VCC, no data can be overwritten.
Memory Organization
The internal memory organization for the CTK24BC family is arranged differently for each of the densities.
The CTK24BC01, for instance, is internally organized as 16 pages of 8 bytes each and requires a 7-bit data
word address. The CTK24BC16, on the other hand, is organized as 128 pages of 16 bytes each with an
11-bit data word address. The table below summarizes these differences.
Density
# of pages
Bytes per page
Data word address length
CTK24BC01 (1K)
16 pages
8 bytes
7 bits
CTK24BC02 (2K)
32 pages
8 bytes
8 bits
CTK24BC04 (4K)
32 pages
16 bytes
9 bits
CTK24BC08 (8K)
64 pages
16 bytes
10 bits
CTK24BC16 (16K)
128 pages
16 bytes
11 bits
Pin Capacitance
Applicable over recommended operating range :TA=25℃, f=1MHz, VCC=+1.8V
Symbol
Test Condition
Max
Unit
CI/O
Input/Output Capacitance (SDA)
8
pF
CIN
Input Capacitance (A0, A1,A2, SCL)
6
pF
Condition
VI/O=0V
VIN=0V
Note : These parameters are characterized and not 100% tested.
CTK24BC01-16P8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 4/12
DC Characteristics
Applicable over recommended operating range: TA=-40~+85℃, VCC=+1.8V~+5.0V(unless otherwise noted)
Parameter
Supply Voltage
Supply Voltage
Supply Voltage
Supply Current VCC=5.0V
Supply Current VCC=5.0V
Standby Current VCC=1.8V
Standby Current VCC=2.5V
Standby Current VCC=5.5V
Input Leakage Current
Output Leakage Current
Input Low Level (Note 1)
Input High Level (Note 1)
Output Low Level VCC=3.0V
Output Low Level VCC=3.0V
Symbol
VCC 1
VCC 2
VCC 3
ICC
ICC
ISB 1
ISB 2
ISB 3
ILI
ILO
VIL
VIH
VOL 2
VOL 1
Condition
READ at 100KHz
WRITE at 100KHz
VIN=VCC or VSS
VIN=VCC or VSS
VIN=VCC or VSS
VIN=VCC or VSS
VOUT=VCC or VSS
IOL =2.1mA
IOL =0.15mA
Min.
1.8
2.7
4.5
-0.6
VCC×0.7
-
Typ.
0.4
2.0
0.6
1.4
5.0
0.2
0.1
-
Max.
5.5
5.5
5.5
1.0
3.0
3.0
4.0
18
5.0
5.0
VCC×0.3
VCC+0.5
0.4
0.2
Unit
V
V
V
mA
mA
μA
μA
μA
μA
μA
V
V
V
V
Note : VIL and VIH Max are reference only and are not tested.
AC Characteristics
Applicable over recommended operating range: TA=-40~+85℃, VCC=+1.8V~+5.0V, CL=1 TTL Gate & 100pF(unless otherwise noted)
Parameter
Symbol
Clock Frequency, SCL
fSCL
Clock Pulse Width Low
tLOW
Clock Pulse Width High
tHIGH
Noise Suppression Time (Note 1)
tI
Clock Low to Data Out Valid
tAA
Time the bus must be free before
A new transmission can start (Note 1)
tBUF
Start Hold Time
tHD.STA
Start Setup Time
tSU.STA
Data in Hold Time
tHD.DAT
Data in Setup Time
tSU.DAT
Input Rise Time (Note 1)
tR
Input Fall Time (Note 1)
tF
CTK24BC01-16P8
Condition
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
Min.
Typ.
-
-
4.7
1.2
4.0
0.6
0.1
0.1
4.7
1.2
4.0
0.6
4.7
0.6
0
0
200
100
Max.
100
400
Unit
-
-
μs
-
-
μs
-
100
50
4.5
0.9
KHz
ns
μs
-
-
μs
-
-
μs
-
-
μs
-
-
μs
-
-
ns
-
-
-
-
1.0
0.3
300
300
μs
ns
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 5/12
AC Characteristics(Cont.)
Applicable over recommended operating range: TA=-40~+85℃, VCC=+1.8V~+5.0V, CL=1TTL Gate & 100pF(unless otherwise noted)
Parameter
Stop Setup Time
Symbol
tSU.STO
Data out Hold Time
tDH
Write Cycle Time
tWR
5.0V, 25℃, Byte Mode
Endurance
(Note 1)
Note: 1. This parameter is characterized and not 100% tested.
Condition
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
VCC=1.8V
VCC=2.7~5.5V
Min.
4.7
0.6
100
50
Typ.
Max.
Unit
-
-
μs
-
-
ns
-
-
5
5
ms
1M
1M
-
-
Write
Cycles
Device Operation
Clock and Data Transitions: Transitions on the SDA pin should only occur when SCL is low(refer to the
Data Validity timing diagram in Figure 3). If the SDA pin changes when SCL is high, then the transition
will be interpreted as a START or STOP condition.
START Condition: A START condition occurs when the SDA transitions from high to low when SCL is
high. The START signal is usually used to initiate a command(refer to the START and STOP definition
timing diagram in Fig 4)
STOP Condition: A STOP condition occurs when the SDA transitions from low to high when SCL is high.
(refer to the START and STOP definition timing diagram in Fig 4) The STOP command will put the device
into standby mode after no acknowledgement is issued during the read sequence.
Acknowledge: An acknowledgement is sent by pulling the SDA low to confirm that a word has been
successfully received. All addresses and data words are serially transmitted to and from the EEPROM in
8-bit words, so acknowledgements are usually issued during the 9th clock cycle.
Standby Mode: Standby mode is entered when the chip is initially powered-on or after a STOP command
has been issued and any internal operations have been completed.
Memory Reset: In the event of unexpected power or connection loss, a START condition can be issued to
restart the input command sequence. If the device is currently in write cycle mode, this command will be
ignored.
CTK24BC01-16P8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 6/12
Bus Timing
Figure 1. SCL: Serial Clock, SDA: Serial Data I/O
Write Cycle Timing
Figure 2. SCL: Serial Clock, SDA: Serial Data I/O
Note : 1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal
clear/write cycle.
CTK24BC01-16P8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 7/12
Figure 3. Data Validity
Figure 4. START and STOP Definition
Figure 5. OUTPUT Acknowledge
CTK24BC01-16P8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 8/12
Device Addressing
To enable the chip for a read or write operation, an 8-bit device address word followed by a START
condition must be issued. The 1st four bits of the device address word consist of a mandatory ‘1010’ pattern,
while the 2nd four bits depend on the particular density being used(refer to Figure 6):
●In the 1K/2K chip, the next 3 bits should correspond to the hard-wired input A2, A1, and A0 device
address bits.
●In the 4K chip, the next 3 bits are the A2 and A1 device address bits and a memory page address bit.
The two device address bits must compare to their corresponding hard-wired input pins.
●In the 8K chip, the next 3 bits include the A2 device address bit with the next 2 bits used for memory
page addressing. The A2 bit must compare to its corresponding hard-wired input pin.
●The 16K chip does not use any device address bits but instead the 3 bits are used for memory page
addressing.
Figure 6. Device address
The memory page address bits , P2, P1, and P0 are used to select the page in the array. P2 represents the
most significant bit, while P1 and P0 are considered the next most significant bits.
The eight bit of the device address determines read or write operation. If the R/W bit is high, then a read
operation is initiated. Otherwise, if the R/W bit is low, then a write operation is started.
After comparing the device address and finding a match, the EEPROM device will issue an acknowledgement by pulling SDA low. If the comparison fails, the chip will return to standby mode.
Figure 7. Byte Write
CTK24BC01-16P8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 9/12
Figure 8. Page Write
Write Operation
Byte/Page Write:
If a write operation is entered (R/W=0) and an acknowledgement is sent, then the next sequence requires an
8-bit data word address. After an acknowledgement is received from this word address, the 1st byte of data
can be loaded. The device will send an acknowledgement after each byte to confirm the transmission.
To being the write cycle, a STOP condition must be issued ( refer to Figure 7). Both byte and page write
operations are supported, so the STOP condition can be issued after the 1st byte or the last byte in the page.
When the STOP condition occurs, an internal time is started, all inputs are disabled, and the EEPROM will
not respond to any more commands until the write cycle is completed.
Note: The number of bytes in a page depends on the density used. If 1K density is used, then the page size
is 8 bytes. In contrast, if the 16K density is used, then the page size is 16 bytes. Refer to the Memory
Organization section for more details.
The internal page counter is incremented after each byte received, but the row location of the memory page
will always remain the same. Therefore the device will wrap around to the 1st byte in the page after the last
byte in the page is received. Any further data loaded into the page buffer will overwrite the previous data
loaded.
Acknowledge Polling:
After the STOP condition is issued, the write cycle begins. Acknowledge polling can be initiated by
sending a START condition followed by the device address word. If the EEPROM has completed the
internal write cycle and returned to standby mode, the device will respond by sending back an
acknowledgement by pulling the SDA pin low. Otherwise, the sequence will be ignored and no
acknowledgement will be sent.
Read Operations
There are three types of read operations: current address read, random address read, and sequence read. A
random address read can be considered a current address read operation with an additional sequence in the
beginning to load a different address into the internal counter. A sequential read occurs when subsequent
bytes are clocked out after a current address read or random address read occurs.
CTK24BC01-16P8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 10/12
Current Address Read : A current address read operation is initiated by issuing R/W=1 in the device
address word(refer to Figure 9). Since the internal address counter maintains the last address incremented
by one accessed during the last read or write operation, the internal address counter will always retain the
last address incremented by one.
Random Read : To access a different address location that the one currently stored in the internal counter,
a random read operation is provided. The random read is actually a combination of a “dummy” byte write
sequence with a current address read command (refer to Figure 10). The “dummy” byte write loads a
different address into the internal counter, and the data can then be accessed using the current address read.
Sequential Read : In order to access subsequent data word after a current address read or random read has
been initiated, the user should send an acknowledgement to the EEPROM chip after each data byte received.
If an acknowledgement is not received, then the chip will not send any more data and expect a STOP
condition on the next cycle to reset back to standby mode(refer to Figure 11).
Sequential reads can be used to perform an entire chip read. Unlike the page write operation, the internal
counter will increment to the next row after the last byte of the page has been reached. When the address
reaches the last byte of the last memory page, the next address will increment to the 1st byte of the 1st
memory page.
Once the memory address limit is reached, the data word address will “roll over” and the sequential read
will continue. When the microcontroller does not respond with a zero but does generate a following stop
condition, the sequential read operation is terminated.
Figure 9. Current Address Read
CTK24BC01-16P8
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 11/12
Figure 10. Random Read
Figure 11. Sequential Read
Ordering Information
Ordering Code
CTK24BC01P8
CTK24BC02P8
CTK24BC04P8
CTK24BC08P8
CTK24BC16P8
CTK24BC01-16P8
Package
DIP-8
Device Function
1K bit(128×8)
2K bit(256×8)
4K bit(512×8)
8K bit(1024×8)
16K bit(2048×8)
Operating Ranges
Industrial (-40~+85℃)
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C705P8
Issued Date : 2007.08.23
Revised Date :
Page No. : 12/12
DIP-8P Dimension
Marking:
Date Code
24BC □□
□□□□
Memory:
1K: 01
2K: 02
4K: 04
8K:08
16K:16
DIP-8P Plastic Package
CYStek Package Code : P8
Inches
Min.
Max.
0.021
0.015
0.115
0.195
0.014
0.022
0.014
0.020
0.045
0.046
0.030
0.045
0.008
0.014
DIM
A
A1
A2
b
b1
b2
b3
c
Millimeters
Min.
Max.
0.5334
0.381
2.921
4.953
0.356
0.559
0.356
0.508
1.143
1.778
0.762
1.143
0.203
0.356
DIM
c1
D
E
E1
e
HE
L
Inches
Min.
Max.
0.008
0.011
0.355
0.400
0.240
0.280
0.300
0.325
0.100 BSC
0.430
0.115
0.150
Millimeters
Min.
Max.
0.203
0.279
9.017
10.16
6.096
7.112
7.620
8.255
2.540BSC
10.92
2.921
3.810
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CTK24BC01-16P8
CYStek Product Specification
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