Allied HFCLR03-8N2 -RC High frequency low resistance inductor Datasheet

RoHS
HFCLR03
High Frequency Low Resistance Inductor
0.020±0.004
(0.5±0.10)
0.039±0.004
(1.0±0.10)
0.020±0.004
(0.51±0.10)
Dimensions:
Inches
(mm)
0.010±0.004
(0.25±0.10)
0.016
(0.41)
0.016
(0.41)
Q
Min.
SRF
Typical
(MHz)
RDC
Max.
(Ω)
IDC
Max.
(mA)
0.3nH
0.3nH
8
8
0.05
0.06
300
0.8
0.3nH
8
HFCLR03-1N0S-RC
1.0
0.3nH
8
10000
10000
10000
10000
0.06
0.07
300
300
300
HFCLR03-1N1S-RC
1.1
0.3nH
8
6000
0.09
300
HFCLR03-1N2S-RC
1.2
0.3nH
8
6000
0.09
300
HFCLR03-1N3S-RC
1.3
0.3nH
8
6000
0.09
300
HFCLR03-1N5S-RC
1.5
0.3nH
8
6000
0.10
300
HFCLR03-1N6S-RC
1.6
0.3nH
8
6000
0.10
300
HFCLR03-1N8S-RC
1.8
8
6000
0.10
HFCLR03-2N0S-RC
2.0
0.3nH
0.3nH
8
6000
0.10
HFCLR03-2N2S-RC
2.2
2.4
2.7
3.0
0.3nH
0.3nH
0.3nH
0.3nH
8
8
8
8
6000
6000
6000
6000
0.12
0.15
0.15
0.17
300
300
300
300
300
300
3.3
0.3nH
8
6000
0.17
300
3.6
0.3nH
8
6000
3.9
4.3
0.3nH
0.3nH
8
8
6000
6000
0.18
0.18
0.18
300
HFCLR03-4N7S-RC
4.7
0.3nH
8
6000
0.18
300
HFCLR03-5N1S-RC
5.1
0.3nH
8
5300
0.20
300
HFCLR03-5N6S-RC
5.6
0.3nH
8
4500
0.20
300
HFCLR03-6N2S-RC
6.2
0.3nH
8
4500
0.22
300
HFCLR03-6N8_-RC
6.8
5, 10
8
4500
0.24
300
HFCLR03-7N5_-RC
7.5
5, 10
8
4200
0.24
300
HFCLR03-8N2_-RC
8.2
5, 10
8
3700
0.24
300
HFCLR03-9N1_-RC
9.1
5, 10
8
3400
0.26
300
• 0402 EIA size for high board density
applications.
• Excellent Q and SRF characteristics
for high frequency applications.
• Cost effective monolithic construction
Allied
Part
Number
Inductance
(nh)
@100MHz
Tolerance
(%)
HFCLR03-0N3S-RC
HFCLR03-0N5S-RC
0.3
0.5
HFCLR03-0N8S-RC
Electrical
Features
Inductance range: .3nh to 82nh
Tolerance: use S for ± .3nh, J for 5%,
K for 10%
Test Frequency: Inductance and Q
tested at 100MHz, 200mv with HP4291A
Impedance Analyzer
Inductance vs Freq. Characteristics
measured on HP4291A
Q vs Frequency Characteristics
measured on HP4291A
SRF measured on HPE4991 & HP87530
DCR measured on Chen Hwa CH502BC
or HP4338B
Mechanical
Operating Temperature: -55ºC-125ºC
Storage Temperature: -55ºC to +125ºC
after mounting to PCB, -5ºC to +40ºC @
40% to 70% humidity before mounting to PCB
Solderability: 90% terminal coverage
Test Condition: Pre heat:150ºC. 1min.
Solder composition:
Sn/Ag3.0/Cu.0.5 (Pb free)
Solder temp: 245ºC±5ºC (pb Free)
Immersion time: 4 ± 1 sec.
Resistance to solder heat:
No damage to part
Test Condition
Pre heat: 150ºC. 1min.
Solder composition:
Sn/Ag3.0/Cu.0.5 (Pb free)
Solder temp: 260ºC±5ºC (pb Free)
Immersion time: 10 ± 1 sec.
Physical
Packaging: 10000 pieces per 7 inch reel.
All specifications subject to change without notice.
714-665-1140
HFCLR03-2N4S-RC
HFCLR03-2N7S-RC
HFCLR03-3N0S-RC
HFCLR03-3N3S-RC
HFCLR03-3N6S-RC
HFCLR03-3N9S-RC
HFCLR03-4N3S-RC
300
300
HFCLR03-10N_-RC
10
5, 10
8
3400
0.26
300
HFCLR03-12N_-RC
12
5, 10
8
3000
0.28
300
HFCLR03-15N_-RC
15
5, 10
8
2500
0.32
300
HFCLR03-18N_-RC
HFCLR03-22N_-RC
18
22
5, 10
5, 10
8
8
2200
1900
0.36
0.42
300
300
HFCLR03-27N_-RC
27
5, 10
8
1700
0.46
300
1600
0.58
200
HFCLR03-33N_-RC
33
5, 10
8
HFCLR03-39N_-RC
39
5, 10
8
1200
0.65
200
HFCLR03-47N_-RC
47
5, 10
8
1000
0.72
200
HFCLR03-56N_-RC
56
5, 10
8
800
0.82
200
HFCLR03-68N_-RC
68
5, 10
8
800
0.92
180
HFCLR03-82N_-RC
82
5, 10
8
700
1.20
150
Note: Insert desired tolerance here “_” Tolerance Values J= ±5%, K= ±10%
ALLIED COMPONENTS INTERNATIONAL
05/20/10
www.alliedcomponents.com
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