Material Content Data Sheet Sales Product Name TLE4209A MA# MA000982386 Package PG-DIP-8-4 Issued Weight* Construction Element Material Group Substances chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material inorganic material plastics plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black antimonytrioxide brominated resin epoxy resin silicondioxide tin silver epoxy resin silver wire encapsulation leadfinish plating glue *deviation 28. August 2013 519.10 mg CAS# if applicable Weight [mg] Average Mass [%] 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 1309-64-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 6.347 1.22 0.053 0.01 0.213 0.04 411 4.266 0.82 8219 173.237 33.37 34.24 333725 342458 0.611 0.12 0.12 1177 1177 1.622 0.31 3124 6.487 1.25 12496 6.487 1.25 12496 66.487 12.81 128082 243.246 46.87 62.49 468591 624789 7.496 1.44 1.44 14440 14440 0.832 0.16 0.16 1603 1603 0.515 0.10 1.202 0.23 Sum [%] Average Mass [ppm] Sum [ppm] 1.22 12226 12226 103 992 0.33 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2315 3307 1000000