Through Hole Lamp Product Data Sheet LTL1BEA4JLCH233 Spec No. :DS20-2017-0069 Effective Date: 08/09/2017 Revision: - LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto Through Hole Lamp LTL1BEA4JLCH233 Through Hole Lamp LTL1BEA4JLCH233 Rev Description By Date P001 Preliminary Specification ( RDR-20170027-01 ) Javy H. 5/05/2017 P002 Update the specification of pin length Javy H. 5/15/2017 P003 Update Hue specification Javy H. 6/19/2017 Above data for PD and Customer tracking only - New Specification Upload On OPNC Chalerm Ya. 1/9 6/29/2017 Part No. : LTL1BEA4JLCH233 BNS-OD-FC002/A4 Through Hole Lamp LTL1BEA4JLCH233 1. Description CBI (Circuit Board Indicator) is a black plastic right angle Holder (Housing) which mates with Lite-On LED lamps. Lite-On CBI is available in a wide variety of packages, including top-view (Spacer) or right angle and horizontal or vertical arrays which is stackable and easy to assembly. 1. 1. Features Designed for ease in circuit board assembly. Black case enhance contrast ratio. Solid state light source. Low power consumption & High efficiency. Lead free product & RoHS Compliant. T-1 lamp: Emitted color is AlInGaP red/yellow green bi-color with white diffused lens. 1.2. Applications Communication. Computer. Consumer. Industrial. 2. Outline Dimensions Notes : 1. 2. 3. 4. All dimensions are in millimeters (inches). Tolerance is ±0.25mm (.010") unless otherwise noted. The Holder (Housing) material is plastic black. The LED lamp is red (super red)/yellow green bi-color, common cathode. 5. Specifications are subject to change without notice. 2/9 Part No. : LTL1BEA4JLCH233 BNS-OD-FC002/A4 Through Hole Lamp LTL1BEA4JLCH233 3. Absolute Maximum Ratings at TA=25°C Parameter Red Yellow Green Unit 75 75 mW (Duty Cycle≦1/10, Pulse Width≦0.1ms) 90 60 mA DC Forward Current 30 30 mA Power Dissipation Peak Forward Current Operating Temperature Range -30°C to + 85°C Storage Temperature Range -40°C to + 100°C Lead Soldering Temperature [2.0mm (.079") From Body] 260°C for 5 Seconds Max. 4. Electrical / Optical Characteristics at TA=25°C Parameter Radiant Intensity Symbol Color Min. Red 10 Peak Emission Wavelength 10 45 Yellow Green 45 Red 639 deg nm 575 631 nm 568 Red 20 Yellow Green 11 570.5 Δλ @Peak (Fig.1) Note 3 nm Red 1.5 2.0 2.3 Yellow Green 1.5 2.1 2.3 VF V Red Reverse Current Note 2 (Fig.6) IF = 5mA 637 λd 563 Note 1,4 Measurement λP 624 Test Condition IF = 5mA 38 Red Yellow Green Forward Voltage 38 2θ1/2 Red Spectral Line Half-Width Unit mcd Yellow Green Dominant Wavelength Max. Iv Yellow Green Viewing Angle Typ. IR IF = 5mA VR = 5V 100 μA Yellow Green Note 6 NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Iv guarantee must be included with ±30% testing tolerance. 5. Reverse current is controlled by dice source. 6. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation. 3/9 Part No. : LTL1BEA4JLCH233 BNS-OD-FC002/A4 Through Hole Lamp LTL1BEA4JLCH233 5. Typical Electrical / Optical Characteristics Curves (25°C Ambient Temperature Unless Otherwise Noted) 4/9 Part No. : LTL1BEA4JLCH233 BNS-OD-FC002/A4 Through Hole Lamp LTL1BEA4JLCH233 6. Packing Specification PAPERBOARD EMPTYTRAY 252Pcsx14TRAYS/ LOT LOTTOTAL:3,528Pcs 1LOT/ INNERCARTON TOTAL: 3,528Pcs (I-CARTON: 300X165X130mm) 8I-CARTON/OUTERCARTON TOTAL: 28,224Pcs (O-CARTON: 610X350X280mm) 5/9 Part No. : LTL1BEA4JLCH233 BNS-OD-FC002/A4 Through Hole Lamp LTL1BEA4JLCH233 7. Bin Table Specification Luminous Intensity Luminous Intensity (Red) (Green) Bin Code Bin Code Unit : mcd @5mA Min. Max. A 10 19 B 19 38 Unit : mcd @5mA Min. Max. A 10 19 B 19 38 Note: Tolerance of each bin limit is ±30% Green Dominant Wavelength Unit : nm @5mA Bin Code Min Max 1 563.0 565.5 2 565.5 568.0 3 568.0 570.5 Note: Tolerance of each bin limit is ±1nm Green Forward Voltage Vf Unit : V @5mA Bin Code Min Max 1 1.5 1.7 2 1.7 1.9 3 1.9 2.1 4 2.1 2.3 Note: Tolerance of each bin limit is ±0.1V 6/9 Part No. : LTL1BEA4JLCH233 BNS-OD-FC002/A4 Through Hole Lamp LTL1BEA4JLCH233 8. CAUTIONS 8.1. Application This LED lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment. 8.2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is re commended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 8.3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 8.4. Lead Forming & Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 8.5. Soldering When soldering, leave a minimum of 2mm clearance from the base of the lens/Holder to the soldering point. Dipping the lens/Holder into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions: Soldering iron Temperature Soldering time Position 350°C Max. 3 seconds Max. (one time only) No closer than 2mm from the base of the epoxy bulb/Holder Wave soldering Pre-heat Pre-heat time Solder wave Soldering time Dipping Position 120°C Max. 100 seconds Max. 260°C Max. 5 seconds Max. No lower than 2mm from the base of the epoxy bulb/Holder Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR reflow is not suitable process for through hole type LED lamp product. Max temperature of wave soldering is not means that Holder’s HDT/Melting temperature. 8.6. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model (A) LED Circuit model (B) LED (A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. 7/9 Part No. : LTL1BEA4JLCH233 BNS-OD-FC002/A4 Through Hole Lamp LTL1BEA4JLCH233 8.7. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use a conductive wrist band or anti- electrostatic glove when handling these LEDs All devices, equipment, and machinery must be properly grounded Work tables, storage racks, etc. should be properly grounded Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing Suggested checking list: Training and Certification 8.7.1.1. Everyone working in a static-safe area is ESD-certified? 8.7.1.2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 8.7.2.1. Static-safe workstation or work-areas have ESD signs? 8.7.2.2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 8.7.2.3. All ionizer activated, positioned towards the units? 8.7.2.4. Each work surface mats grounding is good? Personnel Grounding 8.7.3.1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 8.7.3.1. If conductive footwear used, conductive flooring also present where operator stand or walk? 8.7.3.2. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 8.7.3.3. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 8.7.3.4. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 8.7.4.1. Every ESDS items identified by EIA-471 labels on item or packaging? 8.7.4.2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 8.7.4.3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 8.7.4.4. All flexible conductive and dissipative package materials inspected before reuse or recycle? Others 8.7.5.1. Audit result reported to entity ESD control coordinator? 8.7.5.2. Corrective action from previous audits completed? 8.7.5.3. Are audit records complete and on file? 8/9 Part No. : LTL1BEA4JLCH233 BNS-OD-FC002/A4 Through Hole Lamp LTL1BEA4JLCH233 9. Reliability Test Classification Endurance Test Item Test Condition Sample Size Reference Standard Operation Life Ta = Under room temperature IF = per datasheet maximum drive current Test Time= 1000hrs 22 PCS (CL=90%; LTPD=10%) High Temperature High Humidity storage Ta = 60°C RH = 90% Test Time= 240hrs 22 PCS (CL=90%; LTPD=10%) High Temperature Storage Ta= 105 ± 5°C Test Time= 1000hrs 22 PCS (CL=90%; LTPD=10%) MIL-STD-750D:1031 (1995) MIL-STD-883G:1008 (2006) JEITA ED-4701:200 201 (2001) Low Temperature Storage Ta= -55 ± 5°C Test Time= 1000hrs 22 PCS (CL=90%; LTPD=10%) JEITA ED-4701:200 202 (2001) Temperature Cycling 100°C ～ 25°C ～ -40°C ～ 25°C 22 PCS 30mins 5mins 30mins 5mins (CL=90%; LTPD=10%) 30 Cycles MIL-STD-750D:1051 (1995) MIL-STD-883G:1010 (2006) JEITA ED-4701:100 105 (2001) JESD22-A104C (2005) Thermal Shock 100 ± 5°C ～ -30°C ± 5°C 15mins 15mins 30 Cycles (<20 secs transfer) 22 PCS (CL=90%; LTPD=10%) MIL-STD-750D:1056 (1995) MIL-STD-883G:1011 (2006) MIL-STD-202G:107G (2002) JESD22-A106B (2004) Solder Resistance T.sol = 260 ± 5°C Dwell Time= 10±1 seconds 3mm from the base of the epoxy bulb 11 PCS (CL=90%; LTPD=18.9%) MIL-STD-750D:2031(1995) JEITA ED-4701: 300 302 (2001) Solderability T. sol = 245 ± 5°C 11 PCS Dwell Time= 5 ± 0.5 seconds (CL=90%; (Lead Free Solder, Coverage ≧95% of LTPD=18.9%) the dipped surface) MIL-STD-750D:1026 (1995) MIL-STD-883G:1005 (2006) MIL-STD-202G:103B (2002) JEITA ED-4701:100 103 (2001) Test Environmental Test Soldering Iron T. sol = 350 ± 5°C Dwell Time= 3.5 ± 0.5 seconds 11 PCS (CL=90%; LTPD=18.9%) MIL-STD-750D:2026 (1995) MIL-STD-883G:2003 (2006) MIL-STD-202G:208H (2002) IPC/EIA J-STD-002 (2004) MIL-STD-202G:208H (2002) JEITA ED-4701:300 302 (2001) 10. Others The appearance and specifications of the product may be modified for improvement, without prior notice. 9/9 Part No. : LTL1BEA4JLCH233 BNS-OD-FC002/A4