MM7150 Motion Module Product Features Hardware Features • • • • • • • • The hardware features in the MM7150 module include the following: High Performance 32-bit Embedded Controller Cost effective solution Small form factor ideal for embedded applications Low power; 13.25mA in active mode System in deep sleep consumes 70µA Host interface via I2C 3.3-Volt I/O Package - 17mm x 17mm, 16-pin module Sensor Firmware • Sensor fusion firmware features include: - Self-contained 9-axis sensor fusion - Sensor data pass-through - Fast in-use background calibration of all sensors and calibration monitor - Magnetic immunity: Enhanced magnetic distortion, detection and suppression - Gyroscope drift cancellation - Fully calibrated • Easy to implement complete turnkey sensor fusion solution • Sensor power management • Sensors Supported - Bosch BMC150 Geomagnetic Sensor/Accelerometer - Bosch BMG160 Gyroscope 2015 - 2016 Microchip Technology Inc. • I2C Controller - Supports I2C bus speeds to 400kHz - Host Interface Supports Slave Operation • Low Power Modes Target Markets • • • • Internet of Things Applications Remote Controls, Gaming Fitness Monitoring Applications requiring data from an accelerometer, magnetometer and gyroscope Temperature Ranges Available • Industrial (-40°C to +85°C) • Commercial (0°C to +70°C) Description The MM7150 Motion Module is a simple, cost-effective solution for integrating motion and positioning data into a wide range of applications. The module contains the SSC7150 motion coprocessor with integrated 9-axis sensor fusion as well as high performance MEMS technology including a 3-axis accelerometer, gyroscope and magnetometer. All components are integrated, calibrated and available on the module for PCB mounting. DS00001888B-page 1 MM7150 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected]. We welcome your feedback. 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To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS00001888B-page 2 2015 - 2016 Microchip Technology Inc. MM7150 Table of Contents 1.0 MM7150 Pinout ............................................................................................................................................................................... 4 2.0 MM7150 Module ............................................................................................................................................................................. 7 3.0 MM7150 HID Functions .................................................................................................................................................................. 8 4.0 MM7150 Host Interface ................................................................................................................................................................. 12 5.0 MM7150 Firmware Update ........................................................................................................................................................... 13 6.0 MM7150 References ..................................................................................................................................................................... 14 7.0 MM7150 Performance .................................................................................................................................................................. 15 8.0 Electrical Characteristics ............................................................................................................................................................... 16 Appendix A: Revision History .............................................................................................................................................................. 24 The Microchip Web Site ...................................................................................................................................................................... 25 Customer Change Notification Service ............................................................................................................................................... 25 Customer Support ............................................................................................................................................................................... 25 Product Identification System ............................................................................................................................................................. 26 2015 - 2016 Microchip Technology Inc. DS00001888B-page 3 MM7150 1.0 MM7150 PINOUT The pinout of the MM7150 Motion Module is shown in the assembly drawing. 1.1 Assembly Drawing The assembly drawing is shown in Figure 1-1. FIGURE 1-1: DS00001888B-page 4 ASSEMBLY DRAWING 2015 - 2016 Microchip Technology Inc. MM7150 1.2 Recommended Land Pattern 17.84mm 15.04mm 13.70mm 11.62mm 11.16mm 9.08mm 8.61mm 6.53mm 16 6.08mm 4.00mm 2.80mm 0.00mm 2015 - 2016 Microchip Technology Inc. 17.84mm 15.04mm 13.70mm 11.16mm 11.62mm 8.61mm 9.08mm 6.53mm 6.08mm 4.00mm 2.80mm 0.00mm 1 DS00001888B-page 5 MM7150 1.3 Pin Descriptions The pin descriptions are provided in Table 1-1. TABLE 1-1: PIN DESCRIPTIONS Pin Number 1 Name HOST_TO_SH_WAKE Type I Description Used to wake Motion Module from a Sleep state. This signal must be driven high at least 11ms prior to sending any I2C traffic to the Motion Module. Active high input. This pin should be connected to VDD through a 100KΩ resistor. 11 HOST_TO_SH_RESET I Reset input. Used to reset the host I2C interface. This pin should be connected to VDD through a 100KΩ resistor. 4 HIDI2C_HOST_INT O Alert Interrupt signal from Motion Module to Host. Used to tell Host data from Motion Module is ready to be sent out. Active low output. 15 HIDI2C_HOST_CLK IOD I2C Controller Clock to Host Interface 16 HIDI2C_HOST_DAT IOD I2C Controller Data to Host Interface 10 NC1 - This pin should be left unconnected 2 NC2 - This pin should be left unconnected 9 NC3 - This pin should be left unconnected 12 NC4 - This pin should be left unconnected 13 NC5 - This pin should be left unconnected 14 NC6 - This pin should be left unconnected 3 NC7 - This pin should be left unconnected 5 NC8 - This pin should be left unconnected 6 NC9 - This pin should be left unconnected 7 VDD PWR VDD supply 8 VSS GND VDD associated ground DS00001888B-page 6 2015 - 2016 Microchip Technology Inc. MM7150 2.0 MM7150 MODULE The MM7150 Motion Module provides 9-axis sensor fusion that includes a 3-axis accelerometer, a 3-axis gyroscope and a 3-axis magnetometer. The module has an I2C interface to the host, and supports HID over I2C. The module includes the Bosch BMC150 Geomagnetic Sensor/Accelerometer and Bosch BMG160 Gyroscope. 2.1 Module Block Diagram The block diagram of the module is shown in Figure 2-1. MM7150 MODULE BLOCK DIAGRAM GND +3.3V FIGURE 2-1: VDD VSS (x2) AVSS VSENSOR TPS22929 Power Load D2_WAKE_UP HIDI2C_HOST_DAT HIDI2C_HOST_CLK HIDI2C_HOST_INT HOST_TO_SH_WAKE HOST_TO_SH_RESET Bosch BMG160 (Gyro) Microchip SSC7150 Motion Coprocessor HIDI2C_DEVICE_CLK HIDI2C_DEVICE_DAT Bosch BMC150 (A+M) NC1 NC2 NC3 NC4 NC5 NC6 2.2 Module Features The MM7150 Motion Module provides self-contained 9-axis sensor fusion. It supports fast in-use background calibration of all sensors and calibration monitor. Magnetic immunity features provide enhanced magnetic distortion detection and suppression. The module also provides gyroscope drift cancellation. 2.3 Calibration Requirements User calibration is not required. The MM7150 Motion Module supports fast in-use background calibration of all sensors and calibration monitor. 2.4 Other Information To obtain the most recent and complete documentation for this module, including: - User's Guide Board Description Board Schematics Source Code Application Examples Links to Web Seminars Please refer to the web site: www.microchip.com/motion. 2015 - 2016 Microchip Technology Inc. DS00001888B-page 7 MM7150 3.0 MM7150 HID FUNCTIONS The MM7150 responds to the standard HID protocol for sensors when used over I2C, defined in References [1] and [2]. The hierarchy of descriptors used in the HID protocol is as follows: The following sections described the descriptors required for communicating with the MM7150: 3.1 HID Descriptor TABLE 3-1: HID DESCRIPTOR FORMAT (I2C) Field Description Size Value 0x001E wHIDDescLength Length of HID Descriptor UINT 16 bcdVersion Version compliance. Compliant with Version 1.00 UINT 16 0x0100 wReportDescLength Report Descriptor Length (3213 bytes) UINT 16 0x0C8D wReportDescRegister Identifier to read Report Descriptor UINT 16 0x0002 wInputRegister Identifier to read Input Report UINT 16 0x0003 wMaxInputLength Input Report is 13 Bytes + 2 Bytes length field UINT 16 0x000D wOutputRegistert Identifier to read Output Report UINT 16 0x0000 wMaxOutputLength No Output Report UINT 16 0x0000 wCommandRegister Identifier for Command Register UINT 16 0x0005 wDataRegister Identifier for Data Register UINT 16 0x0006 wVendorID Vendor ID UINT 16 0x04D8 wProductID Product ID UINT 16 0x0F01 wVersionID Version UINT 16 0x7150 RESERVED Reserved UINT 32 0x0 3.2 Report Descriptors Report descriptors are composed of pieces of information. Each piece of information is called an Item. The HID class driver contains a parser used to analyze items found in the Report descriptor. The parser extracts information from the descriptor in a linear fashion. The parser collects the state of each known item as it walks through the descriptor, and stores them in an item state table. The item state table contains the state of individual items. From the parser's point of view, a HID class device looks like the following. DS00001888B-page 8 2015 - 2016 Microchip Technology Inc. MM7150 The Report descriptor is unlike other descriptors in that it is not simply a table of values. The length and content of a Report descriptor vary depending on the number of data fields required for the device’s report or reports. The Report descriptor is made up of items that provide information about the device. The HID report for each sensor has two sections Feature Report and Input Report. The feature report for all the sensors is same. The following sections describe the Feature Report and all Input Reports returned by the Motion Module. 2015 - 2016 Microchip Technology Inc. DS00001888B-page 9 MM7150 3.2.1 FEATURE REPORT TABLE 3-2: FEATURE REPORT FORMAT Field ucReportID Description Size Report ID UINT 8 ucConnectionType Connection Type UINT 8 ucReportingState Reporting State UINT 8 ucPowerState Power On State UINT 8 ucSensorState Sensor State UINT 8 uIReportInterval Reporting Interval UINT 16 usAccuracy Accuracy UINT 16 usResolution Resolution UINT 16 usChangeSensitivity Change Sensitivity UINT 16 sMaximum Maximum range INT 16 sMinimum Minimum range INT 16 minimumReportInterval Minimum report interval supported UINT16 sensorDesc[6] Sensor description, initialized “MCHPSF” 3.2.2 INT16 3D ACCELEROMETER INPUT REPORT TABLE 3-3: 3D ACCELEROMETER REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucSensorState Sensor State UINT 8 ucEventType Event Type UINT 8 sAccelXValue Accelerometer X axis value INT 16 sAccelYValue Accelerometer Y axis value INT 16 sAccelZValue Accelerometer Z axis value INT 16 ucShakeDetectState Shake event detection UINT 8 3.2.3 COMPASS INPUT REPORT TABLE 3-4: COMPASS REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucSensorState Sensor State UINT 8 ucEventType Event Type UINT 8 sHeadingCompensatedMagneticNorthValue Magnetic north value INT 16 sFluxXValue Magnetic field strength, X axis value INT16 sFluxYValue Magnetic field strength, Y axis value INT16 sFluxZValue Magnetic field strength, Z axis value INT16 DS00001888B-page 10 2015 - 2016 Microchip Technology Inc. MM7150 3.2.4 3D GYROSCOPE INPUT REPORT TABLE 3-5: 3D GYROSCOPE REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucSensorState Sensor State UINT 8 ucEventType Event Type UINT 8 sGyroXValue Gyroscope X axis value INT 16 sGyroYValue Gyroscope Y axis value INT 16 sGyroZValue Gyroscope Z axis value INT 16 ucShakeDetectState Shake event detection UINT 8 3.2.5 INCLINOMETER INPUT REPORT TABLE 3-6: INCLINOMETER REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucSensorState Sensor State UINT 8 ucEventType Event Type UINT 8 sIncXValue Inclinometer X axis values INT 16 sIncYValue Inclinometer Y axis value INT 16 sIncZValue Inclinometer Z axis value INT 16 3.2.6 ORIENTATION INPUT REPORT TABLE 3-7: ORIENTATION REPORT FORMAT Field Description Size ucReportID Report ID UINT 8 ucSensorState Sensor State UINT 8 ucEventType Event Type UINT 8 sOriXValue Orientation X axis value INT 16 sOriYValue Orientation Y axis value INT 16 sOriZValue Orientation Z axis value INT 16 sOriWValue Orientation W axis value INT 16 2015 - 2016 Microchip Technology Inc. DS00001888B-page 11 MM7150 4.0 MM7150 HOST INTERFACE 4.1 I2C The MM7150 can be connected to a host via the I2C interface. The I2C interface is compliant with the I2C standard described in [4], at speeds up to 400KHz. Above the transport layer, the protocol used by the MM7150 is the same HID protocol used when communicating over USB. The mapping of HID over I2C is defined in Reference [3]. The protocol and the interface, taken together, are compliant with Windows 8/8.1 certification. DS00001888B-page 12 2015 - 2016 Microchip Technology Inc. MM7150 5.0 MM7150 FIRMWARE UPDATE The firmware in the MM7150 Module may be updated at run time. See Reference [5.] for details. 2015 - 2016 Microchip Technology Inc. DS00001888B-page 13 MM7150 6.0 1. 2. 3. 4. 5. MM7150 REFERENCES USB-Sig, “Device Class Definition for Human Interface Devices (HID). Firmware Specification”, Version 1.11, 6/27/01 USB-Sig, “HID Usage Table Sensor Page”, Request HUTRR39, http://www.usb.org/developers/hidpage/HUTRR39b.pdf Microsoft Corporation, “HID Over I2C Protocol Specification: Device Side”, version 1.00, 04/24/2012 NXP Corporation, “I2C-bus Specification and User Manual”, Rev. 6, 04/04/2014 Microchip Technology Inc., “MM7150 Motion Module User's Guide”, 2014 DS00001888B-page 14 2015 - 2016 Microchip Technology Inc. MM7150 7.0 MM7150 PERFORMANCE TABLE 7-1: PERFORMANCE PARAMETERS Parameter Typical Accelerometer Range ±2G Resolution 0.98mG Accuracy ±40mG Magnetometer Range X,Y: ±1300μT Z: ±2500μT Resolution 0.3μT Heading Accuracy ±3° Compass Range 0° to 360° Resolution 1° Accuracy ±10° Gyroscope Range ±2000°/s Resolution 0.061°/s Accuracy ±5°/s Inclinometer Range: Pitch -180° to +180° Range: Roll -90° to +90° Range: Yaw 0° to +360° Resolution 1° Accuracy ±5° Orientation - Quaternion Range ±1.0 Resolution 0.001 Accuracy 2015 - 2016 Microchip Technology Inc. ±5° DS00001888B-page 15 MM7150 8.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the MM7150 electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the MM7150 devices are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. Absolute Maximum Ratings (See Note 1) Ambient temperature under bias (Commercial temperature range)............................................................ .0°C to +70°C Ambient temperature under bias (Industrial temperature range) ..............................................................-40°C to +85°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V Voltage on any pin that is not 5V tolerant, with respect to VSS (Note 3) ......................................... -0.3V to (VDD + 0.3V) Voltage on any 5V tolerant pin with respect to VSS when VDD 2.3V (Note 3) ........................................ -0.3V to +5.5V Voltage on any 5V tolerant pin with respect to VSS when VDD < 2.3V (Note 3) ........................................ -0.3V to +3.6V Maximum current out of VSS pin(s) .......................................................................................................................300 mA Maximum current into VDD pin(s) (Note 2)............................................................................................................300 mA Maximum output current sunk by any I/O pin..........................................................................................................15 mA Maximum output current sourced by any I/O pin.....................................................................................................15 mA Maximum current sunk by all ports........................................................................................................................200 mA Maximum current sourced by all ports (Note 2) ....................................................................................................200 mA Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2: Maximum allowable current is a function of device maximum power dissipation (see Table 8-2). 3: See the “Pin List” section for the 5V tolerant pins. DS00001888B-page 16 2015 - 2016 Microchip Technology Inc. MM7150 8.1 DC Characteristics TABLE 8-1: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C TA +70°C Industrial Operating temperature -40°C TA +85°C Param. Symbol No. Characteristics Min. Typ. Max. Units Conditions Operating Voltage DC10 VDD Supply Voltage (Note 2) 2.3 — 3.6 V DC12 VDR RAM Data Retention Voltage (Note 1) 1.75 — — V DC16 VPOR VDD Start Voltage to Ensure Internal Power-on Reset Signal 1.75 — 2.1 V DC17 SVDD VDD Rise Rate to Ensure Internal Power-on Reset Signal 0.00005 — 0.115 Note 1: 2: — — — V/s — This is the limit to which VDD can be lowered without losing RAM data. Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. Refer to parameter BO10 in Table 8-5 for BOR values. TABLE 8-2: DC CHARACTERISTICS: OPERATING/POWER-DOWN CURRENT DC CHARACTERISTICS Parameter Symbol No. Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C TA +70°C Industrial Operating temperature -40°C TA +85°C Typical Max. Units Conditions Operating/Power-Down Current (Note 1, 2) DC20 IDD 26.5 mA — DC30 IAVG 13.65 mA — DC40 IIDLE 2.5 mA — DC50 IPD 70 150 μA 0°C TA +70°C DC50 IPD 120 180 μA -40°C TA +85°C Note 1: 2: A device’s supply current is mainly a function of the operating voltage and frequency, as well as temperature. The current measurements are as follows: • Operating current (IDD): This is the peak active current value. • Average current (IAVG): This value represents an average current measurement of active and low power mode time intervals during operation measured over 1 second period. • Idle current (IIDLE) This is the average idle current value when no sensor is actively providing environmental changes (and the device is not in power-down mode). • Power-Down current (IPD): This value is the current measured in power-down mode. This is the sleep state entered when the Host issues the SET_POWER (Sleep) Command if the I2C host interface is used. Wakeup from power-down mode requires the HOST_TO_SH_WAKE pin if the I2C host interface is used. 2015 - 2016 Microchip Technology Inc. DS00001888B-page 17 MM7150 TABLE 8-3: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS DC CHARACTERISTICS Param. Symbol No. VIL Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C TA +70°C Industrial Operating temperature -40°C TA +85°C Characteristics Min. Typical(1) Max. Units Conditions Input Low Voltage DI10 I/O Pins VSS — 0.2 VDD V DI18 SDAx, SCLx VSS — 0.3 VDD V I2C disabled (Note 4) DI19 SDAx, SCLx VSS — 0.8 V I2C enabled (Note 4) 0.65 VDD — VDD V (Note 4,6) VIH Input High Voltage I/O Pins not 5V-tolerant(5) DI20 I/O Pins 5V-tolerant(5) 0.65 VDD — 5.5 V DI28 SDAx, SCLx 0.65 VDD — 5.5 V I2C disabled (Note 4,6) DI29 SDAx, SCLx 2.1 — 5.5 V I2C enabled, 2.3V VPIN 5.5 (Note 4,6) IIL Input Leakage Current (Note 3) DI50 I/O Ports — — +1 A VSS VPIN VDD, Pin at high-impedance DI55 MCLR#(2) — — +1 A VSS VPIN VDD Note 1: 2: 3: 4: 5: 6: Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The leakage current on the MCLR# pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. This parameter is characterized, but not tested in manufacturing. See the “Pin List” section for the 5V-tolerant pins. The VIH specifications are only in relation to externally applied inputs, and not with respect to the userselectable internal pull-ups. External open drain input signals utilizing the internal pull-ups of the device are ensured to be recognized only as a logic “high” internally to the device. For External “input” logic inputs that require a pull-up source, to ensure the minimum VIH of those components, it is recommended to use an external pull-up resistor rather than the internal pull-ups of the device. DS00001888B-page 18 2015 - 2016 Microchip Technology Inc. MM7150 TABLE 8-4: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C TA +70°C Industrial Operating temperature -40°C TA +85°C Param. Symbol DO10 Vol Characteristic Output Low Voltage Min. Typ. Max. Units Conditions — — 0.4 V IOL 10 mA, VDD = 3.3V 1.5(1) — — V IOH -14 mA, VDD = 3.3V (1) — — IOH -12 mA, VDD = 3.3V — — IOH -10 mA, VDD = 3.3V — — IOH -7 mA, VDD = 3.3V I/O Pins DO20 VOH Output High Voltage 2.0 I/O Pins 2.4 (1) 3.0 Note 1: Parameters are characterized, but not tested. TABLE 8-5: ELECTRICAL CHARACTERISTICS: BROWN-OUT RESET (BOR) DC CHARACTERISTICS Param. Symbol No. BO10 Note 1: 2: Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C TA +70°C Industrial Operating temperature -40°C TA +85°C Characteristics BOR Event on VDD transition high-to-low(2) Vbor Min.(1) Typical 2.0 — Max. Units Conditions 2.3 V — Parameters are for design guidance only and are not tested in manufacturing. Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. TABLE 8-6: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Commercial Operating temperature 0°C TA +70°C Industrial Operating temperature -40°C TA +85°C Param. No. Symbol Characteristics Min. Typical Max. Units Comments D321 Cefc External Filter Capacitor Value 8 10 — F Capacitor must be low series resistance (1 ohm). Typical voltage on the VCAP pin is 1.8V. 2015 - 2016 Microchip Technology Inc. DS00001888B-page 19 MM7150 8.2 AC Characteristics and Timing Parameters The information contained in this section defines MM7150 AC characteristics and timing parameters. FIGURE 8-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2 VDD/2 CL Pin RL VSS CL Pin RL = 464 CL = 50 pF for all pins VSS TABLE 8-7: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS AC CHARACTERISTICS Param. Symbol No. Characteristics Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Min. Typical(1) Max. Units DO56 CIO All I/O pins — — 50 pF DO58 CB SCLx, SDAx — — 400 pF Note 1: Conditions In I2C™ mode Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. DS00001888B-page 20 2015 - 2016 Microchip Technology Inc. MM7150 FIGURE 8-2: POWER-ON RESET TIMING CHARACTERISTICS Internal Voltage Regulator Enabled Clock Sources = (FRC, FRCDIV, FRCDIV16, FRCPLL, EC, ECPLL and LPRC) VDD VPOR (TSYSDLY) SY02 Power-up Sequence (Note 2) CPU Starts Fetching Code SY00 (TPU) (Note 1) Internal Voltage Regulator Enabled Note 1: The power-up period will be extended if the power-up sequence completes before the device exits from BOR (VDD < VDDMIN). 2: Includes interval voltage regulator stabilization delay. FIGURE 8-3: EXTERNAL RESET TIMING CHARACTERISTICS Clock Sources = (FRC, FRCDIV, FRCDIV16, FRCPLL, EC, ECPLL and LPRC) MCLR# TMCLR (SY20) BOR TBOR (SY30) (TSYSDLY) SY02 Reset Sequence CPU Starts Fetching Code Clock Sources = (HS, HSPLL, XT, XTPLL and SOSC) 2015 - 2016 Microchip Technology Inc. (TSYSDLY) SY02 DS00001888B-page 21 MM7150 TABLE 8-8: RESETS TIMING AC CHARACTERISTICS Param. Symbol No. Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Characteristics(1) Min. Typical(2) Max. Units Conditions SY00 TPU Power-up Period Internal Voltage Regulator Enabled — 400 600 s — SY02 Tsysdly System Delay Period: Time Required to Reload Device Configuration Fuses plus SYSCLK(3) Delay before First instruction is Fetched. — s + 8 SYSCLK cycles — — — SY20 Tmclr MCLR# Pulse Width (low) 2 — — s — SY30 TBOR BOR Pulse Width (low) — 1 — s — Note 1: 2: 3: These parameters are characterized, but not tested in manufacturing. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Characterized by design but not tested. SYSCLK is 48MHz I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) FIGURE 8-4: SCLx IS34 IS31 IS30 IS33 SDAx Stop Condition Start Condition Note: Refer to Figure 8-1 for load conditions. FIGURE 8-5: I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 IS21 IS11 IS10 SCLx IS30 IS26 IS31 IS25 IS33 SDAx In IS40 IS40 IS45 SDAx Out Note: Refer to Figure 8-1 for load conditions. DS00001888B-page 22 2015 - 2016 Microchip Technology Inc. MM7150 I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE) TABLE 8-9: AC CHARACTERISTICS Param. No. Symbol IS10 TLO:SCL IS11 THI:SCL Characteristics Clock Low Time Clock High Time Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated) Min. Max. Units 100 kHz mode 4.7 — s — 400 kHz mode 1.3 — s — 100 kHz mode 4.0 — s — 400 kHz mode 0.6 — s — 300 ns CB is specified to be from 10 to 400 pF IS20 TF:SCL SDAx and SCLx Fall Time 100 kHz mode — 400 kHz mode 20 + 0.1 CB 300 ns IS21 TR:SCL SDAx and SCLx Rise Time 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns IS25 TSU:DAT Data Input Setup Time 100 kHz mode 250 — ns 400 kHz mode 100 — ns IS26 THD:DAT Data Input Hold Time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 s 100 kHz mode 4700 — ns 400 kHz mode 600 — ns 100 kHz mode 4000 — ns 400 kHz mode 600 — ns 100 kHz mode 4000 — ns 400 kHz mode 600 — ns 100 kHz mode 4000 — ns 400 kHz mode 600 — ns 0 3500 ns 400 kHz mode 0 1000 ns 100 kHz mode 4.7 — s 400 kHz mode 1.3 — s — 400 pF IS30 TSU:STA Start Condition Setup Time IS31 THD:STA Start Condition Hold Time IS33 TSU:STO Stop Condition Setup Time IS34 THD:STO Stop Condition Hold Time IS40 TAA:SCL Output Valid from 100 kHz mode Clock IS45 TBF:SDA Bus Free Time IS50 CB Bus Capacitive Loading 2015 - 2016 Microchip Technology Inc. Conditions CB is specified to be from 10 to 400 pF — — Only relevant for Repeated Start condition After this period, the first clock pulse is generated — — — The amount of time the bus must be free before a new transmission can start — DS00001888B-page 23 MM7150 APPENDIX A: TABLE A-1: REVISION HISTORY REVISION HISTORY Revision DS00001888B (01-26-16) Section/Figure/Entry Industrial Temp Range Correction Added Industrial Temp Range to Data Sheet Updated IPD for Industrial Temp Range DS00001888A (02-05-15) DS00001888B-page 24 Initial Release 2015 - 2016 Microchip Technology Inc. MM7150 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support 2015 - 2016 Microchip Technology Inc. DS00001888B-page 25 MM7150 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.(1) X Device Series - Temperature Range XXX Sensor Fusion Firmware Device: MM7150(1) Temperature Range: Blank = Commercial (0°C to +70°C) I = Industrial (-40°C to +85°C) Sensor Fusion Firmware: AB1 Example: a) b) MM7150-AB1, Bosch 9-axis sensor fusion, Commercial Temperature MM7150I-AB1, Bosch 9-axis sensor fusion., Industrial Temperature Note 1: DS00001888B-page 26 = Bosch 9-axis Sensor Fusion These products meet the halogen maximum concentration values per IEC61249-2-21. All package options are lead-free and RoHS compliant. For RoHS compliance and environmental information, please visit http://www.microchip.com/pagehandler/enus/aboutus/ehs.html. 2015 - 2016 Microchip Technology Inc. MM7150 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015 - 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 9781522402169 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2015 - 2016 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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