Material Content Data Sheet Sales Product Name BGS 15AN16 E6327 MA# MA000951354 Package PG-TSNP-16-6 Issued Weight* Construction Element Material Group Substances chip leadframe inorganic material non noble metal non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics inorganic material plastics plastics < 10% silicon tin zinc chromium copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silicondioxide acrylic resin polyester resin wire encapsulation leadfinish plating tape *deviation 29. August 2013 11.33 mg CAS# if applicable Weight [mg] Average Mass [%] Sum [%] Average Mass [ppm] Sum [ppm] 7440-21-3 7440-31-5 7440-66-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 60676-86-0 - 0.447 3.95 0.010 0.09 3.95 39477 39477 0.008 0.07 709 0.012 0.11 1063 3.986 35.17 35.44 351705 354363 0.115 1.01 1.01 10110 10110 0.031 0.27 886 2693 0.885 7.81 5.188 45.77 53.85 457749 78086 538528 0.186 1.64 1.64 16391 16391 0.216 1.91 1.91 19103 19103 0.062 0.55 5507 0.062 0.55 5507 0.062 0.55 0.062 0.55 5507 2.20 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5507 22028 1000000