www.osram-os.com Produktdatenblatt | Version 1.1 LT QH9G LT QH9G CHIPLED ® 0402 Applications ——Electronic Equipment ——Textile illumination ——Gaming, Amusement, Gambling ——White Goods ——Health monitoring (Health rate, Blood, Oximetry, …) Features: ——Package: SMT package 0402, colorless diffused resin ——Chip technology: InGaN on Sapphire ——Typ. Radiation: 115° (horizontal), 170° (vertical) ——Color: λdom = 530 nm (● true green) ——Optical efficacy: 38 lm/W ——Corrosion Robustness Class: 3B ——ESD: 1 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM) 1 Version 1.3 | 2018-03-27 LT QH9G Ordering Information Type Luminous Intensity 1) IF = 5 mA Iv Ordering Code LT QH9G-Q2OO-25-2Z4Y ≥ 90 mcd Q65111A7377 2 Version 1.3 | 2018-03-27 LT QH9G Maximum Ratings Parameter Symbol Operating Temperature Top min. max. -40 °C 85 °C Storage Temperature Tstg min. max. -40 °C 85 °C Junction Temperature Tj max. 90 °C Forward current TA = 25 °C IF max. 15 mA Surge Current t ≤ 10 µs; D = 0.005 ; TA = 25 °C IFS max. 100 mA Reverse voltage 2) TA = 25 °C VR max. 5V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM) VESD 3 Version 1.3 | 2018-03-27 Values 1 kV LT QH9G Characteristics IF = 5 mA; TA = 25 °C Parameter Symbol Peak Wavelength 3) λpeak typ. 525 nm Dominant Wavelength 3) λdom min. typ. max. 520 nm 530 nm 540 nm Spectral Bandwidth at 50% Irel,max ∆λ typ. 33 nm Viewing angle at 50 % IV values for 0°, 90° 2φ typ. typ. 115 ° 170 ° Forward Voltage 4) IF = 5 mA VF min. typ. max. 2.50 V 2.85 V 3.10 V Reverse current 2) VR = 5 V IR typ. max. 0.01 µA 10 µA Real thermal resistance junction/ambient 5), 6) RthJA real typ. max. 570 K / W 700 K / W Real thermal resistance junction/solderpoint 5) RthJS real typ. max. 350 K / W 480 K / W 4 Version 1.3 | 2018-03-27 Values LT QH9G Brightness Groups Group Luminous Intensity 1) IF = 5 mA min. Iv Luminous Intensity. 1) IF = 5 mA max. Iv Luminous Flux 7) IF = 5 mA typ. ΦV Q2 90 mcd 112 mcd 300 mlm R1 112 mcd 140 mcd 380 mlm R2 140 mcd 180 mcd 480 mlm S1 180 mcd 224 mcd 610 mlm S2 224 mcd 280 mcd 760 mlm T1 280 mcd 355 mcd 950 mlm T2 355 mcd 450 mcd 1210 mlm Forward Voltage Groups Group Forward Voltage 4) IF = 5 mA min. VF Forward Voltage 4) IF = 5 mA max. VF 2Z 2.50 V 2.60 V 3X 2.60 V 2.70 V 3Y 2.70 V 2.80 V 3Z 2.80 V 2.90 V 2.90 V 3.00 V 3.00 V 3.10 V 4X 4Y Wavelength Groups Group Dominant Wavelength 3) min. λdom Dominant Wavelength 3) max. λdom 520 nm 525 nm 3 525 nm 530 nm 4 530 nm 535 nm 5 535 nm 540 nm 2 5 Version 1.3 | 2018-03-27 LT QH9G Group Name on Label Example: Q2-2-2Z Brightness Wavelength Forward Voltage Q2 2 2Z 6 Version 1.3 | 2018-03-27 LT QH9G Relative Spectral Emission 7) Irel = f (λ); IF = 5 mA; TA = 25 °C OHL04094 100 % I rel 80 Vλ 60 blue true green 40 20 0 400 450 500 550 600 650 nm 700 λ Radiation Characteristics 7) Irel = f (ϕ); TA = 25 °C LT QH9G ϕ [°] -20° -40° -50° -30° -10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° 1.0 : 0° : 90° 0.8 0.6 -60° -70° -80° -90° -100° 7 Version 1.3 | 2018-03-27 0.4 0.2 0.0 Irel LT QH9G Forward current Relative Luminous Intensity 7), 8) IF = f(VF); TA = 25 °C 7), 8) Iv/Iv(5 mA) = f(IF); TA = 25 °C LT Q39G OHL04079 5 IF [mA] IV IV (5 mA) 10 10 1 5 4 5 3 2 1 2,4 2,6 2,8 3,0 VF [V] Dominant Wavelength 7) ∆λdom = f(IF); TA = 25 °C OHL04080 10 nm ∆λdom 5 0 -5 -10 -15 -20 0 20 40 60 80 mA 100 IF 8 Version 1.3 | 2018-03-27 10 -1 0 10 5 10 1 mA 10 2 IF LT QH9G Forward Voltage Relative Luminous Intensity 7) ∆VF = VF - VF(25 °C) = f(Tj); IF = 5 mA ∆VF Iv/Iv(25 °C) = f(Tj); IF = 5 mA OHL02397 0.4 V 7) OHL02913 1.1 IV I V (25 ˚C) 0.3 0.8 0.2 true green blue 0.7 0.1 0.6 0.5 0 0.4 -0.1 0.3 0.2 -0.2 0.1 -0.3 -60 -40 -20 0 20 40 60 ˚C 100 Tj 9 Version 1.3 | 2018-03-27 0 -60 -40 -20 0 20 40 60 ˚C 100 Tj LT QH9G Max. Permissible Forward Current IF = f(T) LT QH9G IF [mA] 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 20 40 60 80 TA [°C] Permissible Pulse Handling Capability Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; TA = 25 °C IF = f(tp); D: Duty cycle; TA = 85 °C 10 Version 1.3 | 2018-03-27 LT QH9G Dimensional Drawing 9) Approximate Weight: 0.4 mg Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43) 11 Version 1.3 | 2018-03-27 LT QH9G Recommended Solder Pad 9) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. 12 Version 1.3 | 2018-03-27 LT QH9G Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature tS 60 2 3 100 120 2 3 Unit K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 Time 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 13 Version 1.3 | 2018-03-27 °C 480 s K/s s LT QH9G Taping 9) 14 Version 1.3 | 2018-03-27 LT QH9G Tape and Reel 10) Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 4000 15 Version 1.3 | 2018-03-27 LT QH9G Barcode-Product-Label (BPL) Dry Packing Process and Materials 9) Moisture-sensitive label or print Barcode label L VE LE see lab e If nk, bla cod bar hu ve y el . H) (R dit mi e ed ag % . RH /60 ˚C rar ck rel 30 N s VE RS inf pa % ainITI TO of to ak 90 d ntNSUC < ns (pe or TIO d , cte itio an bje ing U g coSEND ˚C nd 5 ˚C su ss CO Ais baRE co ± ce y 40 be TU MI CThIS ˚C < ll pro tor SE ati _ < ). urs urs Ho de urs Ho co 72 Ho urs te 48 e Ho 24 6 da e tim e th tim or ). 23 tim e at t wi nt l wi or fac ˚C Flo s tim at or ca at re. Flo tha ale el d or nth nti Flo du uiv if: rea es l 4 5 Flo mo lab ce ide eq low g, l ve vic 5a is or be 24 de tin en pro ve l 6 Le de , e te co g: , un wh Le ve l ke r se da ba ed low ure Le ve mo % ba e ba al d ure Le ist en ref e e 10 for tim se ist ure ale op se for > , Mo se 3 ure is or . , se is ha Mo istist nk be g nk -03 rd Mo in n Flo r-p RH g, bla Mo ba TD po If blathi life s % kin Ca (if ar t. wi J-S 10 ba tor thi, va p. elf Ye ar ks _ < e icat me , C 1 tem ted Ye ee urs Sh ter at ed low uir > 1 W Ho un Af Ind no uir DE 1. dy d e 4 ref 8 y is req JE 2. bo e Mo ore tim req 16 : C/ e es dit2b a) St tim or is IP mior ed vic tim e b) g e or Hu en Flo tim or De 2a kin nc te Flo op a) or 3. b) baere Flo da e l 1 2 Flo If al ref tim ve l 4. se d l 2a ve Le 3 g an ve l Le Ba te ure Le ve ure ist Le Da ure ist Mo ist ure Mo Mo ist Mo MO TO OP M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 16 Version 1.3 | 2018-03-27 LT QH9G Transportation Packing and Materials 9) DE R 18 -1 -1 +Q P OU P: 44 01 C: 99 8 D/ 20 00 (9 D) 210 021 : 34 O H 12 (Q )Q TY : S S em R ic AM o nd O uc p to to H rs NO TC BA 3G 5 14 2 (6 P) NO : 12 T 11 00 LO (1 T) NO : OD M Y DE -1 18 P -1 + Q R G RO UP : (G ) 44 01 D/ C: (9 D) 0 AM 00 TY :2 )Q O SR 34 NO : (X ) PR O D 5 14 2 110 0 (Q A R ic NO : O S em S (1 T) LO T NO (6 P) : 12 3G BA TC H H 12 o M n O d u p ct to o rs M Muster u L lt S iT Y O T6 P 76 L E Bi D Bi n1 Bi n2 : P- n3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: (X ) PR < 8 2199 2100 GR L el at (G ) M u L lt S iT Y O T67 P L 6 Muster E V LE see . lab e H) nk, cod (R bla r If ty ba . idi RH m hu 0% e /6 ive d ˚C re ag lat ra ck re 30 _ < inf pa % k s of to 90 ea ur s d ). < ns (p or d Ho ururs s , de cteg itio Ho an bje co ˚C 72 sin nd Ho ur 5 te 48 ˚C su es e Ho co ± 24 6 da 40 be oc ry tim e e ˚C th r pr ll tim cto ). 23 oo r wi nt tim e l wi fa r ˚C Fl oo tim s at at ale e. at ica Fl th oo r th ur el nt Fl oo on es uiv if: read ed l 4 5 Fl , lab m ide eq low oc ve l vic is ingen de be 24 de or l 5a6 pr Le ve nt wh e te co , w, g: ve l Le ke r re ou% se da ed ba flo ba Le ve tu re m ba e al d Le r en re re e re 10 ois tu tim se fo tu re ale op se fo > , M ois r se 3 is , is ha se M ois tu nk be oo . 03 nk rd g M ois in r-p bla in Fl RH g, DM ba Ca po If blath % kin life is (if . ar ST p. wi 10 baator et Jelf r th va Ye ar ks s m _ < m ed 1 Ye ee ur d, C iredic t Sh te w, te at nt > 1 W Ho Af flody qu In no ire DE 1. e ou 4 8 re ed re ty is qu JE 2. bo M or tim e e 16 re C/ : es idi 2b r a) St tim mor is IP e ed r oo vic tim b) g e r Hu Fl oo en tim De 2a kin nc te Fl oo r a) op re 3. b) Fl oo da ba e fe l 1 Fl If al re tim ve l 2 4. se d l 2a3 Le ve g an ve l Le re Ba te Le ve tu re Le Da ois tu re tu re M ois M ois tu M ois M Nns IVEORS ai IT ntNS CT TIO DU U g EcoSE ON A ba IC UR M CThisSTSE OI M TO OP M Y Barcode label E Bi D n1 Bi Bi n2 : Pn3 : Q- 1: 1- 20 M 20 2 L Te 2a 22 m 3 24 0 p ST Ad 26 0 C R 0 C R0 dit ion C R PA 77 al RT CK TE VA XT R: Barcode label Packing Sealing label Dimensions of transportation box in mm Width Length Height 200 ± 5 mm 195 ± 5 mm 30 ± 5 mm 17 Version 1.3 | 2018-03-27 OHA02044 LT QH9G Type Designation System Wavelength (λdom typ.) B: 470 nm S: 633 nm T: 528 nm Y: 587 nm A: 617 nm R/J: 625 nm H: 645 nm O: 606 nm G: 570 nm L: Emission Color blue super red true green yellow amber red hyper-red orange green Color coordinates according CIE 1931/Emission color: W: white Package Type Q: CHIPLED 0603 / 0402 R: CHIPLED 0805 N: CHIPLED 1206 / CHIPLED with lens Light emitting diode L B Q H ´ Lead / Package Properties 1: footprint: 0603 / height: 0.6 mm 3: footprint: 0603 / height: 0.35 mm 9: standard H: footprint: 0402 / height: 0.35 mm Encapsulant Type / Lens Properties 1: focusing lens (=20°) 7: clear resin or white volume conversion 8: white volume conversion 9: clear resin Chip Technology: 1: TSN 3: standard InGaN 4: AlGaAs 6: standard InGalP E: ThinGaN & package with 8 kV ESD stability G: NOTA, Powerflip, ThinGaN 18 Version 1.3 | 2018-03-27 9 G LT QH9G Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize LED exposure to aggressive substances during storage, production, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. Based on very short life cycle times in chip technology this component is subject to frequent adaption to the latest chip technology. For further application related informations please visit www.osram-os.com/appnotes 19 Version 1.3 | 2018-03-27 LT QH9G Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 20 Version 1.3 | 2018-03-27 LT QH9G Glossary 1) Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of ±11 %. 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Wavelength: Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm. 4) Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ±0.1 V. 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad) 7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single LEDs within one packing unit. 9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm. 21 Version 1.3 | 2018-03-27 LT QH9G Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 22 Version 1.3 | 2018-03-27