CYStech Electronics Corp. 10Amp. Schottky Barrier Rectifiers MBR10200FP Features IF(AV) VRRM Tj VF Spec. No. : C462FP Issued Date : 2009.07.14 Revised Date : 2014.04.08 Page No. : 1/1 2 × 5A 200V 175°C 0.7V • 175℃ operating junction temperature • Low VF and low IR type • Metal silicon junction, major carrier conduction • 10A total (5A per diode leg) • Guardring for over voltage protection • Low power loss, high efficiency • High surge capability • Insulating package, insulating voltage=2500V DC, capacitance=45pF • For use in low voltage, high frequency inverters, free wheeling, and polarity protection application • Pb-free lead plating package Mechanical Data • Case: TO-220FP molded plastic • Mounting Position: Any • Weight: 2.2 grams, 0.078 ounce approximately • Terminals: Pure tin plated, lead-free, solderable per MIL-STD-750 method 2026 • Epoxy: UL 94V-0 rate flame retardant • Mounting torque: 5 in.-lb. maximum Equivalent Circuit MBR10200FP Outline TO-220FP AKA MBR10200FP CYStek Product Specification CYStech Electronics Corp. Spec. No. : C462FP Issued Date : 2009.07.14 Revised Date : 2014.04.08 Page No. : 2/2 Maximum Ratings and Electrical Characteristics (Per Diode Leg) (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.) Parameter Symbol Min. Typ. Max. Units Maximum Recurrent peak reverse voltage VRRM 200 V Maximum RMS voltage VRMS 140 V Maximum DC blocking voltage VDC 200 V 0.90 IF=5A, TC=25℃ Maximum instantaneous 0.7 0.74 IF=5A, TC=125℃ V VF forward voltage at IF=10 A, TC=25℃ IF=10A, TC=125℃ Per Diode Maximum Average forward rectified current @ TC=133℃ Per Device 1.00 0.87 (Note 1) IF(AV) 5 10 A IFRM 10 A IFSM 110 A Peak repetitive reverse surge current (Note 1 ), TJ<175℃ VR=200 V, TC=25℃ Maximum instantaneous reverse current at VR=200 V, TC=125℃ IRRM Voltage rate of change, (rated VR) dV/dt 2 5 5 10,000 A μA mA V/μs Peak repetitive forward current (square wave, 20kHz, TC=133℃) Non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (JEDEC method) Typical junction capacitance @ f=1MHz and applied 5V reverse voltage ESD susceptibility (Note 2) Operating junction and storage temperature range IR CJ TJ ; Tstg 65 pF 8000 +175 -65 V ℃ Notes : 1. 2.0μs pulse width, f=1.0kHz 2. Human body model, 1.5kΩ in series with 100pF Thermal Data Parameter Maximum Thermal Resistance, Junction-to-case Maximum Thermal Resistance, Junction-to-ambient Lead Temperature for Soldering Purposes : 1/8” from Case for 5 seconds Symbol Rth,j-c Rth,j-a TL Value 3.5 60 300 Unit °C/W °C/W °C Ordering Information Device MBR10200FP-0-UB-S Package TO-220FP (RoHS compliant package) Shipping 50 pcs / Tube, 40 Tubes/Box Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, UB : 50 pcs / tube, 20 tubes/box Product rank, zero for no rank products Product name MBR10200FP CYStek Product Specification Spec. No. : C462FP Issued Date : 2009.07.14 Revised Date : 2014.04.08 Page No. : 3/3 CYStech Electronics Corp. Characteristic Curves Maximum Non-Repetitive Forward Surge Current Forward Current Derating Curve 200 Peak Forward Surge Current---IFSM (A) Average Forward Current---Io(A) 12 10 8 resistive or inductive load 6 4 2 Tj=150℃, 8.3ms Single Half Sine Wave, JEDEC method, Per leg 150 100 50 0 0 0 25 50 75 100 125 150 1 175 Case Temperature---TC(℃) 100 Number of Cycles at 60Hz Forward Current vs Forward Voltage Junction Capacitance vs Reverse Voltage 100000 1000 Per leg Junction Capacitance---CJ(pF) Instantaneous Forward Current---IF(mA) 10 10000 1000 Tj=150℃ 100 Tj=25℃ 10 Pulse width=300μs, 1% Duty cycle 100 Tj=25℃, f=1.0MHz Per Leg 10 1 0 0.2 0.4 0.6 0.8 1 1.2 0.1 1.4 Forward Voltage---VF(V) 1 10 Reverse Voltage---VR(V) Reverse Leakage Current vs Reverse Voltage Reverse Leakage Current---I R(μA) 100 Tj=125℃ Per leg 10 Tj=75℃ 1 0.1 Tj=25℃ 0.01 0.001 0 MBR10200FP 20 40 60 80 Percent of Rated Peak Reverse Voltage---(%) 100 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C462FP Issued Date : 2009.07.14 Revised Date : 2014.04.08 Page No. : 4/4 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MBR10200FP CYStek Product Specification Spec. No. : C462FP Issued Date : 2009.07.14 Revised Date : 2014.04.08 Page No. : 5/5 CYStech Electronics Corp. TO-220FP Dimension(K Forming) Marking: Device Name 1 2 3 Date Code A K A Style: Pin 1.Anode 2.Cathode 3.Anode 3-Lead TO-220FP Plastic Package CYStek Package Code: FP *: Typical Inches Min. Max. 0.3740 0.4134 *0.2756 0.6063 0.6299 0.2480 0.2717 0.0984 0.1181 0.0138 0.0295 0.0276 0.0354 0.0394 0.0551 0.1693 0.1850 DIM A A1 B b1 b2 C D D1 E1 Millimeters Min. Max. 9.50 10.50 *7.00 15.40 16.00 6.30 6.90 2.50 3.00 0.35 0.75 0.70 0.90 1.00 1.40 4.30 4.70 DIM E2 N1 N2 P L L1 I T Inches Min. Max. 0.0984 0.1063 0.0961 0.1039 0.1921 0.2079 0.0984 0.1142 0.5276 0.5354 0.1378 0.1772 0.1181 0.1339 0.0059 0.0138 Millimeters Min. Max. 2.50 2.70 2.44 2.64 4.88 5.28 2.50 2.90 13.40 13.60 3.50 4.50 3.00 3.40 0.15 0.35 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. MBR10200FP CYStek Product Specification CYStech Electronics Corp. Spec. No. : C462FP Issued Date : 2009.07.14 Revised Date : 2014.04.08 Page No. : 6/6 TO-220FP (C Forming) Dimension Marking: Device Name Date Code 3-Lead TO-220FP Plastic Package CYStek Package Code: FP 10200 □□ Style: Pin 1.Anode 2.Cathode 3.Anode *Typical Inches Min. Max. 0.169 0.185 0.051 REF 0.110 0.126 0.098 0.114 0.020 0.030 0.043 0.053 0.059 0.069 0.020 0.030 0.392 0.408 DIM A A1 A2 A3 b b1 b2 c D Millimeters Min. Max. 4.300 4.700 1.300 REF 2.800 3.200 2.500 2.900 0.500 0.750 1.100 1.350 1.500 1.750 0.500 0.750 9.960 10.360 DIM E e F Φ h L L1 L2 Inches Min. Max. 0.583 0.598 0.100* 0.106 REF 0.138 REF 0.000 0.012 1.102 1.118 0.067 0.075 0.075 0.083 Millimeters Min. Max. 14.800 15.200 2.540* 2.700 REF 3.500 REF 0.000 0.300 28.000 28.400 1.700 1.900 1.900 2.100 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. MBR10200FP CYStek Product Specification CYStech Electronics Corp. Spec. No. : C462FP Issued Date : 2009.07.14 Revised Date : 2014.04.08 Page No. : 7/7 TO-220FP (S Forming) Dimension Marking: Device Name Date Code 3-Lead TO-220FP Plastic Package CYStek Package Code: FP Style: Pin 1.Anode 2.Cathode 3.Anode *Typical Inches Min. Max. 0.171 0.183 0.051 REF 0.112 0.124 0.102 0.110 0.020 0.030 0.031 0.041 0.047 REF 0.020 0.030 0.396 0.404 0.583 0.598 0.100 * 0.106 REF DIM A A1 A2 A3 b b1 b2 c D E e F Millimeters Min. Max. 4.35 4.65 1.300 REF 2.85 3.15 2.60 2.80 0.50 0.75 0.80 1.05 1.20 REF 0.500 0.750 10.06 10.26 14.80 15.20 2.54* 2.70 REF DIM G H H1 H2 J K L L1 L2 M N Inches Min. Max. 0.246 0.258 0.138 REF 0.055 REF 0.256 0.272 0.031 REF 0.020 1.102 1.118 0.043 0.051 0.036 0.043 0.067 REF 0.012 REF Millimeters Min. Max. 6.25 6.55 3.50 REF 1.40 REF 6.50 6.90 0.80 REF 0.50 REF 28.00 28.40 1.10 1.30 0.92 1.08 1.70 REF 0.30 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MBR10200FP CYStek Product Specification