Nell MTP300 High surge current capability Datasheet

MTP300 Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
Three-Phase Bridge Rectifier, 300A
MTP30008 Thru MTP30018
51.00
4-ø6.50
~
67.0
52.50
~
33.50
~
-
+
51.00
94.00
108.00
42.0
3-M6 Screw
7.5
32.5
2-M8 Screw
FEATURES
UL recognition file number E320098
Typical IR less than 5.0 µA
High surge current capability
Low thermal resistance
Compliant to RoHS
Isolation voltage up to 2500V
TYPICAL APPLICATIONS
DC power supplies for apparatus device
Input rectifying power supplies for PWM converters
Field supplies for DC motors
PRIMARY CHARACTERRISTICS
Inverter welders
ADVANTAGE
International standard package
Epoxy meets UL 94 V-O flammability rating
Small volume, light weight
Weight: 600g (21.2 ozs)
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Page 1 of 3
IF(AV)
300A
V RRM
800V to 1800V
I FSM
4000A
IR
20 µA
VF
1.30V
T J max.
150ºC
MTP300 Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
MAJOR RATINGS AND CHARACTERISTICS (TA = 25°C unless otherwise noted)
MTP300
PARAMETER
UNIT
SYMBOL
08
10
12
16
18
Maximum repetitive peak reverse voltage
V RRM
800
1000
1200
1600
1800
V
Peak reverse non-repetitive voltage
V RSM
900
1100
1300
1700
1900
V
Maximum DC blocking voltage
V DC
800
1000
1200
1600
1800
V
Maximum average forward rectified output current at T C = 100°C
I F(AV)
300
A
I FSM
4000
A
Rating (non-repetitive, for t greater than 1 ms and less than 8.3 ms)
for fusing
I 2t
66.4
KA 2 s
RMS isolation voltage from case to leads
V ISO
2500
V
TJ
-40 to 150
ºC
T STG
-40 to 125
ºC
Peak forward surge current single sine-wave superimposed on
rated load
Operating junction storage temperature range
Storage temperature range
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
TEST
CONDITIONS
SYMBOL
Maximum instantaneous forward drop per diode
I F = 300A
VF
Maximum reverse DC current at rated DC blocking
T A = 25°C
voltage per diod
T A = 150°C
PARAMETER
MTP300
08
10
IR
12
UNIT
16
18
1.30
V
20
µA
10
mA
THERMAL AND MECHANICAC (TA = 25°C unless otherwise noted)
MTP300
TEST CONDITIONS
PARAMETER
UNIT
SYMBOL
08
Typical thermal resistance
junction to case
Mounting
torque
± 10 %
to heatsink M6
to terminal M8
Single-side heat dissipation, sine
half wave
R θJC (1)
12
0.08
A mounting compound is recommended
and the torque should be rechecked after
a period of 3 hours to allow for the spread
of the compound.
°C/W
Nm
Notes
(1) With heatsink, single side heat dissipation, half sine wave.
MTP
300
16
1
2
3
-
Module type: ”MTP” for 3Ø Brıdge
2
-
I F(AV) rating:"300" for 300 A
3
-
Voltage code:code x 100 = VRRM
1
18
10
600
Device code
16
4
Approximate weight
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10
Page 2 of 3
g
MTP300 Series
SEMICONDUCTOR
RoHS
RoHS
Nell High Power Products
Fig.1 Forward current vs. Forward voltage
Fig.2 Thermal lmpedance (junction to case)
0.08
2.5
Transient Thermal Impedance (°C/W)
Peak on-state voltage (V)
3
TJ=25°C
2.0
1.5
1.0
0.5
0.06
0.04
0.02
0
0
10
1000
100
0.001
0.01
Peak on-state current (A)
10
1
Time (s)
Fig.3 Power Consumption vs. Avergage Current
Fig.4 Case Temperature vs. O-state Average Current
1200
400
1050
On-state average current(A)
On-state Power consumption (W)
0.1
900
750
600
450
300
300
200
100
150
0
0
0
100
200
300
400
0
On-state average current (A)
30
60
90
120
150
180
Case Temperature (°C)
Fig.6 I2t characteristic
Fig.5 Forward Surge Current vs. Cycle
80
4000
3000
60
50
2
I t (KA S)
2000
40
2
Forward surge current (A)
70
1000
30
20
10
0
0
1
10
100
1
Time (ms)
Cycle @ 50Hz
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