IDT F2976NEGK8 High linearity broadband sp2t 5mhz to 10ghz Datasheet

High Linearity Broadband SP2T
5MHz to 10GHz
F2976
Datasheet
Description
Features (75Ω)
The F2976 is a single-pole double-throw (SP2T) reflective RF
switch featuring high linearity and wide bandwidth. This device is
optimized from 5MHz to 1.8GHz to support downstream cable
modem future migration for DOCSIS 3.1 applications, and operates
at up to 10GHz to support a multitude of wireless RF applications.
Superb performance is achieved when used in either 50Ω or 75Ω
terminating impedance applications.
Low insertion loss:
0.23dB at 204MHz
0.34dB at 1.8GHz
High Isolation: 40dB at 1.8GHz
P0.1dB compression of +37dBm at 204MHz
Second Harmonic: -100dBc at 204MHz
Third Harmonic: -120dBc at 204MHz
Composite Second Order Distortion > 100dBc
Composite Triple Beat Distortion > 100dBc
The F2976 uses a single positive supply voltage of either +3.3V or
+5.0V and is compatible with either 1.8V or 3.3V control logic.
Competitive Advantage
Features (50Ω)
The F2976 provides extremely low insertion loss across the entire
bandwidth while providing superb distortion performance.
Low insertion loss:
0.40dB at 2.4GHz
0.55dB at 8GHz
High Isolation:
34dB at 2.4GHz
High Linearity:
IIP2 +125dBm at 2.4GHz
IIP3 +77dBm at 2.4GHz
P0.1dB compression of +40dBm at 2.4GHz
Second Harmonic: -100dBc at 2.4GHz
Third Harmonic: -110dBc at 2.4GHz
Optimized for DOCSIS 3.1 applications up to 1.8GHz
Optimized for Wi-Fi applications up to 5.9GHz
Low insertion loss
High isolation
Fast switching
No external matching required
Typical Applications
Broadband Cable DOCSIS 3.0 / 3.1
Set top box
CATV filter bank switching
Wi-Fi
Cellular BTS
General purpose
Block Diagram
Figure 1.
Block Diagram
RFC
General Features
Supply voltage: +2.5V to +5.25V
1.8V and 3.3V compatible control logic
2mm x 2mm, 12-pin TQFN package
-40°C to +105°C operating temperature range
RF1
RF2
LS
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Pin Assignments
Figure 2.
Pin Assignments for 2mm x 2mm x 0.5mm 12-pin TQFN, NEG12 – Top View
GND
1
RF2
2
GND
3
Vcc
LS
VCT L
12
11
10
F2976
9
GND
8
RF1
7
GND
EP
4
5
6
GND
RFC
GND
Pin Descriptions
Table 1.
Pin Descriptions
Number
Name
Description
1
GND
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
2
RF2
RF2 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
3
4
GND
GND
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
5
RFC
RF Common Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
6
GND
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
7
GND
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
8
RF1
RF1 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.
9
GND
Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.
10
VCTL
Logic control pin (see Table 9).
11
LS
Truth Table select pin. Defines VCTL logic for RF switching (see Table 9). Pin is internally pulled up to 2.5V
through a 500kΩ resistor.
12
VCC
Power supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as
possible to pin.
EP
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple
ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground
vias are also required to achieve the specified RF performance.
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other
conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Table 2.
Absolute Maximum Ratings
Parameter
VCC to GND
VCTL, LS
RF1, RF2, RFC
Symbol
Minimum
Maximum
Units
VCC
-0.3
+5.5
V
VLOGIC
-0.3
Lower of
(VCC + 0.3, 3.9)
V
VRF
-0.3
+0.3
V
5MHz ≤ fRF ≤ 10MHz
PABSCW1
30
10MHz < fRF ≤ 25MHz
PABSCW2
32
25MHz < fRF ≤ 200MHz
200MHz < fRF ≤ 6000MHz
PABSCW3
PABSCW4
33
34
fRF > 6000MHz
PABSCW5
33
5MHz ≤ fRF ≤ 10MHz
PABSPK1
35
10MHz < fRF ≤ 25MHz
PABSPK2
37
25MHz < fRF ≤ 200MHz
PABSPK3
38
200MHz < fRF ≤ 6000MHz
PABSPK4
39
fRF > 6000MHz
PABSPK5
38
TJMAX
+140
°C
+150
°C
TLEAD
+260
°C
Electrostatic Discharge – HBM
(JEDEC/ESDA JS-001-2012)
VESDHBM
2500
(Class 2)
V
Electrostatic Discharge – CDM
(JEDEC 22-C101F)
VESDCDM
1000
(Class C3)
V
Maximum Input CW
Power, 50Ω, TEP = 25°C,
Vcc = 5.25V (any port,
insertion loss state) [a,b]
Maximum Peak Power,
50Ω, TEP = 25°C,
Vcc = 5.25V (any port,
insertion loss state) [a, b, c]
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10s)
TST
-65
dBm
dBm
a. In a 50Ω system, dBmV = dBm [50Ω] + 47.
In a 75Ω system, dBmV = dBm [75Ω] + 48.75.
b. TEP = Temperature of the exposed paddle.
c. 5 % duty cycle of a 4.6ms period.
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F2976 Datasheet
Recommended Operating Conditions
Table 3.
Recommended Operating Conditions
Parameter
Symbol
Supply Voltage
VCC
Operating Temperature Range
TEP
RF Frequency Range
fRF
Maximum Operating Input Power
PMAX
Port Impedance (RFC, RF1, RF2)
ZRF
Condition
Minimum
Typical
Maximum
Units
2.5
3.3
5.25
V
-40
+105
°C
75Ω
0.005
1.8
50Ω
0.005
10
Exposed Paddle
Insertion Loss State
ZS = ZL = 50Ω
See Figure 3 [a]
75Ω System
75
50Ω System
50
GHz
dBm
Ω
a. In a 50Ω system, dBmV = dBm [50Ω] + 47. In a 75Ω system, dBmV = dBm [75Ω] + 48.75.
Figure 3.
Maximum Operating RF Input Power (ZS = ZL = 50Ω)
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F2976 Datasheet
General Specifications
Table 4.
General Specifications
See F2976 Typical Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C, LS = HIGH, single tone signal
applied at RF1 or RF2 and measured at RFC, unless otherwise noted.
Parameter
Symbol
Condition
Minimum
Typical
Maximum
Units
Logic Input High Threshold
VIH
VCTL, LS pins
1.17 [b]
Lower of
( VCC, 3.6 )
V
Logic Input Low Threshold
VIL
VCTL, LS pins
-0.3
0.6
V
-10 [a]
+10
µA
150
µA
25
kHz
Logic Current
IIH, IIL
DC Current (VCC)
Switching Rate
VCTL, LS pins (each pin)
ICC
80
SWRATE
Peak transient during
switching. ZS = ZL = 75Ω.
Maximum Video Feed-Through,
VIDFT
Measured with 20ns rise time,
RFC Port
0V to 3.3V (3.3V to 0V)
control pulse applied to VCTL.
[c]
Switching Time
SWTIME
50% VCTL to 90% or 10% RF
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. Measured at fRF = 1GHz.
© 2017 Integrated Device Technology, Inc.
5
5
1.5
mVp-p
3
µs
Rev O April 19, 2017
F2976 Datasheet
Electrical Characteristics
Table 5.
Electrical Characteristics - 75Ω SPECIFICATION
See F2976 75Ω Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C. ZS = ZL = 75Ω, LS = HIGH, single tone
signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are de-embedded, unless otherwise noted.
Parameter
Symbol
Insertion Loss (RFC to RF1, RF2)
Isolation (All Paths)
IL
ISO1
Return Loss (RFC, RF1, RF2)
(Insertion Loss States)
RL
Condition
Minimum
0.20
5MHz < fRF ≤ 204MHz
0.23
0.43 [b]
204MHz < fRF ≤ 1.2GHz
0.32
0.52
1.2GHz < fRF ≤ 1.8GHz
0.34
0.54
fRF = 5MHz
77
5MHz < fRF ≤ 204MHz
60
204MHz < fRF ≤ 1.2GHz
44
1.2GHz < fRF ≤ 1.8GHz
fRF = 5MHz
40
35
5MHz < fRF ≤ 204MHz
30
204MHz < fRF ≤ 1.2GHz
17
fIN = 27MHz POUT = 20dBm
3rd
Harmonic
H2
Harmonic
Input 0.1dB Compression Point [d]
(RFC to RF1, RF2)
H3
P0.1dB
Composite Second Order
CSO
Composite Triple Beat
CTB
Maximum
fRF = 5MHz
1.2GHz < fRF ≤ 1.8GHz
2nd
Typical
dB
dB
dB
16
-80
-70
fIN = 204MHz POUT = 20dBm
-100
-90
fIN = 800MHz POUT = 20dBm
-120
-110
fIN = 17MHz POUT = 20dBm
-95
-80
fIN = 204MHz POUT = 20dBm
-120
-105
fIN = 800MHz POUT = 20dBm
-115
-100
[c]
fRF = 5MHz
37
fRF = 204MHz
37
fRF = 1.8GHz
38
41dBmV / channel
137 channels [e]
Units
dBc
dBc
dBm
>100
dBc
>100
a.
b.
c.
d.
Items in min/max columns in bold italics are guaranteed by test.
Items in min/max columns that are not bold italics are guaranteed by design characterization.
dBmV = dBm [75Ω] + 48.75.
The input 0.1dB compression point is a linearity figure of merit. Refer to Figure 3 for the maximum operating RF input
power levels.
e. Total power = -7.75 dBm [75Ω] + 10*log (137) = +13.62 dBm [75Ω].
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Electrical Characteristics
Table 6.
Electrical Characteristics - 50Ω SPECIFICATION
See F2976 50Ω Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C. ZS = ZL = 50Ω, LS = HIGH, single tone
signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are de-embedded, unless otherwise noted.
Parameter
Symbol
Insertion Loss
(RFC to RF1, RF2)
Isolation
(RFC to RF1, RF2)
Isolation
(RF1 to RF2, RF2 to RF1)
IL
ISO1
ISO2
Return Loss (RFC, RF1, RF2)
(Insertion loss states)
RL
Condition
Minimum
Typical
Maximum
fRF = 5MHz
0.25
0.45 [b]
5MHz < fRF ≤ 1GHz
0.33
0.53
1GHz < fRF ≤ 2GHz [c]
0.36
0.56 [a]
2GHz < fRF ≤ 3GHz
0.40
3GHz < fRF ≤ 6GHz
0.45
6GHz < fRF ≤ 8GHz
0.55
8GHz < fRF ≤ 9GHz
0.65
9GHz < fRF ≤ 10GHz
0.80
5MHz < fRF ≤ 1GHz
43
48
1GHz < fRF ≤ 2GHz
36
42
2GHz < fRF ≤ 3GHz
31
37
3GHz < fRF ≤ 6GHz
27
6GHz < fRF ≤ 8GHz
22
8GHz < fRF ≤ 10GHz
18
5MHz < fRF ≤ 1GHz
40
45
1GHz < fRF ≤ 2GHz
33
38
2GHz < fRF ≤ 3GHz
29
34
3GHz < fRF ≤ 6GHz
6GHz < fRF ≤ 8GHz
26
21
8GHz < fRF ≤ 10GHz
18
5MHz < fRF ≤ 1GHz
28
1GHz < fRF ≤ 2GHz
26
2GHz < fRF ≤ 3GHz
26
3GHz < fRF ≤ 6GHz
25
6GHz < fRF ≤ 8GHz
23
8GHz < fRF ≤ 9GHz
18
9GHz < fRF ≤ 10GHz
16
Units
dB
dB
dB
dB
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. Minimum or maximum specification guaranteed by test at 2GHz and by design characterization over the whole
frequency range.
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Electrical Characteristics
Table 7.
Electrical Characteristics - 50Ω SPECIFICATION
See F2976 50Ω Application Circuit. Specifications apply when operated with VCC = +3.3V, TEP = +25°C. ZS = ZL = 50Ω, LS = HIGH, single tone
signal applied at RF1 or RF2 and measured at RFC, EVKit trace and connector losses are de-embedded, unless otherwise noted.
Parameter
Input 0.1dB Compression [c]
Input IP3
(RF1, RF2 to RFC)
Input IP2
(RF1, RF2 to RFC)
Symbol
Minimum
Typical
fRF = 2.4GHz
40
fRF = 6.0GHz
40
fRF = 8.0GHz
40
IIP3
fRF = 2.4GHz
PIN = +24dBm/tone
100MHz spacing
77
IIP2
f1 = 700MHz
f2 = 1.7GHz
PIN = +24dBm/tone
Measure 2.4GHz product
f1 = 2.4GHz
f2 = 3.5GHz
PIN = +24dBm/tone
Measure 5.9GHz product
P0.1dB
Maximum
dBm
125
dBm
120
-100
-90 [b]
fIN = 5.9GHz, PIN = +24dBm
-90
-80
fIN = 2.4GHz, PIN = +24dBm
-110
-95
fIN = 5.9GHz, PIN = +24dBm
-100
-85
PSPUR1
fOUT ≥ 5MHz
All unused ports terminated
-133
PSPUR2
fOUT < 5 MHz
All unused ports terminated
-120
H2
Third Harmonic
(RF1, RF2 to RFC)
H3
Units
dBm
fIN = 2.4GHz, PIN = +24dBm
Second Harmonic
(RF1, RF2 to RFC)
Spurious Output
(No RF Applied)
Condition
dBc
dBc
dBm
a. Items in min/max columns in bold italics are guaranteed by test.
b. Items in min/max columns that are not bold italics are guaranteed by design characterization.
c. The input 0.1dB compression point is a linearity figure of merit. Refer to Figure 3 for the maximum RF operating input
power levels.
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Thermal Characteristics
Table 8.
Package Thermal Characteristics
Parameter
Symbol
Value
Units
Junction to Ambient Thermal Resistance
θJA
102
°C/W
Junction to Case Thermal Resistance
(Case is defined as the exposed paddle)
θJC_BOT
56
°C/W
Moisture Sensitivity Rating (Per J-STD-020)
MSL 1
Typical Operating Conditions (TOCs)
Unless otherwise noted:
VCC = +3.3V
LS = HIGH
ZL = ZS = 75Ω
ZL = ZS = 50Ω
All temperatures are referenced to the exposed paddle
Evaluation Kit traces and connector losses are de-embedded
© 2017 Integrated Device Technology, Inc.
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F2976 Datasheet
Typical Performance Characteristics - 75Ω Performance
Figure 4.
RF1 to RFC Insertion Loss
Figure 5.
0.00
0.00
-0.05
-40 C / 2.5 V
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-0.05
-0.10
Insertion Loss (dB)
-0.10
Insertion Loss (dB)
RF2 to RFC Insertion Loss
-0.15
-0.20
-0.25
-0.30
-0.35
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-0.15
-0.20
-0.25
-0.30
-0.35
-0.40
-0.40
-0.45
-0.45
-0.50
-40 C / 2.5 V
-0.50
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
1.0
Frequency (GHz)
Figure 6.
RF1 to RFC Isolation [RF2 On State]
Figure 7.
0
-40 C / 2.5 V
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
2.5
3.0
RF2 to RFC Isolation [RF1 On State]
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-10
-20
Isolation (dB)
-20
Isolation (dB)
2.0
0
-10
-30
-40
-50
-60
-40 C / 2.5 V
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-30
-40
-50
-60
-70
-70
-80
-80
-90
-90
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
1.0
Frequency (GHz)
Figure 8.
1.5
2.0
2.5
3.0
Frequency (GHz)
RF1 to RF2 Isolation [RF1 On State]
Figure 9.
0
RF1 to RF2 Isolation [RF2 On State]
0
-10
-40 C / 2.5 V
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-10
-40 C / 2.5 V
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-20
Isolation (dB)
-20
Isolation (dB)
1.5
Frequency (GHz)
-30
-40
-50
-60
-30
-40
-50
-60
-70
-70
-80
-80
-90
-90
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
Frequency (GHz)
© 2017 Integrated Device Technology, Inc.
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
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Rev O April 19, 2017
F2976 Datasheet
Typical Performance Characteristics - 75Ω Performance
Figure 10. RFC Return Loss [RF1 On State]
Figure 11. RFC Return Loss [RF2 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-5
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-5
-15
-20
-25
-40 C / 5.25 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-15
-20
-25
-30
-30
-35
-35
-40
-40
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
0.5
Frequency (GHz)
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
Figure 12. RF1 Return Loss [RF1 On State]
Figure 13. RF2 Return Loss [RF2 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-5
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-5
-40 C / 2.5 V
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-10
Match (dB)
-10
Match (dB)
-40 C / 3.3 V
25 C / 2.5 V
-10
Match (dB)
Match (dB)
-10
-40 C / 2.5 V
-15
-20
-25
-15
-20
-25
-30
-30
-35
-35
-40
-40
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0
Frequency (GHz)
© 2017 Integrated Device Technology, Inc.
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
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F2976 Datasheet
Typical Performance Characteristics - 50Ω Performance
Figure 14. RF1 to RFC Insertion Loss
Figure 15. RF2 to RFC Insertion Loss
0.0
0.0
-0.1
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-0.1
-0.2
Insertion Loss (dB)
Insertion Loss (dB)
-0.2
-40 C / 2.5 V
-0.3
-0.4
-0.5
-0.6
-0.7
-40C / 3.3V
-40C / 5.25V
25C / 2.5V
25C / 3.3V
25C / 5.25V
105C / 2.5V
105C / 3.3V
105C / 5.25V
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.8
-0.9
-0.9
-1.0
-40C / 2.5V
-1.0
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
Frequency (GHz)
Figure 16. RF1 to RFC Isolation [RF2 On State]
6
7
8
9
10
0
-10
-40 C / 2.5 V
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-10
-20
Isolation (dB)
-20
Isolation (dB)
5
Figure 17. RF2 to RFC Isolation [RF1 On State]
0
-30
-40
-50
-60
-40 C / 2.5 V
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-30
-40
-50
-60
-70
-70
-80
-80
-90
-90
0
1
2
3
4
5
6
7
8
9
0
10
1
2
3
4
5
6
7
8
9
10
Frequency (GHz)
Frequency (GHz)
Figure 18. RF1 to RF2 Isolation [RF1 On State]
Figure 19. RF1 to RF2 Isolation [RF2 On State]
0
0
-10
-40 C / 2.5 V
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-10
-20
-40 C / 2.5 V
-40 C / 3.3 V
-40 C / 5.25 V
25 C / 2.5 V
25 C / 3.3 V
25 C / 5.25 V
105 C / 2.5 V
105 C / 3.3 V
105 C / 5.25 V
-20
Isolation (dB)
Isolation (dB)
4
Frequency (GHz)
-30
-40
-50
-60
-30
-40
-50
-60
-70
-70
-80
-80
-90
-90
0
1
2
3
4
5
6
7
8
9
10
0
Frequency (GHz)
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2
3
4
5
6
7
8
9
10
Frequency (GHz)
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F2976 Datasheet
Typical Performance Characteristics - 50Ω Performance
Figure 20. RFC Return Loss [RF1 On State]
Figure 21. RFC Return Loss [RF2 On State]
0
0
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-5
-10
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-5
-10
-20
-25
-30
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-20
-25
-30
-35
-35
-40
-40
-45
-45
-50
-50
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
Frequency (GHz)
5
6
7
8
9
10
Frequency (GHz)
Figure 22. RF1 Return Loss [RF1 On State]
Figure 23. RF2 Return Loss [RF2 On State]
0
0
-5
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-10
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-5
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-10
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-40 C / 5.25 V
25 C / 5.25 V
105 C / 5.25 V
-15
Match (dB)
-15
Match (dB)
-40 C / 3.3 V
25 C / 3.3 V
105 C / 3.3 V
-15
Match (dB)
-15
Match (dB)
-40 C / 2.5 V
25 C / 2.5 V
105 C / 2.5 V
-20
-25
-30
-20
-25
-30
-35
-35
-40
-40
-45
-45
-50
-50
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
4
5
6
7
Frequency (GHz)
Frequency (GHz)
Figure 24. Switching Time
[Isolation to Insertion Loss State]
Figure 25. Switching Time
[Insertion Loss to Isolation State]
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F2976 Datasheet
Control Mode
Table 9.
Switch Control Truth Table
VCTL (pin 10)
LS (pin 11)
Switch State
HIGH
HIGH
RFC to RF2 Insertion Loss State
LOW
HIGH
RFC to RF1 Insertion Loss State
HIGH
LOW
RFC to RF1 Insertion Loss State
LOW
LOW
RFC to RF2 Insertion Loss State
Application Information
Power Supplies
A common VCC power supply should be used for all pins requiring DC power. All supply pins should be bypassed with external capacitors to
minimize noise and fast transients. Supply noise can degrade noise figure and fast transients can trigger ESD clamps and cause them to fail.
Supply voltage change or transients should have a slew rate smaller than 1V / 20µs. In addition, all control pins should remain at 0V (+/-0.3V)
while the supply voltage ramps up or while it returns to zero.
Control Pin Interface
If control signal integrity is a concern and clean signals cannot be guaranteed due to overshoot, undershoot, ringing, etc., the following circuit
at the input of each control pin is recommended. This applies to control pins 7 and 8 as shown below.
Figure 26. Control Pin Interface Schematic
5kΩ
LS
2 pF
5kΩ
VCT L
VCC
2 pF
12
GND
1
RF2
2
GND
3
11
10
F2972
9
GND
8
RF1
7
GND
© 2017 Integrated Device Technology, Inc.
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RFC
6
GND
4
GND
EP
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F2976 Datasheet
75Ω Evaluation Kit Picture
Figure 27. Top View (75Ω)
Figure 28. Bottom View (75Ω)
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F2976 Datasheet
50Ω Evaluation Kit Picture
Figure 29. Top View (50Ω)
Figure 30. Bottom View (50Ω)
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F2976 Datasheet
75Ω Evaluation Kit / Applications Circuit
Figure 31. Electrical Schematic (75Ω)
Note: The F2976 75U EVKit reuses the 75U PCB from the F2972 and requires pin 1 of the F2976 to be rotated by 90 degrees
clockwise from the F2972 PCB pin 1 marking, for proper assembly.
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F2976 Datasheet
50Ω Evaluation Kit / Applications Circuit
Figure 32. Electrical Schematic (50Ω)
Note: The F2976 50U EVKit reuses the 50U PCB from the F2972 and requires pin 1 of the F2976 to be rotated by 90 degrees
clockwise from the F2972 PCB pin 1 marking, for proper assembly.
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F2976 Datasheet
Table 10.
75Ω Bill of Material (BOM)
Part Reference
QTY
C1
1
C2, C4
Description
Manufacturer Part #
Manufacturer
0.1µF ±10%, 16V, X7R, Ceramic Capacitor (0402)
GRM155R71C104KA88D
Murata
2
100pF ±5% 50V, C0G, Ceramic Capacitor (0402)
GRM1555C1H101JA01D
Murata
C3
1
0.01µF ±5% 50V, X7R, Ceramic Capacitor (0603)
GRM188R71H103JA01D
Murata
R2, R3
J1 – J5
2
5
100U 1/10W, Resistor (0402)
F-Type Edge Mount
ERJ-2RKF1000X
222181
Panasonic
Amphenol RF
J6
1
Conn Header Vert 5x1 Pos Gold
68002-205HLF
Amphenol FCI
U1
1
SP2T Switch 2mm x 2mm 12-pin TQFN
F2976NEGK
IDT
1
Printed Circuit Board [a]
F2972 75U PCB
IDT
a. The F2976 75U EVKit reuses the 75U PCB from the F2972 and requires pin 1 of the F2976 to be rotated by 90 degrees
clockwise from the F2972 PCB pin 1 marking, for proper assembly.
Table 11.
50Ω Bill of Material (BOM)
Part Reference
QTY
Description
Manufacturer Part #
Manufacturer
C1 – C7
0
Not Installed (0402)
R1– R3
3
0U 1/10 W, Resistor (0402)
ERJ-2GE0R00X
Panasonic
J1 – J5
5
SMA Edge Mount
142-0761-881
Cinch Connectivity
J6
1
Conn Header 10 Pos 0.100” Str 15 Au
68602-210HLF
Amphenol FCI
TP1, TP2, TP3, TP4,
TP5
0
Not Installed Test Point Loop
U1
1
SP2T Switch 2mm x 2mm 12-pin TQFN
F2976NEGK
IDT
1
Printed Circuit Board [a]
F2972 50U PCB
IDT
a. The F2976 50U EVKit reuses the 50U PCB from the F2972 and requires pin 1 of the F2976 to be rotated by 90 degrees
clockwise from the F2972 PCB pin 1 marking, for proper assembly.
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F2976 Datasheet
Evaluation Kit (EVKit) Operation
External Supply Setup
Set up a VCC power supply in the voltage range of 2.5V to 5.25V with the power supply output disabled.
For the 75U EVKit, connect the disabled Vcc supply connection to J6 pin 2 and GND to J6 pins 1 or 5.
For the 50U EVKit, connect the disabled Vcc supply connection to J6 pin 3 and GND to J6 pin 1, 2, 4, 6, 8, 9, or 10.
Logic Control Setup
With the logic control lines disabled set the HIGH and LOW logic levels to satisfy the levels stated in the electrical specifications table.
For the 75U EVKit, connect the disabled logic control lines to J6 EN (pin 3) and VCTL (pin 4).
For the 50U EVKit, connect the disabled logic control lines to J6 EN / LS (pin 5) and VCTL (pin 7).
See Table 9 for the logic truth table.
Turn On Procedure
Setup the supplies and EVKit as noted in the External Supply Setup and Logic Control Setup sections above.
Enable the VCC supply.
Enable the logic control signals.
Set the logic settings to achieve the desired Table 9 configuration. Note that external control logic should not be applied without VCC being
present.
Turn Off Procedure
Set the logic control pins to a logic LOW.
Disable the VCC supply.
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F2976 Datasheet
Package Drawings
Figure 33. Package Outline Drawing NEG12 PSC-4642
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F2976 Datasheet
Recommended Land Pattern
Figure 34. Recommended Land Pattern NEG12 PSC-4642
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F2976 Datasheet
Marking Diagram
2976
YW**
Line 1 Line 2 Line 2 Line 2 -
2976 = Abbreviated part number.
Y = Year code.
W = Work week code.
** = Sequential alpha for lot traceability.
Ordering Information
Orderable Part Number
Package
MSL Rating
Shipping Packaging
Temperature
F2976NEGK
2mm x 2mm x 0.5mm 12-VFQFP-N
MSL1
Cut Reel
-40°C to +105°C
F2976NEGK8
2mm x 2mm x 0.5mm 12-VFQFP-N
MSL1
Tape and Reel
-40°C to +105°C
F2976EVBI-75OHM
75Ω Evaluation Board
F2976EVBI-50OHM
50Ω Evaluation Board
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F2976 Datasheet
Revision History
Revision
Revision Date
Rev O
2017-Apr-19
Description of Change
Initial Release
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Fax: 408-284-2775
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www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time,
without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same
way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability
of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not
convey any license under intellectual property rights of IDT or any third parties.
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Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2017 Integrated Device Technology, Inc.
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