HSMW-C280 Miniature ChipLED Data Sheet Feature LED with InGaN die Surface mount device with 0402 footprint Compatible with reflow soldering Tape in 8mm carrier tape on a 7 inch diameter reel Application Backlighting Indicator Package Dimension Note: 1. 2. All dimensions are in millimeters (inches). Tolerance ±0.1mm (±0.004in) unless otherwise specified. Caution: LEDs are ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. 1 Absolute Maximum Value at TA = 25°C Parameter White Unit Forward Current1 20 mA Peak Pulsing Current2 100 mA Power Dissipation 78 mW LED Junction Temperature 95 °C Operating Temperature Range -30 to 85 °C Storage Temperature Range -40 to 85 °C Note: 1. 2. Derate as shown in Figure 8. Pulse condition of 1/10 duty and 0.1ms width. Optical Characteristics at TA = 25°C, IF=20mA Color Luminous Intensity Viewing Iv (mcd)1 Angle 2θ1/22 White Min Typ Typ 180.0 262.7 130 Note: 1. 2. The luminous intensity is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with the axis. Viewing angle is the off axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics at TA = 25°C, IF=20mA Color Forward Voltage Vf (V)1 Reverse Voltage Vr(V) @Ir=100μA Thermal 2 Resistance Rθj-pin(°C/W) White Min Max Min Typ 2.7 3.9 5 300 Note: 1. 2. Forward voltage tolerance is ±0.1V. Reverse voltage Indicates product final testing, long terms reverse bias is not recommended. 2 Luminous Intensity Bin Limits Bin ID Luminous Intensity (mcd) Min 180.0 285.0 450.0 S T U Tolerance ±15% White Color Bin Limits Bin ID Chromaticity Coordinates x y A1 0.270 0.246 0.270 0.278 0.250 0.250 0.250 0.218 A2 0.270 0.246 0.270 0.213 0.250 0.185 0.250 0.218 B1 0.270 0.246 0.270 0.278 0.290 0.306 0.290 0.274 B2 0.270 0.246 0.270 0.213 0.290 0.241 0.290 0.274 Tolerance ±0.02 Max 285.0 450.0 715.0 Bin ID C1 C2 D1 D2 0.38 0.36 0.34 D1 0.32 C1 0.30 0.28 C2 B1 y D2 0.26 A1 0.24 0.22 B2 A2 0.20 0.18 0.16 0.24 0.26 0.28 0.30 0.32 0.34 x Figure 1. Chromaticity diagram 3 Chromaticity Coordinates x y 0.290 0.306 0.310 0.336 0.310 0.303 0.290 0.274 0.290 0.241 0.310 0.271 0.310 0.303 0.290 0.274 0.310 0.303 0.310 0.336 0.330 0.365 0.330 0.333 0.310 0.303 0.310 0.271 0.330 0.300 0.330 0.333 Forward Voltage Bin Limits Bin ID Forward Voltage (V) Min 2.7 2.9 3.1 3.3 3.5 3.7 Z 1 2 3 4 5 Tolerance ±0.1V Max 2.9 3.1 3.3 3.5 3.7 3.9 20 18 FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.0 0.8 0.6 0.4 16 14 12 10 0.2 8 6 4 2 0.0 0 0 2 4 6 8 10 12 14 16 18 20 1 FORWARD CURRENT - mA 2 2.5 430 3.5 Figure 3. Forward Current vs Forward Voltage 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 3 FORWARD VOLTAGE - V Figure 2. Luminous Intensity vs Forward Current RELATIVE INTENSITY 1.5 480 530 580 630 WAVELENGTH - nm Figure 4. Spectrum 4 680 730 780 4 0.014 x 0.012 0.8 COORDINATE SHIFT NORMALIZED INTENSITY 1.0 0.5 0.3 y 0.010 0.008 0.006 0.004 0.002 0.0 0.000 -90 -60 -30 0 30 60 90 0 2 ANGULAR DISPLACEMENT - DEGREES Figure 5. Radiation pattern 4 6 8 10 12 14 16 FORWARD CURRENT - mA 18 Figure 6. Chromaticity shift vs Forward current 1.2 22 20 Rj-a=500°C/W Rj-a=600°C/W Rj-a=700°C/W Rj-a=850°C/W 18 FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.8 0.6 0.4 0.2 16 14 12 10 8 6 4 2 0.0 0 -40 -20 0 20 40 60 80 100 0 AMBIENT TEMPERATURE, TA -°C Figure 7. Relative intensity vs Temperature 10 20 30 40 50 60 70 80 AMBIENT TEMPERATURE - °C Figure 8. Derating curve Figure 9. Recommended solder pad 5 90 100 20 Figure 10. Reel orientation Figure 11. Reel dimensions 6 Figure 12. Carrier tape dimensions Soldering Recommended reflow soldering condition: (a) Reflow soldering must not be done more than 2 times. Do observe necessary precautions of handling moisture sensitive device as stated in below section. (b) Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. (c) It is preferred to use reflow soldering to solder the LED. But if unavoidable (such as rework), manual hand soldering can be used but must be strictly controlled to condition below: Soldering iron tip temperature = 310°C max Soldering duration = 2sec max Number of cycle = 1 only Power of soldering iron = 50W max (d) Do not touch the LED package body with the soldering iron except for the soldering terminals as it may cause damage to the LED. (e) User is advised to confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. 7 PRECAUTIONARY NOTES 1. Handling of moisture sensitive device This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. (a) Before use - An unopened moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is recommended that the MBB not be opened prior to assembly (e.g. for IQC). (b) Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all times and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours. (c) Control for unfinished reel - Unused LEDs must be stored in a sealed MBB with desiccant or desiccator at <5%RH. (d) Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure that all LEDs have not exceeded their floor life of 672 hours. (e) Baking is required if: - The HIC indicator is not blue at 10% and is pink at 5%. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LED floor life exceeded 672hrs. The recommended baking condition is: 60±5ºC for 20hrs Baking should only be done once. Disclaimer Avago’s products are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. 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