DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 DS36C200 Dual High Speed Bi-Directional Differential Transceiver Check for Samples: DS36C200 FEATURES DESCRIPTION • • The DS36C200 is a dual transceiver device optimized for high data rate and low power applications. This device provides a single chip solution for a dual high speed bi-directional interface. Also, both control pins may be routed together for single bit control of datastreams. Both control pins are adjacent to each other for ease of routing them together. The DS36C200 is compatible with IEEE 1394 physical layer and may be used as an economical solution with some considerations. Please reference the application information on 1394 for more information. The device is in a 14-lead small outline package. The differential driver outputs provides low EMI with its low output swings typically 210 mV. The receiver offers ±100 mV threshold sensitivity, in addition to common-mode noise protection. 1 2 • • • • • • • Optimized for DSS to DVHS Interface Link Compatible IEEE 1394 Signaling Voltage Levels Operates Above 100 Mbps Bi-directional Transceivers 14-lead SOIC Package Ultra Low Power Dissipation ±100 mV Receiver Sensitivity Low Differential Output Swing Typical 210 mV High Impedance During Power Off Connection Diagram Note: * denotes active LOW pin Figure 1. SOIC Package See Package Number D (R-PDSO-G14) Functional Diagram 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS36C200 SNLS111D – JUNE 1998 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) −0.3V to +6V Supply Voltage (VCC) Enable Input Voltage −0.3V to (VCC + 0.3V) (DE, RE*) Voltage (DI/RO) −0.3V to +5.9V Voltage (DO/RI±) −0.3V to +5.9V Maximum Package Power Dissipation @+25°C M Package 1255 mW Derate M Package 10.04 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature Range (Soldering, 4 sec.) ESD Rating +260°C (3) ≥ 3.5 kV (HBM, 1.5 kΩ, 100 pF) (EIAJ, 0 Ω, 200 pF) (1) (2) (3) ≥ 300V “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. ESD Rating: HBM (1.5 kΩ, 100 pF) ≥ 3.5 kV EIAJ (0Ω, 200 pF) ≥ 300V Recommended Operating Conditions Supply Voltage (VCC) Receiver Input Voltage Min Typ Max Units +4.5 +5.0 +5.5 V 2.4 V 70 °C 0 Operating Free Air Temperature (TA) 2 0 Submit Documentation Feedback 25 Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C200 DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 Electrical Characteristics (1) (2) (3) Over supply voltage and operating temperature ranges, unless otherwise specified Symbol Parameter Conditions Pin Min Typ Max Units DO+, DO− 172 210 285 mV 0 4 35 mV DIFFERENTIAL DRIVER CHARACTERISTICS (RE* = VCC) VOD Output Differential Voltage ΔVOD VOD Magnitude Change RL = 55Ω, (Figure 2) VOH Output High Voltage VOL Output Low Voltage VOS Offset Voltage ΔVOS Offset Magnitude Change IOZD TRI-STATE Leakage IOXD Power-Off Leakage IOSD Output Short Circuit Current VOUT = 0V 1.36 V 1.15 V 1.0 1.25 1.6 V 0 5 25 mV VOUT = VCC or GND −10 ±1 +10 μA VOUT = 5.5V or GND, VCC = 0V −10 ±1 +10 μA −4 −9 mA +100 mV DIFFERENTIAL RECEIVER CHARACTERISTICS (DE = GND) VTH Input Threshold High VTL Input Threshold Low VCM = 0V to 2.3V IIN Input Current VIN = +2.4V or 0V VOH Output High Voltage IOH = −400 μA RI+, RI− RO −100 mV −10 ±1 +10 μA 3.8 4.9 V Inputs Open 3.8 4.9 V Inputs Terminated, Rt = 55Ω 3.8 4.9 V Inputs Shorted, VID = 0V 4.9 VOL Output Low Voltage IOL = 2.0 mA, VID = −200 mV 0.1 0.4 V IOSR Output Short Circuit Current VOUT = 0V −60 −100 mA 2.0 VCC V GND 0.8 V ±1 ±10 μA ±1 ±10 μA 3 7 mA RL = 55Ω, DE = RE* = VCC 11 17 mA DE = RE* = 0V 6 10 mA −15 V DEVICE CHARACTERISTICS VIH Input High Voltage VIL Input Low Voltage IIH Input High Current VIN = VCC or 2.4V IIL Input Low Current VIN = GND or 0.4V VCL Input Clamp Voltage ICL = −18 mA ICCD Power Supply Current No Load, DE = RE* = VCC ICCR (1) (2) (3) DI, DE RE* −1.5 VCC −0.8 V Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD and VID. All typicals are given for VCC = +5.0V and TA = +25°C. The DS36C200 is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C200 3 DS36C200 SNLS111D – JUNE 1998 – REVISED APRIL 2013 www.ti.com Switching Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified. Symbol Parameter (1) (2) Conditions Min Typ Max Units RL = 55Ω, CL = 10 pF (Figure 3 and Figure 4) 1.0 2.5 5.5 ns 1.0 2.6 5.5 ns DIFFERENTIAL DRIVER CHARACTERISTICS tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD – tPLHD| 0 0.1 2 ns tTLH Transition Time Low to High 0 0.5 2 ns tTHL Transition Time High to Low 0 0.5 2 ns tPHZ Disable Time High to Z 0.3 5 20 ns tPLZ Disable Time Low to Z 0.3 5 20 ns tPZH Enable Time Z to High 0.3 10 30 ns tPZL Enable Time Z to Low 0.3 10 30 ns 1.5 5 9 ns 1.5 4.6 9 ns RL = 55Ω (Figure 5 and Figure 6) DIFFERENTIAL RECEIVER CHARACTERISTICS tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD – tPLHD| 0 0.4 3 ns tr Rise Time 0 1.5 5 ns tf Fall Time 0 1.5 5 ns tPHZ Disable Time High to Z 1 5 20 ns tPLZ Disable Time Low to Z 1 5 20 ns tPZH Enable Time Z to High 0.3 10 30 ns tPZL Enable Time Z to Low 0.3 10 30 ns (1) (2) 4 CL = 10 pF, VID = 200 mV (Figure 7 and Figure 8) CL = 10 pF (Figure 9 and Figure 10) CL includes probe and fixture capacitance. Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr ≤ 1 ns, tf ≤ 1 ns (0%–100%). Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C200 DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION Figure 2. Differential Driver DC Test Circuit Figure 3. Differential Driver Propagation Delay and Transition Time Test Circuit Figure 4. Differential Driver Propagation Delay and Transition Time Waveforms Figure 5. Driver TRI-STATE Delay Test Circuit Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C200 5 DS36C200 SNLS111D – JUNE 1998 – REVISED APRIL 2013 www.ti.com Figure 6. Driver TRI-STATE Delay Waveforms Figure 7. Receiver Propagation Delay and Transition Time Test Circuit Figure 8. Receiver Propagation Delay and Transition Time Waveforms Figure 9. Receiver TRI-STATE Delay Test Circuit Figure 10. Receiver TRI-STATE Delay Waveforms 6 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C200 DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 APPLICATION INFORMATION TRUTH TABLES The DS36C200 has two enable pins DE and RE*, however, the driver and receiver should never be enabled simultaneously. Enabling both could cause multiple channel contention between the receiver output and the driving logic. It is recommended to route the enables together on the PC board. This will allow a single bit [DE/RE*] to control the chip. This DE/RE* bit toggles the DS36C200 between Receive mode and Transmit mode. When the bit is asserted HIGH the device is in Transmit mode. When the bit is asserted LOW the device is in Receive mode. The mode determines the function of the I/O pins: DI/RO, DO/RI+, and DO/RI−. Please note that some of the pins have been identified by its function in the corresponding mode in the three tables below. For example, in Transmit mode the DO/RI+ pin is identified as DO+. This was done for clarity in the tables only and should not be confused with the pin identification throughout the rest of this document. Also note that a logic low on the DE/RE* bit corresponds to a logic low on both the DE pin and the RE* pin. Similarly, a logic high on the DE/RE* bit corresponds to a logic high on both the DE pin and the RE* pin. Table 1. Receive Mode (1) Input(s) (1) Input/Output DE RE* [RI+] − [RI−] RO L L > +100 mV H L L < −100 mV L L L 100 mV > & > −100 mV X L H X Z H = Logic high level L = Logic low level X = Indeterminate state Z = High impedance state Table 2. Transmit Mode (1) Input(s) (1) Input/Output DE RE* H H H H H H L H DI DO+ DO− L L H H H L 2 > & > 0.8 X X X Z Z H = Logic high level L = Logic low level X = Indeterminate state Z = High impedance state Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C200 7 DS36C200 SNLS111D – JUNE 1998 – REVISED APRIL 2013 www.ti.com DEVICE PIN DESCRIPTIONS Pin# Name Mode Description (In mode only) 3 DE 1, 7 DI 10, 13 DO+ 11, 12 DO− 4 RE* Transmit Driver Enable: When asserted low driver is disabled. And when asserted high driver is enabled. TTL/CMOS driver input pins Non-inverting driver output pin Inverting driver output pin Receive Receiver Enable: When asserted low receiver is enabled. And when asserted high receiver is disabled. 1, 7 RO Receiver output pin 10, 13 RI+ Positive receiver input pin 11, 12 RI− 5 GND Transmit and Negative receiver input pin 2 VCC Receive 6, 8, 9, 14 NC Ground pin Positive power supply pin, +5V ± 10% No Connect IEEE 1394 The DS36C200 drives and receives IEEE 1394 physical layer signal levels. The current mode driver is capable of driving a 55Ω load with VOD between 172 mV and 285 mV. The DS36C200 is not designed to work with a link layer controller IC requiring full 1394 physical layer compliancy to the standard. No clock generator, no arbitration, and no encode/decode logic is provided with this device. For a 1394 link where speed sensing, bus arbitration, and other functions are not required, a controller and the DS36C200 will provide a cost effective, high speed dedicated link. This is shown in Figure 11. In applications that require fully compliant 1394 protocol, a link layer controller and physical layer controller will be required as shown in Figure 11. The physical layer controller supports up to three DC36C200 devices (not shown). The DS36C200 drivers are current mode drivers and intended to work with a two 110Ω termination resistors in parallel with each other. The termination resistors should match the characteristic impedance of the transmission media. The drivers are current mode devices therefore the resistors are required. Both resistors are required for half duplex operation and should be placed as close to the DO/RI+ and DO/RI− pins as possible at opposite ends of the bus. However, if your application only requires simplex operation, only one termination resistor is required. In addition, note the voltage levels will vary from those in the datasheet due to different loading. Also, AC or unterminated configurations are not used with this device. Multiple node configurations are possible as long as transmission line effects are taken into account. Discontinuities are caused by mid-bus stubs, connectors, and devices that affect signal integrity. The differential line driver is a balanced current source design. A current mode driver, generally speaking has a high output impedance and supplies a constant current for a range of loads (a voltage mode driver on the other hand supplies a constant voltage for a range of loads). Current is switched through the load in one direction to produce a logic state and in the other direction to produce the other logic state. The typical output current is mere 3.8 mA, a minimum of 3.1 mA, and a maximum of 5.2 mA. The current mode requires that a resistive termination be employed to terminate the signal and to complete the loop as shown in Figure 12. The 3.8 mA loop current will develop a differential voltage of 210 mV across the 55Ω termination resistor which the receiver detects with a 110 mV minimum differential noise margin neglecting resistive line losses (driven signal minus receiver threshold (210 mV – 100 mV = 110 mV)). The signal is centered around +1.2V (Driver Offset, VOS) with respect to ground as shown in Figure 8. The current mode driver provides substantial benefits over voltage mode drivers, such as an RS-422 driver. Its quiescent current remains relatively flat versus switching frequency. Whereas the RS-422 voltage mode driver increases exponentially in most case between 20 MHz–50 MHz. This is due to the overlap current that flows between the rails of the device when the internal gates switch. Whereas the current mode driver switches a fixed current between its output without any substantial overlap current. This is similar to some ECL and PECL devices, but without the heavy static ICC requirements of the ECL/PECL designs. LVDS requires > 80% less current than similar PECL devices. AC specifications for the driver are a tenfold improvement over other existing RS-422 drivers. 8 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C200 DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 Fail-safe Feature: The LVDS receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to CMOS logic levels. Due to the high gain and tight threshold of the receiver, care should be taken to prevent noise from appearing as a valid signal. The receiver's internal fail-safe circuitry is designed to source/sink a small amount of current, providing fail-safe protection (a stable known state of HIGH output voltage) for floating, terminated or shorted receiver inputs. 1. Open Input Pins. The DS36C200 is a dual transceiver device, and if an application requires only one receiver, the unused channel inputs should be left OPEN. Do not tie the receiver inputs to ground or any other voltages. The input is biased by internal high value pull up or pull down resistors to set the output to a HIGH state. This internal circuitry will ensure a HIGH, stable output state for open inputs. 2. Terminated Input. If the driver is disconnected (cable unplugged), or if the driver is in a TRI-STATE or power-off condition, the receiver output will again be in a HIGH state, even with the end of the cable 100Ω termination resistor across the input pins. The unplugged cable can become a floating antenna which can pick up noise. If the cable picks up more than 10mV of differential noise, the receiver may see the noise as a valid signal and switch. To insure that any noise is seen as common-mode and not differential, a balanced interconnect should be used. Twisted pair cable will offer better balance than flat ribbon cable. 3. Shorted Inputs. If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0V differential input voltage, the receiver output will remain in a HIGH state. Shorted input fail-safe is not supported across the common-mode range of the device (GND to 2.4V). It is only supported with inputs shorted and no external common-mode voltage applied. If there is more than 10mV of differential noise, the receiver may switch or oscillate. If this condition can happen in your application, you may wish to add external fail-safe resistors to create a larger noise margin. External lower value pull up and pull down resistors (for a stronger bias) may be used to boost fail-safe in the presence of higher noise levels. The pull up and pull down resistors should be in the 5kΩ to 15kΩ range to minimize loading and waveform distortion to the driver. The common-mode bias point should be set to approximately 1.2V (less than 1.75V) to be compatible with the internal circuitry. Additional information on fail-safe biasing of LVDS devices may be found in AN-1194 (SNLA051). Figure 11. (A) Dedicated IEEE 1394 Link (B) Full IEEE 1394 Compliant Link Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C200 9 DS36C200 SNLS111D – JUNE 1998 – REVISED APRIL 2013 www.ti.com Figure 12. Typical in Home Application Figure 13. Typical Interface Connection (1) 10 (1) The DS36C200 is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C200 DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS36C200 11 PACKAGE OPTION ADDENDUM www.ti.com 7-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) DS36C200M/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS36C200M DS36C200MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS36C200M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS36C200MX/NOPB Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.35 2.3 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS36C200MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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