Material Content Data Sheet Sales Product Name SAK-XC2321D-20F66V AA MA# MA000974554 Package PG-VQFN-48-54 Issued 29. August 2013 Weight* 126.41 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 5.350 4.23 0.018 0.01 0.071 0.06 558 1.412 1.12 11168 57.319 45.35 46.54 453452 465318 0.733 0.58 0.58 5802 5802 0.172 0.14 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 4.23 42325 42325 140 1359 7.271 5.75 49.810 39.40 45.29 394048 452929 2.340 1.85 1.85 18515 18515 0.656 0.52 0.52 5189 5189 0.288 0.23 0.966 0.76 57522 2282 0.99 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7640 9922 1000000