1 of 3 Creation Date : May 15, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012JB1H105M085AB TDK item description C2012JB1H105MT**** Applications Commercial Grade Feature General General (Up to 50V) Series C2012 [EIA 0805] Status Production (Not Recommended for New Design) Size Length(L) 2.00mm ±0.20mm Width(W) 1.25mm ±0.20mm Thickness(T) 0.85mm ±0.15mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.50mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 1μF ±20% Rated Voltage 50VDC Temperature Characteristic JB(±10%) Dissipation Factor (Max.) 5% Insulation Resistance (Min.) 500MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : May 15, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012JB1H105M085AB Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C2012JB1H105M085AB ESR C2012JB1H105M085AB Capacitance C2012JB1H105M085AB C2012JB1H105M085AB Temperature Characteristic C2012JB1H105M085AB(No Bias) DC Bias Characteristic C2012JB1H105M085AB(DC Bias = 25V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising C2012JB1H105M085AB(100kHz) C2012JB1H105M085AB(500kHz) C2012JB1H105M085AB(1MHz) Multilayer Ceramic Chip Capacitors C2012JB1H105M085AB Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : May 15, 2017 (GMT)