Product Guide HD_1105W Series, Dome Lens Type InGaN/SiC SMT LED ■ Features ■ Applications • High brightness (InGaN/SiC) die material • Available in green (525nm), bluish-green (505nm) • and blue (470nm) colors • Reflow and dip soldering compatible • Available for both standard and reverse mounting • 1000V minimum ESD protection • Automotive indicator display • Various other backlight uses ■ Outline Dimensions ■ Recommended Solder Pad on a Surface Mount 0.3 0.6 1.55 1.6 1.5 Anode Cathode Mark 2.1 + 0.05 1.5 HOLE Polarity Mark 0.6 R0.8 (2) (4.6) 0.5 1.6 3.2 0.5 1.6 ■ Recommended Solder Pad on a reverse mount (1.6) Cathode 2.3+0.05 PCB Unit: mm Tolerance + 0.1 ■ Electro-Optical Characteristics Part No. Material Emitted Lens Color Color Luminous Intensity IV MIN. HDG1105W InGaN/SiC HDC1105W InGaN/SiC Bluish-Green HDB1105W InGaN/SiC Units Green Blue (Ta=25°C) TYP. IF 70 140 10 Water 70 140 10 Clear 35 70 10 mcd mA Forward Voltage V Wavelength Peak λp TYP. Dominant λd TYP. 522 525 502 467 Spectral Line Half Width λ ∆λ TYP. Reverse Viewing Current IR Angle F IF TYP. MAX. IF MAX. VR 30 10 3.3 3.8 10 100 5 505 30 10 3.3 3.8 10 100 5 470 26 10 3.3 3.8 10 100 5 mA µA V nm mA V (2 θ 1/2) 40° Deg. ■ Absolute Maximum Ratings (Ta=25°C) Green Bluish-Green Blue Symbol HDG HDC HDB Pd 76 76 76 mW Forward Current IF 20 20 20 mA Peak Forward Current IFM 48 48 48 mA Reverse Voltage VR 5 5 5 V Item Power Dissipation Units Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -40 to +100 °C ∆IF 0.28 (DC) 0.69 (Pulse) mA/°C Derating* * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. Center Hole 4+0.1 3.5+0.05 2+0.05 ( φ 1.1) (1.85) φ 1.5 +0.1 0 Center Hole 8+0.2 (3.5) Quantity on tape: 2000 pieces per reel 2 + 0.05 ( φ 1.1) (0.5) Center Hole Cathode (2.2) for Standard Mount Type (0.25) 1.75 +0.1 4+0.1 (0.25) 8+0.2 (1.8) 3.5 +0.05 1.75 + 0.1 4+0.1 φ 1.5 +0.1 0 ■ Taping Specifications for Reverse Mount Type Quantity on tape: 2000 pieces per reel (3.45) ■ Taping Specifications (2.1) 4+0.1 2+0.5 φ 21+0.8 +1 φ 60 -0 φ 13+0.2 φ 13+0.2 Direction to pull Cathode RR 9+0.3 11.4+1 ■ Operation Current Derating Chart (DC) +0 φ 180 3 Direction to pull TR ■ Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. DG, DC, DB, 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: Operation Heating 150 ~ LED Surface Temperature ■ Spatial Distribution °C 240 Pre-heating Temperature rise: 5°C/sec. Cooling: —5°C/sec. 120 0 60 to 120 sec. 5 sec. max 2. Cleaning: • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGHD1105W-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com