Vicor BCM6123S60E15A3M02 Fixed ratio dc-dc converter Datasheet

BCM® Bus Converter
BCM6123x60E15A3yzz
®
S
US
C
C
NRTL
US
Fixed Ratio DC-DC Converter
Features
Product Ratings
• Up to 130 A continuous output current
• 2870 W/in3 power density
VPRI = 54 V (36 – 60 V)
PSEC= up to 1950 W
VSEC = 13.5 V (9 – 15 V)
(NO LOAD)
K = 1/4
• 97.4% peak efficiency
• 2,250 Vdc isolation
• Parallel operation for multi-kW arrays
• OV, OC, UV, short circuit and thermal protection
• 6123 through-hole ChiP package
n 2.402” x 0.990” x 0.286”
Product Description
The VI Chip® Bus Converter (BCM®) is a high efficiency
Sine Amplitude Converter™ (SAC™), operating from a 36 to
60 VDC primary bus to deliver an isolated, ratiometric output
from 9 to 15 VDC.
(61.00 mm x 25.14 mm x 7.26 mm)
Typical Applications
The BCM6123x60E15A3yzz offers low noise, fast transient
response, and industry leading efficiency and power density. In
addition, it provides an AC impedance beyond the bandwidth
of most downstream regulators, allowing input capacitance
normally located at the input of a POL regulator to be located at
the primary side of the BCM module. With a primary to
secondary K factor of 1/4, that capacitance value can be
reduced by a factor of 16x, resulting in savings of board area,
material and total system cost.
• High End Computing Systems
• Automated Test Equipment
• Industrial Systems
• High Density Power Supplies
• Communications Systems
• Transportation
Leveraging the thermal and density benefits of Vicor’s ChiP
packaging technology, the BCM module offers flexible thermal
management options with very low top and bottom side
thermal impedances. Thermally-adept ChiP-based power
components, enable customers to achieve low cost power
system solutions with previously unattainable system size,
weight and efficiency attributes, quickly and predictably.
BCM® Bus Converter
Rev 1.1
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BCM6123x60E15A3yzz
Typical Application
BCM
TM
EN
enable/disable
switch
SW1
VAUX
F1
VPRI
+VPRI
+VSEC
–VPRI
–VSEC
CPRI
GND
POL
PRIMARY
SECONDARY
ISOLATION BOUNDRY
BCM6123x60E15A3yzz + Point of load
BCM® Bus Converter
Rev 1.1
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BCM6123x60E15A3yzz
Pin Configuration
1
TOP VIEW
2
+VSEC
A
A’ +VSEC
-VSEC1
B
B’ -VSEC2
-VSEC1
C
C’ -VSEC2
+VSEC
D
D’ +VSEC
+VSEC
E
E’
+VSEC
-VSEC1
F
F’
-VSEC2
-VSEC1
G
G’ -VSEC2
+VSEC
H
H’ +VSEC
+VPRI
I
I’
TM
+VPRI
J
J’
EN
+VPRI
K
K’ VAUX
+VPRI
L
L’
-VPRI
6123 ChiP Package
Pin Descriptions
Pin Number
Signal Name
Type
I1, J1, K1, L1
+VPRI
PRIMARY POWER
I’2
TM
OUTPUT
J’2
EN
INPUT
K’2
VAUX
OUTPUT
L’2
-VPRI
A1, D1, E1, H1,
A’2, D’2, E’2, H’2
B1, C1, F1, G1
B’2, C’2, F’2, G’2
+VSEC
-VSEC*
PRIMARY POWER
RETURN
SECONDARY
POWER
SECONDARY
POWER RETURN
Function
Positive primary transformer power terminal
Temperature Monitor; primary side referenced signals
Enables and disables power supply; primary side referenced signals
Auxilary Voltage Source; primary side referenced signals
Negative primary transformer power terminal
Positive secondary transformer power terminal
Negative secondary transformer power terminal
*For proper operation an external low impedance connection must be made between listed -VSEC1 and -VSEC2 terminals.
BCM® Bus Converter
Rev 1.1
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BCM6123x60E15A3yzz
Part Ordering Information
Product
Function
Package
Size
Package
Mounting
Max Primary
Input Voltage
Range
Identifier
Max
Secondary
Voltage
Secondary
Output
Current
Temperature
Grade
Option
BCM
6123
x
60
E
15
A3
y
zz
Bus Converter
Module
61 = L
23 = W
T = TH
36 – 60 V
15 V
No Load
00 = Analog Ctrl
S = SMT
60 V
130 A
T = -40°C – 125°C
01 = PMBus Ctrl
M = -55°C – 125°C
0R = Reversible Analog Ctrl
0P = Reversible PMBus Ctrl
All products shipped in JEDEC standard high profile (0.400” thick) trays (JEDEC Publication 95, Design Guide 4.10).
Standard Models
Product
Function
Package
Size
Package
Mounting
Max Primary
Input Voltage
Range
Identifier
Max
Secondary
Voltage
Secondary
Output
Current
Temperature
Grade
Option
BCM
6123
T
60
E
15
A3
T
00
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
+VPRI_DC to –VPRI_DC
Min
Max
Unit
-1
80
V
1
V/µs
20
V
4.6
V
5.5
V
4.6
V
VPRI_DC or VSEC_DC slew rate
(operational)
+VSEC_DC to –VSEC_DC
-1
TM to –VPRI_DC
EN to –VPRI_DC
-0.3
VAUX to –VPRI_DC
BCM® Bus Converter
Rev 1.1
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Electrical Specifications
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
60
V
14
V
General Powetrain PRIMARY to SECONDARY Specification (Forward Direction)
Primary Input Voltage range,
continuous
VPRI µController
PRI to SEC Input Quiescent Current
36
VPRI_DC
VPRI_DC voltage where µC is initialized,
(ie VAUX = Low, powertrain inactive)
VµC_ACTIVE
Disabled, EN Low, VPRI_DC = 54 V
IPRI_Q
5
TINTERNAL ≤ 100ºC
10
VPRI_DC = 54 V, TINTERNAL = 25ºC
PRI to SEC No Load Power
Dissipation
PRI to SEC Inrush Current Peak
7.5
VPRI_DC = 54 V
PPRI_NL
14.7
35.2
25
VPRI_DC = 36 V to 60 V
38
40
TINTERNAL ≤ 100ºC
DC Primary Input Current
Transformation Ratio
Secondary Output Power
(continuous)
Secondary Output Power (pulsed)
Secondary Output Current
(continuous)
Secondary Output Current (pulsed)
PRI to SEC Efficiency (ambient)
IPRI_IN_DC
PSEC_OUT_PULSE
1/4
ηAMB
1950
W
Specified at VPRI_DC = 60 V; 10 ms pulse, 25% Duty
cycle, PSEC_AVG = 50% rated PSEC_OUT_DC
2340
W
130
A
156
A
10 ms pulse, 25% Duty cycle, ISEC_OUT_AVG = 50% rated
ISEC_OUT_DC
VPRI_DC = 54 V, ISEC_OUT_DC = 130 A
96.2
VPRI_DC = 36 V to 60 V, ISEC_OUT_DC = 130 A
95.2
97
VPRI_DC = 54 V, ISEC_OUT_DC = 65 A
96.5
97.4
95.8
96.5
%
PRI to SEC Efficiency (hot)
ηHOT
VPRI_DC = 54 V, ISEC_OUT_DC = 130 A
PRI to SEC Efficiency
(over load range)
η20%
26 A < ISEC_OUT_DC < 130 A
90
RSEC_COLD
VPRI_DC = 54 V, ISEC_OUT_DC = 130 A, TINTERNAL = -40°C
1.2
1.5
1.8
RSEC_AMB
VPRI_DC = 54 V, ISEC_OUT_DC = 130 A
1.6
1.95
1.3
RSEC_HOT
VPRI_DC = 54 V, ISEC_OUT_DC = 130 A, TINTERNAL = 100°C
2.2
2.5
2.8
FSW
Frequency of the Output Voltage Ripple = 2x FSW
0.9
0.95
1.0
VSEC_OUT_PP
CSEC_EXT = 0 µF, ISEC_OUT_DC = 130 A, VPRI_DC = 54 V,
20 MHz BW
PRI to SEC Output Resistance
Switching Frequency
Secondary Output Voltage Ripple
Secondary Output Leads Inductance
(Parasitic)
%
%
120
TINTERNAL ≤ 100ºC
Primary Input Leads Inductance
(Parasitic)
A
V/V
Specified at VPRI_DC = 60 V
ISEC_OUT_DC
ISEC_OUT_PULSE
A
33
Primary to secondary, K = VSEC_DC / VPRI_DC, at no load
PSEC_OUT_DC
W
45
At ISEC_OUT_DC = 130 A, TINTERNAL ≤ 100ºC
K
21.6
VPRI_DC = 36 V to 60 V, TINTERNAL = 25 ºC
VPRI_DC = 60 V, CSEC_EXT = 1000 µF, RLOAD_SEC = 20% of
full load current
IPRI_INR_PK
mA
mΩ
MHz
mV
250
LPRI_IN_LEADS
Frequency 2.5 MHz (double switching frequency),
Simulated lead model
6.7
nH
LSEC_OUT_LEADS
Frequency 2.5 MHz (double switching frequency),
Simulated lead model
0.64
nH
BCM® Bus Converter
Rev 1.1
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BCM6123x60E15A3yzz
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
General Powetrain PRIMARY to SECONDARY Specification (Forward Direction) Cont.
Effective Primary Capacitance
(Internal)
Effective Secondary Capacitance
(Internal)
Effective Secondary Output
Capacitance (External)
Effective Secondary Output
Capacitance (External)
CPRI_INT
Effective Value at 54 VPRI_DC
11.2
µF
CSEC_INT
Effective Value at 15 VSEC_DC
140
µF
CSEC_OUT_EXT
Excessive capacitance may drive module into SC
protection
CSEC_OUT_AEXT
CSEC_OUT_AEXT Max = N * 0.5 * CSEC_OUT_EXT MAX, where
N = the number of units in parallel
1000
µF
560
ms
Protection PRIMARY to SECONDARY (Forward Direction)
Auto Restart Time
Primary Overvoltage Lockout
Threshold
Primary Overvoltage Recovery
Threshold
Primary Overvoltage Lockout
Hysteresis
Primary Overvoltage Lockout
Response Time
Primary Undervoltage Lockout
Threshold
Primary Undervoltage Recovery
Threshold
Primary Undervoltage Lockout
Hysteresis
Primary Undervoltage Lockout
Response Time
Primary Undervoltage Startup Delay
Primary Soft-Start Time
Secondary Output Overcurrent Trip
Threshold
Secondary Output Overcurrent
Response Time Constant
Secondary Output Short Circuit
Protection Trip Threshold
Secondary Output Short Circuit
Protection Response Time
Overtemperature Shutdown
Threshold
Overtemperature Recovery
Threshold
Undertemperature Shutdown
Threshold
Undertemperature Restart Time
tAUTO_RESTART
Startup into a persistent fault condition. Non-Latching
fault detection given VPRI_DC > VPRI_UVLO+
490
VPRI_OVLO+
64
66
68
V
VPRI_OVLO-
60
64
66
V
VPRI_OVLO_HYST
2
V
tPRI_OVLO
100
µs
VPRI_UVLO-
26
28
30
V
VPRI_UVLO+
28
30
32
V
VPRI_UVLO_HYST
2
V
tPRI_UVLO
100
µs
From VPRI_DC = VPRI_UVLO+ to powertrain active, EN
tPRI_UVLO+_DELAY floating, (i.e One time Startup delay form application
of VPRI_DC to VSEC_DC)
20
ms
From powertrain active. Fast Current limit protection
disabled during Soft-Start
1
ms
tPRI_SOFT-START
145
ISEC_OUT_OCP
tSEC_OUT_OCP
Effective internal RC filter
tOTP–
Temperature sensor located inside controller IC;
Protection not available for M-Grade units.
Startup into a persistent fault condition. Non-Latching
fault detection given VPRI_DC > VPRI_UVLO+
BCM® Bus Converter
Rev 1.1
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µs
125
105
tUTP_RESTART
A
1
Temperature sensor located inside controller IC
A
ms
195
tSEC_OUT_SCP
tUTP
225
3
ISEC_OUT_SCP
tOTP+
180
°C
110
3
115
°C
-45
°C
s
BCM6123x60E15A3yzz
Primary/Secondary
Output Power (W)
2400
2100
1800
1500
1200
900
600
300
0
35
45
55
65
75
85
95
105
115
125
Case Temperature (°C)
Top only at temperature
Leads at temperature
Top and leads at temperature
Top, leads and belly at temperature
2300
2200
2100
2000
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
Secondary Output Current (A)
Secondary Output Power (W)
Figure 1 — Specified thermal operating area
36
38
41
43
46
48
50
53
55
58
200
150
100
50
0
60
36
38
41
Input Voltage (V)
PSEC_OUT_DC
43
46
ISEC_OUT_DC
PSEC_OUT_PULSE
Figure 2 — Specified electrical operating area using rated RSEC_HOT
Secondary Output Capacitance
(% Rated CSEC_EXT_MAX)
48
50
53
Input Voltage (V)
110
100
90
80
70
60
50
40
30
20
10
0
0
20
40
60
80
Secondary Output Current (% ISEC_DC)
Figure 3 — Specified Primary start-up into load current and external capacitance
BCM® Bus Converter
Rev 1.1
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Page 7 of 23
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100
ISEC_OUT_PULSE
55
58
60
BCM6123x60E15A3yzz
Signal Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Temperature Monitor
• The TM pin is a standard analog I/O configured as an output from an internal µC.
• The TM pin monitors the internal temperature of the controller IC within an accuracy of ±5°C.
• µC 250 kHz PWM output internally pulled high to 3.3 V.
SIGNAL TYPE
STATE
Startup
ATTRIBUTE
Powertrain active to TM
time
TM Duty Cycle
SYMBOL
CONDITIONS / NOTES
TYP
MAX
100
tTM
18.18
TMPWM
TM Current
MIN
ITM
UNIT
µs
68.18
%
4
mA
Recommended External filtering
DIGITAL
OUTPUT
Regular
Operation
TM Capacitance (External)
CTM_EXT
Recommended External filtering
0.01
µF
TM Resistance (External)
RTM_EXT
Recommended External filtering
1
kΩ
ATM
10
mV / °C
VTM_AMB
1.27
V
Specifications using recommended filter
TM Gain
TM Voltage Reference
TM Voltage Ripple
VTM_PP
RTM_EXT = 1 K Ohm, CTM_EXT = 0.01 uF, VPRI_DC
= 54 V, ISEC_DC = 130 A
28
mV
TINTERNAL ≤ 100ºC
40
Enable / Disable Control
• The EN pin is a standard analog I/O configured as an input to an internal µC.
• It is internally pulled high to 3.3 V.
• When held low the BCM internal bias will be disabled and the powertrain will be inactive.
• In an array of BCMs, EN pins should be interconnected to synchronize startup and permit startup into full load conditions.
SIGNAL TYPE
STATE
Startup
ANALOG
INPUT
Regular
Operation
ATTRIBUTE
EN to Powertrain active
time
SYMBOL
tEN_START
EN Voltage Threshold
VEN_TH
EN Resistance (Internal)
REN_INT
EN Disable Threshold
CONDITIONS / NOTES
MIN
VPRI_DC > VPRI_UVLO+, EN held low both
conditions satisfied for T > tPRI_UVLO+_DELAY
TYP
MAX
250
µs
2.3
Internal pull up resistor
V
1.5
kΩ
1
VEN_DISABLE_TH
BCM® Bus Converter
Rev 1.1
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UNIT
V
BCM6123x60E15A3yzz
Signal Characteristics (Cont.)
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Auxiliary Voltage Source
• The VAUX pin is a standard analog I/O configured as an output from an internal µC.
• VAUX is internally connected to µC output as internally pulled high to a 3.3 V regulator with 2% tolerance, a 1% resistor of 1.5 kΩ.
• VAUX can be used as a "Ready to process full power" flag. This pin transitions VAUX voltage after a 2 ms delay from the start of powertrain activating,
signaling the end of softstart.
• VAUX can be used as "Fault flag". This pin is pulled low internally when a fault protection is detected.
SIGNAL TYPE
ANALOG
OUTPUT
STATE
ATTRIBUTE
SYMBOL
Startup
Powertrain active to VAUX
time
tVAUX
VAUX Voltage
VVAUX
VAUX Available Current
IVAUX
Regular
MIN
TYP
MAX
2
Powertrain active to VAUX High
2.8
UNIT
ms
3.3
V
4
mA
50
VAUX Voltage Ripple
VVAUX_PP
Operation
Fault
CONDITIONS / NOTES
VAUX Capacitance
(External)
CVAUX_EXT
VAUX Resistance (External)
RVAUX_EXT
VAUX Fault Response Time
tVAUX_FR
100
TINTERNAL ≤ 100ºC
0.01
VPRI_DC < VµC_ACTIVE
From fault to VVAUX = 2.8 V, CVAUX = 0 pF
BCM® Bus Converter
Rev 1.1
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1.5
mV
µF
kΩ
10
µs
VAUX
TM
OUTPUT
OUTPUT
OUTPUT
EN
+VPRI
+VSEC
BIDIR
INPUT
VµC_ACTIVE
BCM® Bus Converter
Rev 1.1
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STARTUP
tVAUX
tPRI_UVLO+_DELAY
VPRI_UVLO+
VPRI_OVLO+
VNOM
OVER VOLTAGE
VPRI_UVLO-
VPRI_OVLO-
up
ll u
N
ER
T
-O L P
PU
OV
R N NA
T
T
U
T TER
OU
PU E
U T IN
ZE RY ON
IN AG
I
P
L
RY L T
IN U X
IA DA N
IT ON UR MA VO
DC V A
N
I_
I
T
I
R
C
PR
VP N &
µc SE
E
tAUTO-RESTART
ENABLE CONTROL
OVER CURRENT
>
tPRI_UVLO+_DELAY
tSEC_OUT_SCP
SHUTDOWN
GE
NT
TA
H
L
E
W G
EV
VO
LO HI
S
T F
IT
D ED
RE
U
U
F
E
P
L
L
C
UT
IN N-O
IR
UL PUL
P
C
P
Y
R
T
IN
E
E
A R TU
BL ABL
OR
DC
M
I
I_
A
H
R
S
PR
VP
E N EN
RT
TA
BCM6123x60E15A3yzz
BCM Module Timing diagram
BCM6123x60E15A3yzz
High Level Functional State Diagram
Conditions that cause state transitions are shown along arrows. Sub-sequence activities listed inside the state bubbles.
Application
of input voltage to VPRI_DC
VμC_ACTIVE < VPRI_DC < VPRI_UVLO+
STANDBY SEQUENCE
STARTUP SEQUENCE
VPRI_DC > VPRI_UVLO+
TM Low
TM Low
EN High
EN High
VAUX Low
VAUX Low
Powertrain Stopped
Powertrain Stopped
ENABLE falling edge,
or OTP detected
tPRI_UVLO+_DELAY
expired
ONE TIME DELAY
INITIAL STARTUP
Input OVLO or UVLO,
Output OCP,
or UTP detected
Fault
Autorecovery
ENABLE falling edge,
or OTP detected
FAULT
SEQUENCE
Input OVLO or UVLO,
Output OCP,
or UTP detected
TM Low
EN High
VAUX Low
Powertrain Stopped
SUSTAINED
OPERATION
TM PWM
EN High
VAUX High
Powertrain Active
Short Circuit detected
BCM® Bus Converter
Rev 1.1
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Application Characteristics
24
22
20
18
16
14
12
10
8
6
39
41
44
47
49
52
55
57
60
98.0
97.5
97.0
96.5
96.0
-40
-20
0
Primary Input Voltage (V)
- 40°C
25°C
90°C
VPRI:
80
98
70
96
60
94
50
PD
40
90
30
88
20
86
10
84
0
0
13
26
39
52
65
78
91
104
117
PRI to SEC, Power Dissipation
PRI to SEC, Efficiency (%)
100
92
54 V
60
50
92
40
30
90
PD
88
10
86
0
84
13
26
60
50
PD
40
90
30
88
20
86
10
84
0
50
63
75
88
100
36 V
54 V
52
65
78
91
104
117
130
113
125
36 V
54 V
60 V
3
2
1
0
-40
-20
Secondary Output Current (A)
VPRI :
39
Figure 7 — Efficiency and power dissipation at TCASE = 25°C
PRI to SEC, Power Dissipation
PRI to SEC, Efficiency (%)
70
38
20
Load Current (A)
96
25
60 V
94
VPRI :
98
13
54 V
70
60 V
80
0
36 V
96
0
100
92
100
98
130
Figure 6 — Efficiency and power dissipation at TCASE = -40°C
94
80
80
PRI to SEC, Output Resistance (mΩ)
36 V
60
100
Secondary Output Current (A)
VPRI :
40
Figure 5 — Full load efficiency vs. temperature; VPRI_DC
Figure 4 — No load power dissipation vs. VPRI_DC
PRI to SEC, Efficiency (%)
TTOP SURFACE CASE:
20
Case Temperature (ºC)
PRI to SEC, Power Dissipation
36
PRI to SEC, Full Load Efficiency (%)
PRI to SEC, Power Dissipation (W)
Product is mounted and temperature controlled via top side cold plate, unless otherwise noted. All data presented in this section are collected data form
primary sourced units processing power in forward direction.See associated figures for general trend data.
0
20
40
60
Case Temperature (°C)
60 V
ISEC:
Figure 8 — Efficiency and power dissipation at TCASE = 80°C
130 A
Figure 9 — RSEC vs. temperature; Nominal VPRI_DC
ISEC_DC = 125 A at TCASE = 80°C
BCM® Bus Converter
Rev 1.1
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80
100
BCM6123x60E15A3yzz
Voltage Ripple (mVPK-PK)
200
175
150
125
100
75
50
25
0
0
13
26
39
52
65
78
91
104
117
130
Load Current (A)
VPRI:
54 V
Figure 10 — VSEC_OUT_PP vs. ISEC_DC ; No external CSEC_OUT_EXT. Board
mounted module, scope setting : 20 MHz analog BW
Figure 11 — Full load ripple, 2700 µF CPRI_IN_EXT; No external
CSEC_OUT_EXT. Board mounted module, scope setting :
20 MHz analog BW
Figure 12 — 0 A– 130 A transient response:
CPRI_IN_EXT = 2700 µF, no external CSEC_OUT_EXT
Figure 13 — 130 A – 0 A transient response:
CPRI_IN_EXT = 2700 µF, no external CSEC_OUT_EXT
Figure 14 — Start up from application of VPRI_DC= 54 V, 20% IOUT,
100% CSEC_OUT_EXT
Figure 15 — Start up from application of EN with pre-applied
VPRI_DC = 54 V, 20% ISEC_DC, 100% CSEC_OUT_EXT
BCM® Bus Converter
Rev 1.1
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BCM6123x60E15A3yzz
General Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Mechanical
Length
L
60.87 / [2.396] 61.00 / [2.402] 61.13 / [2.407]
mm/[in]
Width
W
24.76 / [0.975] 25.14 / [0.990] 25.52 / [1.005]
mm/[in]
Height
H
7.21 / [0.284]
mm/[in]
Volume
Vol
Weight
W
Lead finish
Without Heatsink
7.26 / [0.286]
7.31 / [0.288]
11.13 / [0.679]
cm3/[in3]
41 / [1.45]
g/[oz]
Nickel
0.51
2.03
Palladium
0.02
0.15
0.003
0.051
-40
125
Gold
µm
Thermal
Operating Temperature
TINTERNAL
BCM6123x60E15A3yzz (T-Grade)
Thermal Resistance Top Side
ΦINT-TOP
Estimated thermal resistance to maximum
temperature internal component from
isothermal top
1.26
°C/W
Estimated thermal resistance to
maximum temperature internal
component from isothermal leads
1.21
°C/W
1.03
°C/W
34
Ws/°C
Thermal Resistance Leads
Thermal Resistance Bottom Side
ΦINT-LEADS
Estimated thermal resistance to
ΦINT-BOTTOM maximum temperature internal
component from isothermal bottom
Thermal Capacity
°C
Assembly
Storage temperature
ESD Withstand
BCM6123x60E15A3yzz (T-Grade)
-55
ESDHBM
Human Body Model, "ESDA / JEDEC JDS-001-2012" Class I-C (1kV to < 2 kV)
ESDCDM
Charge Device Model, "JESD 22-C101-E" Class II (200 V to < 500 V)
BCM® Bus Converter
Rev 1.1
vicorpower.com
Page 14 of 23
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125
°C
BCM6123x60E15A3yzz
General Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Soldering[1]
Peak Temperature Top Case
135
°C
Safety
Isolation voltage / Dielectric test
VHIPOT
PRIMARY to SECONDARY
2,250
PRIMARY to CASE
2,250
SECONDARY to CASE
707
Isolation Capacitance
CPRI_SEC
Unpowered Unit
620
Insulation Resistance
RPRI_SEC
At 500 Vdc
10
MTBF
VDC
780
MIL-HDBK-217Plus Parts Count - 25°C
Ground Benign, Stationary, Indoors /
Computer
4.45
MHrs
Telcordia Issue 2 - Method I Case III; 25°C
Ground Benign, Controlled
7.01
MHrs
cURus "UL 60950-1"
CE Marked for Low Voltage Directive and RoHS Recast Directive, as applicable
[1]
pF
MΩ
cTÜVus "EN 60950-1"
Agency Approvals / Standards
940
Product is not intended for reflow solder attach.
BCM® Bus Converter
Rev 1.1
vicorpower.com
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VAUX
-VPRI
EN
1.5 kΩ
TM
BCM® Bus Converter
Rev 1.1
vicorpower.com
Page 16 of 23
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-Vcc
Startup /
Re-start Delay
Over-Temp
Under-Temp
Cntrl
SEPIC EN
Over Voltage
UnderVoltage
Cntrl
EN
TM PWM
Current Flow detection
+ Forward IIN sense
1.5 kΩ
3.3v
Linear
Regulator
Digital Controller
+VPRI
+Vcc
Current
Monitor
Differential Current
Sensing
Fast Current
Limit
Slow Current
Limit
Modulator
Temperature
Sensor
Soft-Start
On/Off
SEPIC
Q02
Q01
Primary Stage
Primary and
Secondary Gate
Drive Transformer
Cr
Lr
Q03
Q04
Q07
Q05
Secondary Stage
Half-Bridge Synchronous
Rectification
Q08
Q6
COUT2
COUT1
-VSEC2
+VSEC
-VSEC1
+VSEC
BCM6123x60E15A3yzz
BCM Module Block Diagram
Analog Controller
BCM6123x60E15A3yzz
Sine Amplitude Converter™ Point of Load Conversion
RSEC
1.96 mΩ
0.53 nH
ISEC
IOUT
LPRI_IN_LEADS = 6.7 nH
+
VVPRI
IN
CPRI_INT_ESR
0.75 mΩ
CPRI_INT C
IN
11.2 µF
RCIN
ROUT
IPRI_Q
IQ
270 mA
+
+
–
RCCSEC_INT_ESR
OUT
10 mΩ
V•I
1/4 • ISEC
LSEC_OUT_LEADS = 0.64 nH
+
60.4 µΩ
1/4 • VPRI
COUT
CSEC_INT
140 µF
–
VSEC
VOUT
K
–
–
Figure 16 — BCM module AC model
The Sine Amplitude Converter (SAC™) uses a high frequency resonant
tank to move energy from Primary to secondary and vice versa. (The
resonant tank is formed by Cr and leakage inductance Lr in the power
transformer windings as shown in the BCM module Block Diagram).
The resonant LC tank, operated at high frequency, is amplitude
modulated as a function of input voltage and output current. A small
amount of capacitance embedded in the primary and secondary stages
of the module is sufficient for full functionality and is key to achieving
high power density.
The BCM6123x60E15A3yzz SAC can be simplified into the preceeding
model.
The use of DC voltage transformation provides additional interesting
attributes. Assuming that RSEC = 0 Ω and IPRI_Q = 0 A, Eq. (3) now
becomes Eq. (1) and is essentially load independent, resistor R is now
placed in series with VIN.
RRIN
Vin
V
PRI
+
–
SAC™
SAC
1/4
KK==1/32
VSEC
Vout
At no load:
VSEC = VPRI • K
(1)
K represents the “turns ratio” of the SAC.
Rearranging Eq (1):
K=
Figure 17 — K = 1/4 Sine Amplitude Converter
with series input resistor
The relationship between VPRI and VSEC becomes:
VSEC
(2)
VPRI
VSEC = (VPRI – IPRI • RIN) • K
Substituting the simplified version of Eq. (4)
(IPRI_Q is assumed = 0 A) into Eq. (5) yields:
In the presence of load, VOUT is represented by:
VSEC = VPRI • K – ISEC • RSEC
(3)
VSEC = VPRI • K – ISEC • RIN • K2
and IOUT is represented by:
ISEC =
(5)
IPRI – IPRI_Q
K
(4)
ROUT represents the impedance of the SAC, and is a function of the
RDSON of the input and output MOSFETs and the winding resistance of
the power transformer. IQ represents the quiescent current of the SAC
control, gate drive circuitry, and core losses.
BCM® Bus Converter
Rev 1.1
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This is similar in form to Eq. (3), where RSEC is used to represent the
characteristic impedance of the SAC™. However, in this case a real R on
the primary side of the SAC is effectively scaled by K2 with respect
to the secondary.
Assuming that R = 1 Ω, the effective R as seen from the secondary side is
62.5 mΩ, with K = 1/4 .
A similar exercise should be performed with the additon of a capacitor
or shunt impedance at the primary input to the SAC. A switch in series
with VPRI is added to the circuit. This is depicted in Figure 18.
A solution for keeping the impedance of the SAC low involves
switching at a high frequency. This enables small magnetic components
because magnetizing currents remain low. Small magnetics mean small
path lengths for turns. Use of low loss core material at high frequencies
also reduces core losses.
SS
VVin
PRI
Low impedance is a key requirement for powering a high-current, lowvoltage load efficiently. A switching regulation stage should have
minimal impedance while simultaneously providing appropriate
filtering for any switched current. The use of a SAC between the
regulation stage and the point of load provides a dual benefit of scaling
down series impedance leading back to the source and scaling up shunt
capacitance or energy storage as a function of its K factor squared.
However, the benefits are not useful if the series impedance of the SAC
is too high. The impedance of the SAC must be low, i.e. well beyond the
crossover frequency of the system.
+
–
C
C
SAC™
SAC
K = 1/4
K = 1/32
VVout
SEC
The two main terms of power loss in the BCM module are:
n No load power dissipation (PPRI_NL): defined as the power
used to power up the module with an enabled powertrain
at no load.
n Resistive loss (RSEC): refers to the power loss across
the BCM® module modeled as pure resistive impedance.
Figure 18 — Sine Amplitude Converter with input capacitor
PDISSIPATED= PPRI_NL + PRSEC
A change in VPRI with the switch closed would result in a change in
capacitor current according to the following equation:
IC(t) = C
dVPRI
dt
(7)
Assume that with the capacitor charged to VPRI, the switch is opened
and the capacitor is discharged through the idealized SAC. In this case,
IC= ISEC • K
(8)
(10)
Therefore,
PSEC_OUT = PPRI_IN – PDISSIPATED = PRI_IN – PPRI_NL – PRSEC
The above relations can be combined to calculate the overall module
efficiency:
h =
PSEC_OUT
PIN
=
PPRI_IN – PPRI_NL – PRSEC
PIN
substituting Eq. (1) and (8) into Eq. (7) reveals:
ISEC
C •
=
K2
dISEC
dt
(9)
The equation in terms of the output has yielded a K2 scaling factor for
C, specified in the denominator of the equation.
A K factor less than unity results in an effectively larger capacitance on
the secondary output when expressed in terms of the input. With a
K= 1/4 as shown in Figure 18, C = 1 μF would appear as C = 16 μF when
viewed from the secondary.
(11)
=
VPRI • IPRI – PPRI_NL – (ISEC)2 • RSEC
VIN • IIN
= 1–
(
)
PPRI_NL + (ISEC)2 • RSEC
VPRI • IPRI
BCM® Bus Converter
Rev 1.1
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Input and Output Filter Design
Thermal Considerations
A major advantage of SAC™ systems versus conventional PWM
converters is that the transformer based SAC does not require external
filtering to function properly. The resonant LC tank, operated at
extreme high frequency, is amplitude modulated as a function of input
voltage and output current and efficiently transfers charge through the
isolation transformer. A small amount of capacitance embedded in the
primary and secondary stages of the module is sufficient for full
functionality and is key to achieving power density.
The ChiP package provides a high degree of flexibility in that it presents
three pathways to remove heat from internal power dissipating
components. Heat may be removed from the top surface, the bottom
surface and the leads. The extent to which these three surfaces are
cooled is a key component for determining the maximum power that is
available from a ChiP, as can be seen from Figure 1.
This paradigm shift requires system design to carefully evaluate
external filters in order to:
n Guarantee low source impedance:
To take full advantage of the BCM module’s dynamic
response, the impedance presented to its input terminals
must be low from DC to approximately 5 MHz. The
connection of the bus converter module to its power
source should be implemented with minimal distribution
inductance. If the interconnect inductance exceeds
100 nH, the input should be bypassed with a RC damper
to retain low source impedance and stable operation. With
an interconnect inductance of 200 nH, the RC damper
may be as high as 1 μF in series with 0.3 Ω. A single
electrolytic or equivalent low-Q capacitor may be used in
place of the series RC bypass.
Since the ChiP has a maximum internal temperature rating, it is
necessary to estimate this internal temperature based on a real thermal
solution. Given that there are three pathways to remove heat from the
ChiP, it is helpful to simplify the thermal solution into a roughly
equivalent circuit where power dissipation is modeled as a current
source, isothermal surface temperatures are represented as voltage
sources and the thermal resistances are represented as resistors. Figure
19 shows the “thermal circuit” for a VI Chip® BCM module 6123 in an
application where the top, bottom, and leads are cooled. In this case,
the BCM power dissipation is PDTOTAL and the three surface
temperatures are represented as TCASE_TOP, TCASE_BOTTOM, and TLEADS. This
thermal system can now be very easily analyzed using a SPICE
simulator with simple resistors, voltage sources, and a current source.
The results of the simulation would provide an estimate of heat flow
through the various pathways as well as internal temperature.
Thermal Resistance Top
n Further reduce input and/or output voltage ripple without
sacrificing dynamic response:
Given the wide bandwidth of the module, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the module multiplied by its
K factor.
n Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
induce stresses:
The module primary/secondary voltage ranges shall not be
exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even when disabled, the powertrain is exposed
to the applied voltage and power MOSFETs must
withstand it.
Total load capacitance at the output of the BCM module shall not
exceed the specified maximum. Owing to the wide bandwidth and low
output impedance of the module, low-frequency bypass capacitance
and significant energy storage may be more densely and efficiently
provided by adding capacitance at the input of the module. At
frequencies <500 kHz the module appears as an impedance of RSEC
between the source and load.
Within this frequency range, capacitance at the input appears as
effective capacitance on the output per the relationship
defined in Eq. (13).
CSEC_EXT =
CPRI_EXT
MAX INTERNAL TEMP
1.26°C / W
Thermal Resistance Bottom
Thermal Resistance Leads
1.03°C / W
TCASE_BOTTOM(°C)
Power Dissipation (W)
1.21°C / W
+
–
TLEADS(°C)
+
–
+
–
Figure 19 — Top case, Bottom case and leads thermal model
Alternatively, equations can be written around this circuit and
analyzed algebraically:
TINT – PD1 • 1.24 = TCASE_TOP
TINT – PD2 • 1.24 = TCASE_BOTTOM
TINT – PD3 • 7 = TLEADS
PDTOTAL = PD1+ PD2+ PD3
Where TINT represents the internal temperature and PD1, PD2, and PD3
represent the heat flow through the top side, bottom side, and leads
respectively.
Thermal Resistance Top
MAX INTERNAL TEMP
1.26°C / W
Thermal Resistance Bottom
Thermal Resistance Leads
1.03°C / W
1.21°C / W
Power Dissipation (W)
TCASE_BOTTOM(°C)
TLEADS(°C)
+
–
(13)
K2
This enables a reduction in the size and number of capacitors used in a
typical system.
TCASE_TOP(°C)
Figure 20 — Top case and leads thermal model
BCM® Bus Converter
Rev 1.1
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TCASE_TOP(°C)
+
–
BCM6123x60E15A3yzz
Figure 20 shows a scenario where there is no bottom side cooling. In
this case, the heat flow path to the bottom is left open and the
equations now simplify to:
ZIN_EQ1
Vin
BCM®1
TINT – PD1 • 1.24 = TCASE_TOP
ZOUT_EQ1
Vout
R0_1
TINT – PD3 • 7 = TLEADS
PDTOTAL = PD1 + PD3
ZIN_EQ2
BCM®2
ZOUT_EQ2
R0_2
+ DC
Thermal Resistance Top
Load
MAX INTERNAL TEMP
1.26°C / W
Thermal Resistance Bottom
Thermal Resistance Leads
1.03°C / W
1.21°C / W
Power Dissipation (W)
TCASE_BOTTOM(°C)
TLEADS(°C)
TCASE_TOP(°C)
+
–
ZIN_EQn
BCM®n
ZOUT_EQn
R0_n
Figure 21 — Top case thermal model
Figure 22 — BCM module array
Figure 21 shows a scenario where there is no bottom side and leads
cooling. In this case, the heat flow path to the bottom is left open and
the equations now simplify to:
TINT – PD1 • 1.24 = TCASE_TOP
PDTOTAL = PD1
Please note that Vicor has a suite of online tools, including a simulator
and thermal estimator which greatly simplify the task of determining
whether or not a BCM thermal configuration is valid for a given
condition. These tools can be found at:
http://www.vicorpower.com/powerbench.
Fuse Selection
In order to provide flexibility in configuring power systems
VI Chip® modules are not internally fused. Input line fusing
of VI Chip products is recommended at system level to provide thermal
protection in case of catastrophic failure.
The fuse shall be selected by closely matching system
requirements with the following characteristics:
n Current rating
(usually greater than maximum current of BCM module)
Current Sharing
n Maximum voltage rating
The performance of the SAC™ topology is based on efficient transfer of
energy through a transformer without the need of closed loop control.
For this reason, the transfer characteristic can be approximated by an
ideal transformer with a positive temperature coefficient series
resistance.
n Ambient temperature
(usually greater than the maximum possible input voltage)
This type of characteristic is close to the impedance characteristic of a
DC power distribution system both in dynamic (AC) behavior and for
steady state (DC) operation.
When multiple BCM modules of a given part number are connected in
an array they will inherently share the load current according to the
equivalent impedance divider that the system implements from the
power source to the point of load.
Some general recommendations to achieve matched array impedances
include:
n Nominal melting I2t
n Recommend fuse: ≤ 40 A Littelfuse 456 Series
Reverse Operation
BCM modules are capable of reverse power operation. Once the unit is
started, energy will be transferred from secondary back to the primary
whenever the secondary voltage exceeds VPRI • K. The module will
continue operation in this fashion for as long as no faults occur.
Transient operation in reverse is expected in cases where there is
significant energy storage on the output and transient voltages appear
on the input.
n Dedicate common copper planes within the PCB
to deliver and return the current to the modules.
n Provide as symmetric a PCB layout as possible among modules
n An input filter is required for an array of BCMs in order to
prevent circulating currents.
For further details see AN:016 Using BCM Bus Converters
in High Power Arrays.
BCM® Bus Converter
Rev 1.1
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Page 20 of 23
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BCM6123x60E15A3yzz
BCM Module Through Hole Package Mechanical Drawing and Recommended Land Pattern
12.57
.495
0
11.81
.465
2.03
.080
(9) PL.
0
2.03
.080
(9) PL.
11.43
.450
11.81
.465
25.14±.38
.990±.015
27.21
1.071
(2) PL.
21.94
.864
(2) PL.
17.09
.673
(2) PL.
30.50
1.201
12.52
.493
(2) PL.
7.94
.312
(2) PL.
0
1.49
.058
(2) PL.
0
61.00±.13
2.402±.005
1.02
.040
(3) PL.
1.02
.040
(3) PL.
0
0
3.37
.132
(2) PL.
6.76
.266
(2) PL.
18.05
.710
(2) PL.
20.84
.820
(2) PL.
27.55
1.085
(2) PL.
0
0
23.64
.931
(2) PL.
TOP VIEW (COMPONENT SIDE)
BOTTOM VIEW
.05 [.002]
NOTES:
1- RoHS COMPLIANT PER CST-0001 LATEST REVISION.
2- UNLESS SPECIFIED OTHERWISE, DIMENSIONS ARE MM / [INCH], TOLERANCE ± 0.127 / [0.005]
.41
.016
(24) PL.
21.94±.08
.864±.003
(2) PL.
12.52±.08
.493±.003
(2) PL.
6.76±.08
.266±.003
(2) PL.
2.54±.08
.100±.003
PLATED THRU
.38 [.015]
ANNULAR RING
(18) PL.
20.84±.08
.820±.003
(2) PL.
27.55±.08
1.085±.003
(2) PL.
0
+VSEC
+VSEC
-VSEC
-VSEC
-VSEC
-VSEC
+VSEC
+VSEC
+VSEC
+VSEC
-VSEC
-VSEC
-VSEC
-VSEC
+VSEC
+VSEC
+VPRI
TM
+VPRI
+VPRI
EN
VAUX
+VPRI
-VPRI
27.21±.08
1.071±.003
(2) PL.
17.09±.08
.673±.003
(2) PL.
7.94±.08
.312±.003
(2) PL.
0
1.49±.08
.058±.003
(2) PL.
1.52±.08
.060±.003
PLATED THRU
.25 [.010]
ANNULAR RING
(6) PL.
18.05±.08
.710±.003
(2) PL.
23.64±.08
.931±.003
(2) PL.
0
3.37±.08
.132±.003
(2) PL.
0
11.81±.08
.465±.003
4.17
.164
(24) PL.
11.81±.08
.465±.003
SEATING
PLANE
7.26±.05
.286±.002
RECOMMENDED HOLE PATTERN
(COMPONENT SIDE)
BCM® Bus Converter
Rev 1.1
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Revision History
Revision
Date
1.0
08/26/15
1.1
09/28/15
Description
Initial Release
Page Number(s)
n/a
Changed PRI to SEC Input Quiescent Current
Added certifications
BCM® Bus Converter
Rev 1.1
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1 & 15
BCM6123x60E15A3yzz
Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and
accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom
power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes no
representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make
changes to any products, specifications, and product descriptions at any time without notice. Information published by Vicor has been checked and
is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies. Testing and other quality controls are
used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
Specifications are subject to change without notice.
Vicor’s Standard Terms and Conditions
All sales are subject to Vicor’s Standard Terms and Conditions of Sale, which are available on Vicor’s webpage or upon request.
Product Warranty
In Vicor’s standard terms and conditions of sale, Vicor warrants that its products are free from non-conformity to its Standard Specifications (the
“Express Limited Warranty”). This warranty is extended only to the original Buyer for the period expiring two (2) years after the date of shipment
and is not transferable.
UNLESS OTHERWISE EXPRESSLY STATED IN A WRITTEN SALES AGREEMENT SIGNED BY A DULY AUTHORIZED VICOR SIGNATORY, VICOR DISCLAIMS
ALL REPRESENTATIONS, LIABILITIES, AND WARRANTIES OF ANY KIND (WHETHER ARISING BY IMPLICATION OR BY OPERATION OF LAW) WITH
RESPECT TO THE PRODUCTS, INCLUDING, WITHOUT LIMITATION, ANY WARRANTIES OR REPRESENTATIONS AS TO MERCHANTABILITY, FITNESS FOR
PARTICULAR PURPOSE, INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT, OR ANY OTHER MATTER.
This warranty does not extend to products subjected to misuse, accident, or improper application, maintenance, or storage. Vicor shall not be liable
for collateral or consequential damage. Vicor disclaims any and all liability arising out of the application or use of any product or circuit and assumes
no liability for applications assistance or buyer product design. Buyers are responsible for their products and applications using Vicor products and
components. Prior to using or distributing any products that include Vicor components, buyers should provide adequate design, testing and
operating safeguards.
Vicor will repair or replace defective products in accordance with its own best judgment. For service under this warranty, the buyer must contact
Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be
returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the
product was defective within the terms of this warranty.
Life Support Policy
VICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS
PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used herein, life support
devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform
when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the
user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or system or to affect its safety or effectiveness. Per Vicor Terms and Conditions of Sale, the user of Vicor products
and components in life support applications assumes all risks of such use and indemnifies Vicor against all liability and damages.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and pending patent applications) relating to the products described in this
data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property rights is granted by this document.
Interested parties should contact Vicor's Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
6,911,848; 6,930,893; 6,934,166; 7,145,786; 7,782,639; 8,427,269 and for use under 6,975,098 and 6,984,965.
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25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: [email protected]
Technical Support: [email protected]
BCM® Bus Converter
Rev 1.1
vicorpower.com
Page 23 of 23
09/2015
800 927.9474
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