Material Content Data Sheet Sales Product Name SGP10N60A MA# MA000694870 Package PG-TO220-3-1 Issued 29. August 2013 Weight* 2030.26 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus antimony silver tin iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-36-0 7440-22-4 7440-31-5 7439-89-6 7723-14-0 7440-50-8 2.461 0.12 0.816 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.12 1212 1212 402 0.245 0.01 815.335 40.18 40.23 401591 121 402115 1.292 0.06 0.06 637 637 5.965 0.29 2938 113.338 5.58 477.212 23.50 29.37 235050 293812 21.462 1.06 1.06 10571 10571 0.244 0.01 0.001 0.00 0.165 0.01 0.414 0.02 1.075 0.05 0.590 0.03 0.177 0.01 589.466 29.03 55824 120 0.01 1 204 0.08 530 2. 3. 87 29.07 290340 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 815 291 Important Remarks: 1. 120 81 290718 1000000