NSC LM7171BIMNOPB Lm7171 very high speed, high output current, voltage feedback amplifier Datasheet

LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
LM7171 Very High Speed, High Output Current, Voltage Feedback Amplifier
Check for Samples: LM7171
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
•
•
The LM7171 is a high speed voltage feedback
amplifier that has the slewing characteristic of a
current feedback amplifier; yet it can be used in all
traditional voltage feedback amplifier configurations.
The LM7171 is stable for gains as low as +2 or −1. It
provides a very high slew rate at 4100V/μs and a
wide unity-gain bandwidth of 200 MHz while
consuming only 6.5 mA of supply current. It is ideal
for video and high speed signal processing
applications such as HDSL and pulse amplifiers. With
100 mA output current, the LM7171 can be used for
video distribution, as a transformer driver or as a
laser diode driver.
1
23
(Typical Unless Otherwise Noted)
Easy-to-Use Voltage Feedback Topology
Very High Slew Rate: 4100 V/μs
Wide Unity-Gain Bandwidth: 200 MHz
−3 dB Frequency @ AV = +2: 220 MHz
Low Supply Current: 6.5 mA
High Open Loop Gain: 85 dB
High Output Current: 100 mA
Differential Gain and Phase: 0.01%, 0.02°
Specified for ±15V and ±5V Operation
APPLICATIONS
•
•
•
•
•
•
•
•
HDSL and ADSL Drivers
Multimedia Broadcast Systems
Professional Video Cameras
Video Amplifiers
Copiers/Scanners/Fax
HDTV Amplifiers
Pulse Amplifiers and Peak Detectors
CATV/Fiber Optics Signal Processing
Operation on ±15V power supplies allows for large
signal swings and provides greater dynamic range
and signal-to-noise ratio. The LM7171 offers low
SFDR and THD, ideal for ADC/DAC systems. In
addition, the LM7171 is specified for ±5V operation
for portable applications.
The LM7171 is built on TI's advanced VIP™ III
(Vertically integrated PNP) complementary bipolar
process.
Typical Performance
Figure 1. Large Signal Pulse Response
AV = +2, VS = ±15V
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
VIP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
ESD Tolerance
(1)
(2)
2.5 kV
Supply Voltage (V+–V−)
Differential Input Voltage
36V
(3)
Output Short Circuit to Ground
±10V
(4)
Continuous
−65°C to +150°C
Storage Temperature Range
Maximum Junction Temperature
(1)
(2)
(3)
(4)
(5)
(5)
150°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not specified. For ensured specifications and the test
conditions, see the Electrical Characteristics.
Human body model, 1.5 kΩ in series with 100 pF.
Input differential voltage is applied at VS = ±15V.
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX)–TA)/θJA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings
(1)
5.5V ≤ VS ≤ 36V
Supply Voltage
Junction Temperature Range
−40°C ≤ TJ ≤ +85°C
LM7171AI, LM7171BI
Thermal Resistance (θJA)
(1)
2
8-Pin PDIP
108°C/W
8-Pin SOIC
172°C/W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not specified. For ensured specifications and the test
conditions, see the Electrical Characteristics.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
±15V DC Electrical Characteristics
Unless otherwise noted, all limits are specified for TJ = 25°C, V+ = +15V, V− = −15V, VCM = 0V, and RL = 1 kΩ. Boldface
limits apply at the temperature extremes
Symbol
VOS
Parameter
Conditions
Input Offset Voltage
Typ
(1)
0.2
TC VOS
Input Offset Voltage Average
Drift
35
IB
Input Bias Current
2.7
IOS
Input Offset Current
RIN
Input Resistance
RO
Open Loop Output
Resistance
CMRR
Common Mode Rejection
Ratio
PSRR
0.1
40
Differential Mode
3.3
VCM = ±10V
Power Supply Rejection Ratio VS = ±15V to ±5V
Input Common-Mode Voltage
Range
AV
Large Signal Voltage Gain
(3)
Output Swing
CMRR > 60 dB
RL = 1 kΩ
105
90
85
RL = 100Ω
81
RL = 1 kΩ
13.3
RL = 100Ω
Output Current (Open Loop)
(4)
Units
1
3
mV
4
7
max
μV/°C
10
10
μA
12
12
max
4
4
μA
6
6
max
MΩ
Ω
85
75
dB
80
70
min
85
75
dB
80
70
min
V
80
75
dB
75
70
min
75
70
dB
70
66
min
13
13
V
12.7
12.7
min
−13
−13
V
−12.7
−12.7
max
11.8
10.5
10.5
V
9.5
9.5
min
−10.5
−9.5
−9.5
V
−9
−9
max
105
105
mA
95
95
min
95
95
mA
90
90
max
Sourcing, RL = 100Ω
118
Sinking, RL = 100Ω
105
Output Current (in Linear
Region)
Sourcing, RL = 100Ω
100
Sinking, RL = 100Ω
100
ISC
Output Short Circuit Current
Sourcing
140
Sinking
135
IS
Supply Current
(4)
Limit (2)
±13.35
−13.2
(1)
(2)
(3)
LM7171BI
Limit (2)
15
VCM
VO
Common Mode
LM7171AI
6.5
mA
mA
8.5
8.5
mA
9.5
9.5
max
Typical values represent the most likely parametric norm.
All limits are specified by testing or statistical analysis.
Large signal voltage gain is the total output swing divided by the input signal required to produce that swing. For VS = ±15V, VOUT =
±5V. For VS = ±5V, VOUT = ±1V.
The open loop output current is specified, by the measurement of the open loop output voltage swing, using 100Ω output load.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
3
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
±15V AC Electrical Characteristics
Unless otherwise noted, TJ = 25°C, V+ = +15V, V− = −15V, VCM = 0V, and RL = 1 kΩ.
Symbol
SR
Parameter
Slew Rate
Conditions
(3)
AV = +2, VIN = 13 VPP
4100
AV = +2, VIN = 10 VPP
3100
Unity-Gain Bandwidth
−3 dB Frequency
Typ (1)
AV = +2
LM7171AI
Limit
(2)
LM7171BI
Limit
Units
(2)
V/μs
200
MHz
220
MHz
50
Deg
φm
Phase Margin
ts
Settling Time (0.1%)
AV = −1, VO = ±5V
RL = 500Ω
42
ns
tp
Propagation Delay
AV = −2, VIN = ±5V,
RL = 500Ω
5
ns
AD
Differential Gain
0.01
%
φD
(4)
Differential Phase
(4)
Second Harmonic Distortion (5)
Third Harmonic Distortion
(5)
0.02
Deg
fIN = 10 kHz
−110
dBc
fIN = 5 MHz
−75
dBc
fIN = 10 kHz
−115
dBc
fIN = 5 MHz
−55
dBc
en
Input-Referred Voltage Noise
f = 10 kHz
14
nV/√Hz
in
Input-Referred Current Noise
f = 10 kHz
1.5
pA/√Hz
(1)
(2)
(3)
(4)
(5)
4
Typical values represent the most likely parametric norm.
All limits are specified by testing or statistical analysis.
Slew Rate is the average of the raising and falling slew rates.
Differential gain and phase are measured with AV = +2, VIN = 1 VPP at 3.58 MHz and both input and output 75Ω terminated.
Harmonics are measured with VIN = 1 VPP, AV = +2 and RL = 100Ω.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
±5V DC Electrical Characteristics
Unless otherwise noted, all limits are specified for TJ = 25°C, V+ = +5V, V− = −5V, VCM = 0V, and RL = 1 kΩ. Boldface limits
apply at the temperature extremes
Symbol
VOS
Parameter
Conditions
Input Offset Voltage
Typ (1)
0.3
TC VOS
Input Offset Voltage Average
Drift
35
IB
Input Bias Current
3.3
IOS
Input Offset Current
RIN
Input Resistance
0.1
Common Mode
40
Differential Mode
3.3
RO
Output Resistance
CMRR
Common Mode Rejection
Ratio
VCM = ±2.5V
104
PSRR
Power Supply Rejection Ratio
VS = ±15V to ±5V
90
VCM
Input Common-Mode Voltage
Range
CMRR > 60 dB
AV
Large Signal Voltage Gain
(3)
RL = 1 kΩ
Output Swing
RL = 1 kΩ
RL = 100Ω
Output Current (Open Loop)
(4)
Sourcing, RL = 100Ω
Sinking, RL = 100Ω
ISC
Output Short Circuit Current
IS
Supply Current
(4)
Limit (2)
Units
1.5
3.5
mV
4
7
max
μV/°C
10
10
μA
12
12
max
4
4
μA
6
6
max
MΩ
Ω
80
70
dB
75
65
min
85
75
dB
80
70
min
±3.2
78
V
75
70
dB
70
65
min
72
68
dB
67
63
min
3.2
3.2
V
3
3
min
−3.4
−3.2
−3.2
V
−3
−3
max
3.1
2.9
2.9
V
2.8
2.8
min
−2.9
−2.9
V
−2.8
−2.8
max
29
29
mA
28
28
min
29
29
mA
28
28
max
76
3.4
−3.0
(1)
(2)
(3)
LM7171BI
Limit (2)
15
RL = 100Ω
VO
LM7171AI
31
30
Sourcing
135
Sinking
100
6.2
mA
8
8
mA
9
9
max
Typical values represent the most likely parametric norm.
All limits are specified by testing or statistical analysis.
Large signal voltage gain is the total output swing divided by the input signal required to produce that swing. For VS = ±15V, VOUT =
±5V. For VS = ±5V, VOUT = ±1V.
The open loop output current is specified, by the measurement of the open loop output voltage swing, using 100Ω output load.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
5
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
±5V AC Electrical Characteristics
Unless otherwise noted, all limits are specified for TJ = 25°C, V+ = +5V, V− = −5V, VCM = 0V, and RL = 1 kΩ.
Symbol
SR
Parameter
Slew Rate
(3)
Conditions
AV = +2, VIN = 3.5 VPP
Unity-Gain Bandwidth
−3 dB Frequency
AV = +2
Typ (1)
LM7171AI
Limit
(2)
LM7171BI
Limit
Units
(2)
950
V/μs
125
MHz
140
MHz
φm
Phase Margin
57
Deg
ts
Settling Time (0.1%)
AV = −1, VO = ±1V,
RL = 500Ω
56
ns
tp
Propagation Delay
AV = −2, VIN = ±1V,
RL = 500Ω
6
ns
(4)
AD
Differential Gain
φD
Differential Phase
0.02
%
0.03
Deg
fIN = 10 kHz
−102
dBc
fIN = 5 MHz
−70
dBc
fIN = 10 kHz
−110
dBc
(5)
Second Harmonic Distortion (6)
Third Harmonic Distortion (6)
fIN = 5 MHz
−51
dBc
en
Input-Referred Voltage Noise
f = 10 kHz
14
nV/√Hz
in
Input-Referred Current Noise
f = 10 kHz
1.8
pA/√Hz
(1)
(2)
(3)
(4)
(5)
(6)
Typical values represent the most likely parametric norm.
All limits are specified by testing or statistical analysis.
Slew Rate is the average of the raising and falling slew rates.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not specified. For ensured specifications and the test
conditions, see the Electrical Characteristics.
Differential gain and phase are measured with AV = +2, VIN = 1 VPP at 3.58 MHz and both input and output 75Ω terminated.
Harmonics are measured with VIN = 1 VPP, AV = +2 and RL = 100Ω.
Connection Diagram
Figure 2. 8-Pin DIP/SOIC
Top View
6
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
Typical Performance Characteristics
unless otherwise noted, TA= 25°C
Supply Current
vs.
Supply Voltage
Supply Current
vs.
Temperature
Figure 3.
Figure 4.
Input Offset Voltage
vs.
Temperature
Input Bias Current
vs.
Temperature
Figure 5.
Figure 6.
Short Circuit Current
vs.
Temperature (Sourcing)
Short Circuit Current
vs.
Temperature (Sinking)
Figure 7.
Figure 8.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
7
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
unless otherwise noted, TA= 25°C
8
Output Voltage
vs.
Output Current
Output Voltage
vs.
Output Current
Figure 9.
Figure 10.
CMRR
vs.
Frequency
PSRR
vs.
Frequency
Figure 11.
Figure 12.
PSRR
vs.
Frequency
Open Loop Frequency Response
Figure 13.
Figure 14.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
unless otherwise noted, TA= 25°C
Open Loop Frequency Response
Gain-Bandwidth Product
vs.
Supply Voltage
Figure 15.
Figure 16.
Gain-Bandwidth Product
vs.
Load Capacitance
Large Signal Voltage Gain
vs.
Load
Figure 17.
Figure 18.
Large Signal Voltage Gain
vs.
Load
Input Voltage Noise
vs.
Frequency
Figure 19.
Figure 20.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
9
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
unless otherwise noted, TA= 25°C
10
Input Voltage Noise
vs.
Frequency
Input Current Noise
vs.
Frequency
Figure 21.
Figure 22.
Input Current Noise
vs.
Frequency
Slew Rate
vs.
Supply Voltage
Figure 23.
Figure 24.
Slew Rate
vs.
Input Voltage
Slew Rate
vs.
Load Capacitance
Figure 25.
Figure 26.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
unless otherwise noted, TA= 25°C
Open Loop Output Impedance
vs.
Frequency
Open Loop Output Impedance
vs
Frequency
Figure 27.
Figure 28.
Large Signal Pulse Response
AV = −1, VS = ±15V
Large Signal Pulse Response
AV = −1, VS = ±5V
Figure 29.
Figure 30.
Large Signal Pulse Response
AV = +2, VS = ±15V
Large Signal Pulse Response
AV = +2, VS = ±5V
Figure 31.
Figure 32.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
11
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
unless otherwise noted, TA= 25°C
12
Small Signal Pulse Response
AV = −1, VS = ±15V
Small Signal Pulse Response
AV = −1, VS = ±5V
Figure 33.
Figure 34.
Small Signal Pulse Response
AV = +2, VS = ±15V
Small Signal Pulse Response
AV = +2, VS = ±5V
Figure 35.
Figure 36.
Closed Loop Frequency Response
vs.
Supply Voltage
(AV = +2)
Closed Loop Frequency Response
vs.
Capacitive Load
(AV = +2)
Figure 37.
Figure 38.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
unless otherwise noted, TA= 25°C
Closed Loop Frequency Response
vs.
Capacitive Load
(AV = +2)
Closed Loop Frequency Response
vs.
Input Signal Level
(AV = +2)
Figure 39.
Figure 40.
Closed Loop Frequency Response
vs.
Input Signal Level
(AV = +2)
Closed Loop Frequency Response
vs.
Input Signal Level
(AV = +2)
Figure 41.
Figure 42.
Closed Loop Frequency Response
vs.
Input Signal Level
(AV = +2)
Closed Loop Frequency Response
vs.
Input Signal Level
(AV = +4)
Figure 43.
Figure 44.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
13
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
unless otherwise noted, TA= 25°C
(1)
14
Closed Loop Frequency Response
vs.
Input Signal Level
(AV = +4)
Closed Loop Frequency Response
vs.
Input Signal Level
(AV = +4)
Figure 45.
Figure 46.
Closed Loop Frequency Response
vs.
Input Signal Level
(AV = +4)
Total Harmonic Distortion
vs.
Frequency (1)
Figure 47.
Figure 48.
Total Harmonic Distortion
vs.
Frequency (1)
Undistorted Output Swing
vs.
Frequency
Figure 49.
Figure 50.
The THD measurement at low frequency is limited by the test instrument.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
unless otherwise noted, TA= 25°C
Undistorted Output Swing
vs.
Frequency
Undistorted Output Swing
vs.
Frequency
Figure 51.
Figure 52.
Harmonic Distortion
vs.
Frequency (2)
Harmonic Distortion
vs.
Frequency (2)
Figure 53.
Figure 54.
Maximum Power Dissipation
vs.
Ambient Temperature
Figure 55.
(2)
The THD measurement at low frequency is limited by the test instrument.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
15
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
Note: M1 and M2 are current mirrors.
Figure 56. Simplified Schematic Diagram
16
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
APPLICATION NOTES
PERFORMANCE DISCUSSION
The LM7171 is a very high speed, voltage feedback amplifier. It consumes only 6.5 mA supply current while
providing a unity-gain bandwidth of 200 MHz and a slew rate of 4100V/μs. It also has other great features such
as low differential gain and phase and high output current.
The LM7171 is a true voltage feedback amplifier. Unlike current feedback amplifiers (CFAs) with a low inverting
input impedance and a high non-inverting input impedance, both inputs of voltage feedback amplifiers (VFAs)
have high impedance nodes. The low impedance inverting input in CFAs and a feedback capacitor create an
additional pole that will lead to instability. As a result, CFAs cannot be used in traditional op amp circuits such as
photodiode amplifiers, I-to-V converters and integrators where a feedback capacitor is required.
CIRCUIT OPERATION
The class AB input stage in LM7171 is fully symmetrical and has a similar slewing characteristic to the current
feedback amplifiers. In the LM7171 Simplified Schematic, Q1 through Q4 form the equivalent of the current
feedback input buffer, RE the equivalent of the feedback resistor, and stage A buffers the inverting input. The
triple-buffered output stage isolates the gain stage from the load to provide low output impedance.
SLEW RATE CHARACTERISTIC
The slew rate of LM7171 is determined by the current available to charge and discharge an internal high
impedance node capacitor. This current is the differential input voltage divided by the total degeneration resistor
RE. Therefore, the slew rate is proportional to the input voltage level, and the higher slew rates are achievable in
the lower gain configurations. A curve of slew rate versus input voltage level is provided in the “Typical
Performance Characteristics”.
When a very fast large signal pulse is applied to the input of an amplifier, some overshoot or undershoot occurs.
By placing an external resistor such as 1 kΩ in series with the input of LM7171, the bandwidth is reduced to help
lower the overshoot.
SLEW RATE LIMITATION
If the amplifier's input signal has too large of an amplitude at too high of a frequency, the amplifier is said to be
slew rate limited; this can cause ringing in time domain and peaking in frequency domain at the output of the
amplifier.
In the “Typical Performance Characteristics” section, there are several curves of AV = +2 and AV = +4 versus
input signal levels. For the AV = +4 curves, no peaking is present and the LM7171 responds identically to the
different input signal levels of 30 mV, 100 mV and 300 mV.
For the AV = +2 curves, with slight peaking occurs. This peaking at high frequency (>100 MHz) is caused by a
large input signal at high enough frequency that exceeds the amplifier's slew rate. The peaking in frequency
response does not limit the pulse response in time domain, and the LM7171 is stable with noise gain of ≥+2.
LAYOUT CONSIDERATION
Printed Circuit Board and High Speed Op Amps
There are many things to consider when designing PC boards for high speed op amps. Without proper caution, it
is very easy to have excessive ringing, oscillation and other degraded AC performance in high speed circuits. As
a rule, the signal traces should be short and wide to provide low inductance and low impedance paths. Any
unused board space needs to be grounded to reduce stray signal pickup. Critical components should also be
grounded at a common point to eliminate voltage drop. Sockets add capacitance to the board and can affect high
frequency performance. It is better to solder the amplifier directly into the PC board without using any socket.
Using Probes
Active (FET) probes are ideal for taking high frequency measurements because they have wide bandwidth, high
input impedance and low input capacitance. However, the probe ground leads provide a long ground loop that
will produce errors in measurement. Instead, the probes can be grounded directly by removing the ground leads
and probe jackets and using scope probe jacks.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
17
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
Component Selection and Feedback Resistor
It is important in high speed applications to keep all component leads short. For discrete components, choose
carbon composition-type resistors and mica-type capacitors. Surface mount components are preferred over
discrete components for minimum inductive effect.
Large values of feedback resistors can couple with parasitic capacitance and cause undesirable effects such as
ringing or oscillation in high speed amplifiers. For LM7171, a feedback resistor of 510Ω gives optimal
performance.
COMPENSATION FOR INPUT CAPACITANCE
The combination of an amplifier's input capacitance with the gain setting resistors adds a pole that can cause
peaking or oscillation. To solve this problem, a feedback capacitor with a value
CF > (RG × CIN)/RF
(1)
can be used to cancel that pole. For LM7171, a feedback capacitor of 2 pF is recommended. Figure 57 illustrates
the compensation circuit.
Figure 57. Compensating for Input Capacitance
POWER SUPPLY BYPASSING
Bypassing the power supply is necessary to maintain low power supply impedance across frequency. Both
positive and negative power supplies should be bypassed individually by placing 0.01 μF ceramic capacitors
directly to power supply pins and 2.2 μF tantalum capacitors close to the power supply pins.
Figure 58. Power Supply Bypassing
TERMINATION
In high frequency applications, reflections occur if signals are not properly terminated. Figure 59 shows a
properly terminated signal while Figure 60 shows an improperly terminated signal.
18
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
Figure 59. Properly Terminated Signal
Figure 60. Improperly Terminated Signal
To minimize reflection, coaxial cable with matching characteristic impedance to the signal source should be
used. The other end of the cable should be terminated with the same value terminator or resistor. For the
commonly used cables, RG59 has 75Ω characteristic impedance, and RG58 has 50Ω characteristic impedance.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
19
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
DRIVING CAPACITIVE LOADS
Amplifiers driving capacitive loads can oscillate or have ringing at the output. To eliminate oscillation or reduce
ringing, an isolation resistor can be placed as shown below in Figure 61. The combination of the isolation resistor
and the load capacitor forms a pole to increase stability by adding more phase margin to the overall system. The
desired performance depends on the value of the isolation resistor; the bigger the isolation resistor, the more
damped the pulse response becomes. For LM7171, a 50Ω isolation resistor is recommended for initial
evaluation. Figure 62 shows the LM7171 driving a 150 pF load with the 50Ω isolation resistor.
Figure 61. Isolation Resistor Used
to Drive Capacitive Load
Figure 62. The LM7171 Driving a 150 pF Load
with a 50Ω Isolation Resistor
POWER DISSIPATION
The maximum power allowed to dissipate in a device is defined as:
PD = (TJ(MAX) − TA)/θJA
(2)
Where
PD is the power dissipation in a device
TJ(max) is the maximum junction temperature
TA is the ambient temperature
θJA is the thermal resistance of a particular package
20
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
For example, for the LM7171 in a SOIC-8 package, the maximum power dissipation at 25°C ambient
temperature is 730 mW.
Thermal resistance, θJA, depends on parameters such as die size, package size and package material. The
smaller the die size and package, the higher θJA becomes. The 8-pin DIP package has a lower thermal
resistance (108°C/W) than that of 8-pin SOIC (172°C/W). Therefore, for higher dissipation capability, use an 8pin DIP package.
The total power dissipated in a device can be calculated as:
PD = PQ + PL
(3)
PQ is the quiescent power dissipated in a device with no load connected at the output. PL is the power dissipated
in the device with a load connected at the output; it is not the power dissipated by the load.
Furthermore,
PQ:
PL:
= supply current × total supply voltage with no load
= output current × (voltage difference between supply voltage and output voltage of the same side of
supply voltage)
For example, the total power dissipated by the LM7171 with VS = ±15V and output voltage of 10V into 1 kΩ is
PD = PQ + PL
= (6.5 mA) × (30V) + (10 mA) × (15V − 10V)
= 195 mW + 50 mW
= 245 mW
Application Circuit
Figure 63. Fast Instrumentation Amplifier
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
21
LM7171
SNOS760B – MAY 1999 – REVISED MARCH 2013
www.ti.com
Figure 64. Multivibrator
Figure 65. Pulse Width Modulator
Figure 66. Video Line Driver
22
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
LM7171
www.ti.com
SNOS760B – MAY 1999 – REVISED MARCH 2013
REVISION HISTORY
Changes from Revision A (March 2013) to Revision B
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 22
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM7171
23
PACKAGE OPTION ADDENDUM
www.ti.com
27-Mar-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM7171AIM
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
LM71
71AIM
LM7171AIM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
-40 to 85
LM71
71AIM
LM7171AIMX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 85
LM71
71AIM
LM7171AIMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
-40 to 85
LM71
71AIM
LM7171BIM
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
LM71
71BIM
LM7171BIM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
-40 to 85
LM71
71BIM
LM7171BIMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
-40 to 85
LM71
71BIM
LM7171BIN
LIFEBUY
PDIP
P
8
40
TBD
Call TI
Call TI
-40 to 85
LM7171
BIN
LM7171BIN/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 85
LM7171
BIN
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
27-Mar-2014
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM7171AIMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM7171AIMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM7171BIMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM7171AIMX
SOIC
D
8
2500
367.0
367.0
35.0
LM7171AIMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM7171BIMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
Similar pages