ON NCP4632BDT08T5G 3a, low voltage, low dropout linear voltage regulator with reverse current protection Datasheet

NCP4632
3A, Low Voltage, Low
Dropout Linear Voltage
Regulator with Reverse
Current Protection
The NCP4632 is a CMOS Linear voltage regulator with high output
current capability (up to 3 A). This device can provide output voltages
as low as 0.8 V while maintaining a low dropout voltage of 510 mV
typ. at full load. The NCP4632 is designed to draw only 350 mA of
supply current and less than 1 mA in standby mode to minimize current
consumption for battery operated applications. The device has a high
accuracy output voltage of ±1% along with soft−start and reverse
current protection circuits to protect the device and the application.
The NCP4632 is available in a Pb−Free DPAK−5 package in both
fixed and adjustable output voltage options. The output voltage for the
fixed options can be modified in 0.1 V steps from 0.8 V to 4.2 V
Please contact your sales office for any additional fixed voltage
outputs to those already listed.
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MARKING
DIAGRAMS
E1Jxx1
yy
zz
DPAK−5
CASE 369AE
1 2 3 4 5
Features
• Operating Input Voltage Range: 1.6 V to 5.25 V
• Output Voltage Range: 0.8 to 4.5 V (0.1 V steps for fixed options)
• Supply current: Typical Operation Mode − 350.0 mA
•
•
•
•
•
•
Standby Mode
− 1.0 mA
Dropout Voltage:
150 mV Typ. at IOUT = 1 A, VOUT = 2.5 V
510 mV Typ. at IOUT = 3 A, VOUT = 2.5 V
±1% Output Voltage Accuracy
Line Regulation 0.15%/V Typ.
Current Fold Back Protection Typ. 220 mA
Stable with Ceramic Capacitors
Available in DPAK−5 Package (TO252−5)
These are Pb−Free Devices
•
•
•
•
Battery Powered Equipments
Portable Communication Equipments
Cameras, VCRs and Camcorders
Home appliances
•
xx
YY
= Specific Device Code
= B − Without Active Discharge
= D − With Active Discharge
= Lot Number
zz
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 13 of this data sheet.
Typical Applications
NCP4632 (Fixed)
VIN
VIN
VOUT
VIN
VOUT
NCP4632 (Adj)
VIN
VOUT
R1
C1
10m
CE
SENSE
GND
C2
10m
C1
10m
CE
GND
VADJ
R2
VOUT
C2
10m
Figure 1. Typical Application Schematics
© Semiconductor Components Industries, LLC, 2012
June, 2012 − Rev. 0
1
Publication Order Number:
NCP4632/D
NCP4632
VIN
VIN
VOUT
VOUT
SENSE/
ADJ
SENSE/ADJ
Vref
Vref
Current Limit
Thermal Protection
CE
Current Limit
Thermal Protection
CE
GND
GND
Reverse Detector
Reverse Detector
NCP4632B
NCP4632D
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
TO252−5−P2
Pin Name
4
VOUT
2
VIN
3
GND (Note 1)
1
CE
5
SENSE / ADJ
Description
Output Voltage Pin
Input Voltage Pin
Ground Pin
Chip Enable Pin, Active “H”, Connect to VIN pin if not used.
Sense Pin on Fixed Options, ADJ for Adjustable
1. TAB is internally connected to pin 3 GND.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VIN
6.0
V
Output Voltage
VOUT
−0.3 to VIN + 0.3
V
Chip Enable Input
VCE
−0.3 to 6.0
V
Vsense
−0.3 to 6.0
V
IOUT
3000
mA
Input Voltage
Sense Input
Output Current
Power Dissipation (Note 2)
PD(MAX)
3800
mW
Storage Temperature
TSTG
−55 to 125
°C
Operating Temperature
TOP
−40 to 85
°C
ESD Capability, Human Body Model (Note 3)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 3)
ESDMM
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard 76.2mm x 114.3 mm, FR4 Four−layers board
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, DPAK−5
Thermal Resistance, Junction−to−Air
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Symbol
Value
Unit
RqJA
7
°C/W
NCP4632
ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 85°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA; CIN = COUT = 10 mF; unless otherwise
noted. Typical values are at TJ = +25°C.
Parameter
Test Conditions
Operating Input Voltage (Note 4)
Output Voltage
Symbol
Min
VIN
VOUT
x1.02
V
−45
30
mV
0.808
V
TJ = +25°C,
IOUT = 5 mA
VOUT = ADJ
1 mA ≤ IOUT < 300 mA
TJ = +25°C,
IOUT = 1000 mA
VOUT = 3.3 V
IOUT = 3000 mA
VADJ
0.792
3
LoadReg
%/V
−15
2
20
−70
3
50
VDO
100
0.9 V ≤ VOUT < 1.0 V
0.865
1.000
1.0 V ≤ VOUT < 1.1 V
0.810
0.950
0.755
0.895
VDO
0.720
0.840
1.5 V ≤ VOUT < 2.5 V
0.630
0.760
2.5 V ≤ VOUT < 3.3 V
0.510
0.600
3.3 V ≤ VOUT < 4.2 V
0.480
0.560
VOUT ≤ 1.5 V
ISC
220
IQ
390
450
350
430
VOUT > 1.5 V
IOUT = 3000 mA
IGND
VCE = 5.25 V, TJ = 25°C
ISTB
CE Input Voltage “H”
VCEH
CE Input Voltage “L”
VCEL
CE Pull Down Current
mV
mV
1.110
VOUT = 0 V
IOUT = 0 mA,
VIN = 5.25 V
A
0.15
0.910
1.2 V ≤ VOUT < 1.5 V
Short Current Limit
0.8
0.8 V ≤ VOUT < 0.9 V
1.1 V ≤ VOUT < 1.2 V
Reverse Current Limit
mV
x0.97
1 mA ≤ IOUT < 3000 mA
Auto Discharge Low Output Nch Tr.
On Resistance
V
VOUT ≤ 2 V
Load Regulation
Output Noise Voltage
x1.01
VOUT > 2 V
IOUT
Power Supply Rejection Ratio
x0.99
15
LineReg
CE Pin Threshold Voltage
V
−15
TJ = −40 to 85°C
Standby Current
5.25
VOUT ≤ 1.5 V
VIN = VOUT + 0.5 V to 5 V, IOUT = 1 mA
VIN ≥ 1.6 V for NCP4632xDT08T5G, IOUT = 1 mA
Supply Current
1.6
−40°C ≤ TJ ≤ 85°C,
IOUT = 5 mA
Line Regulation
Quiescent Current
Unit
VOUT > 1.5 V
Output Current
Dropout Voltage
Max
TJ = +25°C,
IOUT = 5 mA
Output Voltage (Adjustable Option)
Dropout Voltage
Typ
V
mA
450
1
mA
mA
mA
V
1.0
0.4
ICEPD
0.3
0.6
VIN = VOUT + 1 V or 2.2 V whichever is higher,
DVIN = 0.2 Vpk−pk, IOUT = 300 mA, f = 1 kHz
PSRR
55
dB
VOUT = 1.5 V, IOUT = 300 mA, f = 10 Hz to 100 kHz
VN
60
mVrms
VIN = 4 V, VCE = 0 V
RLOW
30
W
VOUT > 0.5 V, 0 V ≤ VIN < 5.25 V
IREV
10
mA
mA
4. The maximum Input Voltage of the ELECTRICAL CHARACTERISTICS is 5.25 V. In case of exceeding this specification, the IC must be
operated on condition that the Input Voltage is up to 5.5 V and the total operating time is within 500 hrs.
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3
NCP4632
0.9
1.6
0.8
1.4
0.7
0.6
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
TYPICAL CHARACTERISTICS
1 mA
0.5
10 mA
0.4
100 mA
0.3
1A
0.2
2A
1A
0.6
100 mA
0.4
10 mA
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 3. Output Voltage vs. Input Voltage at
NCP4632xDT08
Figure 4. Output Voltage vs. Input Voltage at
NCP4632xDT15
2.5
3.0
OUTPUT VOLTAGE (V)
3.5
2.0
2A
1.5
1A
1.0
100 mA
10 mA
1 mA
0.5
2.5
2.0
1.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 5. Output Voltage vs. Input Voltage at
NCP4632xDT28
Figure 6. Output Voltage vs. Input Voltage at
NCP4632xDT33
350
400
300
250
200
150
TA = 25°C
Iout = 0
Cin = Cout = 10 mF
0
100 mA
10 mA
1 mA
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
450
0
1A
1.0
400
50
2A
0.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
100
1 mA
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
QUIESCENT CURRENT (mA)
OUTPUT VOLTAGE (V)
QUIESCENT CURRENT (mA)
2A
0.8
3.0
0.0
3A
1.0
0.2
0.1
0.0
1.2
350
300
250
200
150
100
TA = 25°C
Iout = 0
Cin = Cout = 10 mF
50
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 7. Quiescent Current vs. Input Voltage
at NCP4632xDT08
Figure 8. Quiescent Current vs. Input Voltage
at NCP4632xDT15
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NCP4632
450
450
400
400
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
TYPICAL CHARACTERISTICS
350
300
250
200
150
100
TA = 25°C
Iout = 0
Cin = Cout = 10 mF
50
0
0
150
100
TA = 25°C
Iout = 0
Cin = Cout = 10 mF
50
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Figure 10. Quiescent Current vs. Input Voltage
at NCP4632xDT33
1.6
1.4
Vin = 1.8 V
0.7
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
200
INPUT VOLTAGE (V)
0.6
0.5
0.4
Vin = 3 V
0.3
0.2
Vin = 5.5 V
TA = 25°C
Cin = Cout = 10 mF
0.1
0
1
2
3
4
5
6
1.2
Vin = 5.5 V
1
0.8
Vin = 2.5 V
0.6
0.4
Vin = 3.5 V
0.2
TA = 25°C
Cin = Cout = 10 mF
0
0
7
1
2
3
4
5
6
OUTPUT CURRENT (A)
OUTPUT CURRENT (mA)
Figure 11. Output Voltage vs. Output Current
at NCP4632xDT08
Figure 12. Output Voltage vs. Output Current
at NCP4632xDT15
4
7
0.6
DROPOUT VOLTAGE (V)
3.5
OUTPUT VOLTAGE (V)
250
Figure 9. Quiescent Current vs. Input Voltage
at NCP4632xDT28
0.8
3
2.5
2
Vin = 5.5 V
1.5
Vin = 5 V
Vin = 4.3 V
1
0.5
0
300
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.9
0
350
TA = 25°C
Cin = Cout = 10 mF
0
1
2
3
4
5
6
7
0.5
0.4
85°C
0.2
40°C
0.1
0
8
25°C
0.3
0
0.5
1
1.5
2
2.5
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
Figure 13. Output Voltage vs. Output Current
at NCP4632xDT33
Figure 14. Dropout Voltage vs. Output Current
at NCP4632xDT15
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3
NCP4632
0.4
0.4
0.35
0.35
0.3
DROPOUT VOLTAGE (V)
DROPOUT VOLTAGE (V)
TYPICAL CHARACTERISTICS
85°C
0.25
0.2
25°C
0.15
40°C
0.1
0.5
0
1
1.5
2
2.5
25°C
0.2
0.15
40°C
0.1
0
0.5
1
1.5
2
2.5
3
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
Figure 15. Dropout Voltage vs. Output Current
at NCP4632xDT28
Figure 16. Dropout Voltage vs. Output Current
at NCP4632xDT33
100
90
80
Iout = 1 mA
70
70
PSRR (dB)
50
40
30
10
10
40
100
Iout = 1 A
10
1000
0
0.1
1
10
100
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 17. PSRR vs. Frequency at
NCP4632xDT08
Figure 18. PSRR vs. Frequency at
NCP4632xDT15
1000
70
90
80
Iout = 1 mA
60
Iout = 1 mA
70
50
PSRR (dB)
60
50
40
30
Iout = 100 mA
20
1
10
40
Iout = 100 mA
30
20
Iout = 1 A
10
0
0.1
Iout = 100 mA
50
20
Iout = 1 A
1
60
30
Iout = 100 mA
20
0
0.1
Iout = 1 mA
80
60
PSRR (dB)
0.25
0
3
90
PSRR (dB)
85°C
0.05
0.05
0
0.3
100
Iout = 1 A
10
1000
0
0.1
1
10
100
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 19. PSRR vs. Frequency at
NCP4632xDT28
Figure 20. PSRR vs. Frequency at
NCP4632xDT33
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1000
NCP4632
TYPICAL CHARACTERISTICS
4.5
Vin = 1.8 V
Iout = 100 mA
Cin = Cout = 10 mF
2.0
Vin = 2.5 V
Iout = 100 mA
Cin = Cout = 10 mF
4.0
NOISE DENSITY (mV/√HZ)
NOISE DENSITY (mV/√HZ)
2.5
1.5
1.0
0.5
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.01
0.1
1
10
1000
0.0
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 21. Output Noise Density vs. Frequency
at NCP4632xDT08
Figure 22. Output Noise Density vs. Frequency
at NCP4632xDT15
9
9
Vin = 3.8 V
Iout = 100 mA
Cin = Cout = 10 mF
7
Vin = 4.3 V
Iout = 100 mA
Cin = Cout = 10 mF
8
NOISE DENSITY (mV/√HZ)
8
6
5
4
3
2
7
6
5
4
3
2
1
1
0
0.01
0.1
1
10
100
0
0.01
1000
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 23. Output Noise Density vs. Frequency
at NCP4632xDT28
Figure 24. Output Noise density vs. Frequency
at NCP4632xDT33
4.0
3.0
1.0
0.810
0.0
0.805
0.800
Vin = 1.8 V to 2.8 V
Iout = 50 mA
Cin = 0, Cout = 10 mF
0.795
0.790
0
10
20
30
40
50
60
t (ms)
Figure 25. Line Transient Response at
NCP4632xDT08
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70
Vin (V)
2.0
Vout (V)
NOISE DENSITY (mV/√HZ)
100
NCP4632
TYPICAL CHARACTERISTICS
6.0
3.310
4.0
3.305
3.0
Vin (V)
Vout (V)
5.0
3.300
Vin = 4.3 V to 5.3 V
Iout = 50 mA
Cin = 0, Cout = 10 mF
3.295
3.290
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
t (ms)
600
500
400
300
200
100
0
0.82
0.81
0.80
0.79
0.78
0.77
0
10
20
30
Iout (mA)
Vout (V)
Figure 26. Line Transient Response at
NCP4632xDT33
Vin = 1.8 V
Iout = step 5 mA to 500 mA
Cin = Cout = 10 mF
40
50
60
70
t (ms)
3.32
3.31
3.30
3.29
3.28
3.27
600
500
400
300
200
100
0
Vin = 5.3 V
Iout = step 5 mA to 500 mA
Cin = Cout = 10 mF
0
10
20
30
40
t (ms)
50
60
Figure 28. Load Transient Response at
NCP4632xDT33
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70
Iout (mA)
Vout (V)
Figure 27. Load Transient Response at
NCP4632xDT08
NCP4632
TYPICAL CHARACTERISTICS
4
2
Vin = 1.8 V
Iout = step 1 mA to 3 A
Slope 1 A/ms
Cin = Cout = 10 mF
1
0
Iout (A)
Vout (V)
3
0.85
0.80
0.75
0.70
0.0
0.2
0.4
0.6
0.8
t (ms)
1.0
1.2
1.4
Figure 29. Load Transient Response at
NCP4632xDT08
4
2
Vin = 5.3 V
Iout = step 1 mA to 3 A
Slope 1 A/ms
Cin = Cout = 10 mF
3.40
1
0
3.35
Iout (A)
Vout (V)
3
3.30
3.25
3.20
3.15
0.0
0.2
0.4
0.6
0.8
t (ms)
1.0
1.2
1.4
Figure 30. Load Transient Response at
NCP4632xDT33
2
1.6
Vout (V)
0.8
0.4
CE Pin Voltage
0
Iout = 1 mA
0.8
Iout = 10 mA
0.6
Iout = 100 mA
0.4
0.2
0
0
10
20
30
40
t (ms)
Figure 31. Turn Off with CE pin vs. Output
Current at NCP4632BDT08
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50
CE PIN VOLTAGE (V)
1.2
NCP4632
TYPICAL CHARACTERISTICS
2
1.6
Vout (V)
0.8
0.4
CE Pin Voltage
0
Iout = 1 mA
0.8
Iout = 10 mA
0.6
Iout = 100 mA
0.4
CE PIN VOLTAGE (V)
1.2
0.2
0
0
3
6
9
12
15
t (ms)
Figure 32. Turn Off with CE pin vs. Output
Current at NCP4632DDT08
2
1.2
Vout (V)
0.8
0.4
CE Pin Voltage
0
0.8
NCP4632BDT08,
Iout = 1 mA
0.6
0.4
NCP4632DDT08,
Iout = 1 mA
CE PIN VOLTAGE (V)
1.6
0.2
0
0
10
20
30
40
50
t (ms)
Figure 33. Turn Off with CE pin at
NCP4632xDT08, Iout = 1 mA
2
1
Vout (V)
0.5
Iout = 300 mA
0.8
0
Iout = 100 mA
0.6
0.4
Iout = 1 mA
0.2
0
0.0
0.1
0.2
0.3
0.4
t (ms)
Figure 34. Turn On with CE pin at
NCP4632xDT08
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0.5
CE PIN VOLTAGE (V)
1.5
CE Pin Voltage
NCP4632
TYPICAL CHARACTERISTICS
3
Vout (V)
1
Iout = 500 mA
1.6
1.2
0
Iout = 100 mA
0.8
Iout = 1 mA
0.4
CE PIN VOLTAGE (V)
2
CE Pin Voltage
0
0.0
0.1
0.2
t (ms)
0.3
0.4
0.5
Figure 35. Turn On with CE Pin at
NCP4632xDT15
5
CE Pin Voltage
4
Vout (V)
Iout = 1000 mA
2
3
1
2.5
0
2
Iout = 100 mA
1.5
Iout = 1 mA
1
CE PIN VOLTAGE (V)
3
0.5
0
0.0
0.1
0.2
0.3
0.4
0.5
t (ms)
Figure 36. Turn On with CE Pin at
NCP4632xDT28
5
4
Vout (V)
3.5
3
2
3
1
2.5
0
2
Iout = 1 mA
1.5
1
Iout = 100 mA
0.5
0
0.0
0.1
0.2
t (ms)
0.3
0.4
Figure 37. Turn On with CE Pin at
NCP4632xDT33
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0.5
CE PIN VOLTAGE (V)
Iout = 1000 mA
NCP4632
APPLICATION INFORMATION
A typical application circuit for NCP4632 series is shown
in Figure 38.
NCP4632 (Fixed)
VIN
C1
10m
VIN
VOUT
CE
SENSE
GND
V OUT + 0.8
VIN
R1
CE
C1
10m
GND
I ADJ + V SET
V OUT + 0.8
R1
VADJ
R2
I ADJ
(eq. 1)
R1
RADJ
(eq. 2)
By choosing R1 << RADJ (RADJ is typically around
1.6 MW), this value becomes very small in which case we
can omit the term R1 x IADJ in Equation 1. The simplified
equation for the output voltage calculation is shown in
Equation 3.
C2
10m
VOUT
R2
The current consumption IADJ flowing into the ADJ pin
can be described by Equation 2.
VOUT
NCP4632 (Adj)
VIN
ǒ1 ) R1Ǔ ) R1
ǒ1 ) R1Ǔ
(eq. 3)
R2
The resistor divider should be kept to values below
500 kW to ensure stability.
VOUT
C2
10m
Figure 38. Typical Application Schematic
Input Decoupling Capacitor (C1)
oncapc7EG
A 10 mF ceramic input decoupling capacitor should be
connected as close as possible to the input and ground pin of
the NCP4632. Higher values and lower ESR improves line
transient response.
VSET
VOUT
Output Decoupling Capacitor (C2)
A 10 mF ceramic output decoupling capacitor is sufficient
to achieve stable operation of the IC. If a tantalum capacitor
is used, and its ESR is high, loop oscillation may result.
Using multiple ceramic capacitors in parallel should be
avoided if possible as this can lead to unstable operation. The
Output capacitor should be connected as close as possible to
the output and ground pin. Larger capacitance values and
lower ESR improves dynamic parameters.
Figure 39. Output Voltage Setting
Output Discharger
The D version includes a transistor between VOUT and
GND that is used for faster discharging of the output
capacitor. This function is activated when the IC goes into
disable mode.
Enable Operation
Thermal
The Enable pin (CE) may be used for turning the regulator
on and off. The regulator is switched on when the CE pin
voltage is above logic high level. The Enable pin has an
internal pull down current source with a 300 nA current
capability. If the enable function is not needed, connect CE
pin to VIN pin.
As power across the IC increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature rise for the part.
That is to say, when the device has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
Output Voltage Setting
For the Adjustable version of the NCP4632, the output
voltage can be adjusted by using an external resister divider.
The output voltage can be calculated using Equation 1.
http://onsemi.com
12
NCP4632
PCB layout
regulator off as soon as VIN drops to < 30 mV above VOUT.
In this state, reverse current is restricted to less than 10 mA,
which flows to ground. As VIN recovers, the power device
is switched back on. In order to avoid unstable behavior,
there is a 5 mV hysteresis incorporated in the design which
will require the dropout to rise above 35 mV before the
power device is switched on again. Therefore, the minimum
voltage dropout of the device at small output current is
limited to 35 mV. Figures 40 and 41 show the diagrams of
both operating modes.
Make VIN and GND line sufficient. If their impedance is
high, noise pickup or unstable operation may result. Connect
capacitors C1 and C2 as close as possible to the IC, and make
wiring as short as possible.
Reverse Current Protection
The NCP4632 device include a Reverse Current
Protection Circuit, which stops a reverse current flowing
from the VOUT pin to the VIN or GND pin when the voltage
on VOUT becomes higher than VIN. The reverse current
protection circuitry switches the output power device of the
Vin
Vin
VOUT
Vout
SENSE
SENSE
Vref
Vref
Current
Limit
CE
CE
Current
Limit
Reverse Detector
Reverse Detector
GND
GND
Figure 40. Normal Operating Mode
Figure 41. Reverse Operating Mode
ORDERING INFORMATION
Nominal Output
Voltage
Description
Marking
Package
Shipping†
Adj
Adjustable, auto
discharge
E1J081D
DPAK−5
(Pb−Free)
3000 / Tape &
Reel
NCP4632BDT08T5G
0.8 V
W/O Auto discharge
E1J081B
DPAK−5
(Pb−Free)
3000 / Tape &
Reel
NCP4632DDT08T5G
0.8 V
Auto discharge
E1J081D
DPAK−5
(Pb−Free)
3000 / Tape &
Reel
NCP4632DDT15T5G
1.5 V
Auto discharge
E1J151D
DPAK−5
(Pb−Free)
3000 / Tape &
Reel
NCP4632DDT28T5G
2.8 V
Auto discharge
E1J281D
DPAK−5
(Pb−Free)
3000 / Tape &
Reel
NCP4632DDT33T5G
3.3 V
Auto discharge
E1J331D
DPAK−5
(Pb−Free)
3000 / Tape &
Reel
Device
NCP4632DDTADJT5G
NOTE:
The Adjustable and the 0.8 V fixed voltage option devices are interchangeable and have the same device marking. Evaluation
Boards are available for select devices. Consult our website for further details
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
13
NCP4632
PACKAGE DIMENSIONS
DPAK−5 (TO−252, 5 LEAD)
CASE 369AE−01
ISSUE O
C
A
E
b2
A
B
c2
L3
Z
D
H
DETAIL A
1
2 3
4
E2
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. THERMAL PAD CONTOUR OPTIONAL, WITHIN
DIMENSIONS b3, E2, L3 AND Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15mm PER SIDE. THESE
DIMENSIONS TO BE MEASURED AT DATUM H.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
c
e
b
TOP VIEW
0.12
M
SIDE VIEW
C A B
BOTTOM VIEW
H
RECOMMENDED
SOLDERING FOOTPRINT*
C
L2
GUAGE
PLANE
5.70
0.10 C
L
DIM
A
A1
b
b2
c
c2
D
E
E2
e
H
L
L1
L2
L3
Z
MILLIMETERS
MIN
MAX
2.10
2.50
0.00
0.13
0.40
0.60
5.14
5.54
0.40
0.60
0.40
0.60
5.90
6.30
6.40
6.80
5.04 REF
1.27 BSC
9.60
10.20
1.39
1.78
2.50
2.90
0.51 BSC
0.90
1.30
2.74 REF
A1
L1
DETAIL A
6.00
10.50
5X
2.10
5X
1.27
PITCH
0.80
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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Phone: 81−3−5817−1050
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14
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP4632/D
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