Fairchild FPF1107 Advance load management switch Datasheet

FPF1107 / FPF1108
Advance Load Management Switch
Features
Description
ƒ
ƒ
The FPF1107/08 are low RDS P-channel MOSFET load
switches of the IntelliMAX™ family. Integrated slew-rate
control prevents inrush current from glitch supply rails
with capacitive loads common in power applications.
ƒ
ƒ
ƒ
ƒ
ƒ
1.2V to 4V Input Voltage Operating Range
Typical RDS(ON):
- 35mΩ at VIN=3.3V
-
55mΩ at VIN=1.8V
-
85mΩ at VIN=1.2V
The input voltage range operates from 1.2V to 4V to
fulfill today's lowest ultra-portable device supply
requirements. Switch control is by a logic input (ON-pin)
capable of interfacing directly with low-voltage CMOS
control signals and GPIOs in embedded processors.
Slew Rate Control with tR: 130µs
Output Discharge Function on FPF1108
Low <1µA Quiescent Current at VON=VIN
ESD Protected: Above 4000V HBM, 2000V CDM
GPIO/CMOS-Compatible Enable Circuitry
Applications
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
Mobile Devices and Smart Phones
Portable Media Devices
Digital Cameras
Advanced Notebook, UMPC, MID
Portable Medical Devices
GPS and Navigation Equipment
Ordering Information
Part
Number
Switch
Part
Input
Output
ON Pin
(Typical)
Marking
Buffer Discharge Activity
At 1.8VIN
tR
Eco
Status
Package
4-Ball, Wafer-Level
Chip-Scale Package
(WLCSP), 1.0 x 1.0mm,
0.5mm Pitch
FPF1107
QC
55mΩ
CMOS
NA
Active
HIGH
130µs
Green
FPF1108
QD
55mΩ
CMOS
65Ω
Active
HIGH
130µs
Green
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
www.fairchildsemi.com
FPF1107 / FPF1108 — Advance Load Management Switch
November 2009
VIN
CIN
VOUT
FPF1107/FPF1108
OFF ON
ON
To Load
COUT
GND
Figure 1. Typical Application
Notes:
1. CIN=1μF, X5R, 0603, for example Murata GRM185R60J105KE26
2. COUT=1μF, X5R, 0805, for example Murata GRM216R61A105KA01
Block Diagram
FPF1107 / FPF1108 — Advance Load Management Switch
Application Diagram
FPF1107/8
Figure 2. Block Diagram (Output Discharge for FPF1108 Only)
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
www.fairchildsemi.com
2
Figure 3. 1 x 1mm WLCSP Bumps Facing Down
VOUT
A1
A2
VIN
GND
B1
B2
ON
Figure 4. 1 x 1mm WLCSP Bumps Facing Up
Pin Definitions
Name
Description
A1
VOUT
Switch Output
A2
VIN
B1
GND
B2
ON
A2
A1
VOUT
ON
B2
B1
GND
Figure 6. Pin Assignments (Bottom View)
Figure 5. Pin Assignments (Top View)
Pin #
VIN
FPF1107 / FPF1108 — Advance Load Management Switch
Pin Configurations
Supply Input: Input to the Power Switch.
Ground
ON/OFF Control, Active HIGH
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
www.fairchildsemi.com
3
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
VIN
Parameter
VIN, VOUT, VON to GND
Min.
Max.
Unit
-0.3
4.2
V
ISW
Maximum Continuous Switch Current
1.2
A
PD
Power Dissipation at TA=25°C
1.0
W
TSTG
Storage Junction Temperature
-65
+150
°C
TA
Operating Temperature Range
-40
+85
°C
ΘJA
Thermal Resistance, Junction-to-Ambient
ESD
Electrostatic Discharge Capability
1S2P with 1 Thermal Via
95
1S2P without Thermal Via
187
Human Body Model,
JESD22-A114
4
Charged Device Model,
JESD22-C101
2
°C/W
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Max.
Unit
VIN
Supply Voltage
1.2
4.0
V
TA
Ambient Operating Temperature
-40
+85
°C
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
FPF1107 / FPF1108 — Advance Load Management Switch
Absolute Maximum Ratings
www.fairchildsemi.com
4
Unless otherwise noted, VIN=1.2 to 4.0V, TA=-40 to +85°C, typical values are at VIN=3.3V and TA=25°C.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
4.0
V
Basic Operation
VIN
Supply Voltage
1.2
IQ(OFF)
Off Supply Current
VON=GND VOUT=Open, VIN=4V
1
μA
ISD(OFF)
Off Switch Current
VON=GND VOUT=GND
1
μA
IQ
Quiescent Current
IOUT=0mA, VON=VIN
1
IOUT=0mA, VON < VIN
3
RON
On Resistance
VIN=3.3V, IOUT=200mA, TA=25°C
35
50
VIN=1.8V, IOUT=200mA, TA=25°C
55
70
VIN=1.5V, IOUT=200mA, TA=25°C
70
VIN=1.2V, IOUT=200mA, TA=25°C
mΩ
85
150
VIN=1.8V, IOUT=200mA, TA=85°C
65
100
65
110
(3)
RPD
Output Discharge RPULL DOWN
VIN=3.3V, VON=0V, IFORCE=20mA,
TA=25°C, FPF1108
VIH
On Input Logic High Voltage
VIN=1.2V to 4.0V
VIL
On Input Logic Low Voltage
VIN=1.2V to 4.0V
ION
On Input Leakage
VON=VIN or GND
μA
1.1
Ω
V
-1
0.35
V
1
μA
Dynamic Characteristics
(4)
tDON
Turn-On Delay
tR
VOUT Rise Time
tON
Turn-On Time
(4)
(4,6)
VIN=3.3V, RL=10Ω, CL=0.1µF,
TA=25°C, FPF1107/8
(4)
tDON
Turn-On Delay
(4)
tR
VOUT Rise Time
tON
Turn-On Time
(4,6)
VIN=3.3V, RL=500Ω, CL=0.1µF,
TA=25°C, FPF1107/8
80
μs
130
μs
210
μs
70
95
FPF1107 / FPF1108 — Advance Load Management Switch
Electrical Characteristics
μs
95
120
μs
165
215
μs
2.0
2.5
μs
FPF1107
(4)
tDOFF
Turn-Off Delay
(4)
tF
VOUT Fall Time
(4,7)
tOFF
Turn-Off
tDOFF
Turn-Off Delay
VIN=3.3V, RL=10Ω, CL=0.1µF,
TA=25°C
(4)
(4)
tF
VOUT Fall Time
tOFF
Turn-Off
(4,7)
VIN=3.3V, RL=500Ω, CL=0.1µF,
TA=25°C
2.2
μs
4.2
μs
7.0
μs
110
μs
117
μs
(5)
FPF1108
tDOFF
tF
tOFF
tDOFF
tF
tOFF
(4)
Turn-Off Delay
(4)
VOUT Fall Time
Turn-Off
(4,7)
VIN=3.3V, RL=10Ω, CL=0.1µF,
RPD=65Ω, TA=25°C
(4)
Turn-Off Delay
(4)
VOUT Fall Time
Turn-Off
(4,7)
VIN=3.3V, RL=500Ω, CL=0.1µF,
RPD=65Ω, TA=25°C
2.0
2.5
μs
1.9
μs
3.9
μs
2.5
μs
10.6
μs
13.1
μs
Notes:
3. This parameter is guaranteed by design and characterization; not production tested.
4. tDON/tDOFF/tR/tF are defined in Figure 7.
5. Output discharge path is enabled during off.
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
www.fairchildsemi.com
5
90%
VOUT
90%
10%
10%
tR
tF
3.3V
50%
50%
VON
90%
10%
VOUT
tDOFF
tDON
Notes:
6. tON=tR + tDON.
7. tOFF=tF + tDOFF.
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
FPF1107 / FPF1108 — Advance Load Management Switch
Timing Diagram
Figure 7. Timing Diagram
www.fairchildsemi.com
6
0.30
0 .2 5
V IN SH UTDOW N C U R RENT ( μA)
V IN SH U T DO W N C U R R EN T ( μA )
VON = VOUT = 0V
0.25
0.20
VIN = 4.0V
0.15
VIN = 3.3V
0.10
VIN = 1.2V
0.05
0.00
-40
-15
10
35
60
VON = V OUT = 0V
0 .2 0
0 .1 5
0 .1 0
8 5 °C
0 .0 5
2 5 °C
85
1 .0
1 .5
TJ, JUNCTION TEMPERATURE (°C)
2 .5
3 .0
3 .5
4 .0
Figure 9. Shutdown Current vs. Supply Voltage
0.07
0.10
O FF SUPPLY CU RRENT ( μA)
VON = 0V
0.09
O FF SU PPLY CUR RENT ( μA)
2 .0
S U PP L Y V O L T A G E (V )
Figure 8. Shutdown Current vs. Temperature
0.08
0.07
0.06
0.05
VIN = 4.0V
0.04
VIN = 3.3V
0.03
VIN = 1.2V
0.02
0.01
0.00
VON = 0V
0.06
0.05
0.04
0.03
85°C
0.02
-40°C
0.01
25°C
0.00
-40
-15
10
35
60
85
1.0
1.5
TJ, JUNCTION TEMPERATURE (°C)
3.0
3.5
4.0
0.40
VON = VIN
0.045
0.35
SUPPLY CURRENT ( μA)
0.040
0.035
0.030
0.025
VIN = 4.0V
0.015
2.5
Figure 11. Off Supply Current vs. Supply Voltage
(FPF1107, VOUT is Floating)
0.050
0.020
2.0
SUPPLY VOLTAGE (V)
Figure 10. Off Supply Current vs. Temperature
(FPF1107, VOUT is Floating)
SUPPLY CU RRENT ( μA)
-4 0 °C
0 .0 0
FPF1107 / FPF1108 — Advance Load Management Switch
Typical Performance Characteristics
VIN = 3.3V
VIN = 1.2V
0.010
VON = VIN
0.30
0.25
-40°C
0.20
0.15
0.10
25°C
0.05
0.005
85°C
0.00
0.000
-40
-15
10
35
60
1.0
85
Figure 12. Quiescent Current vs. Temperature
(VON=VIN)
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
1.5
2.0
2.5
3.0
3.5
4.0
SUPPLY VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Quiescent Current vs. Supply Voltage
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7
3.00
2.50
VON = 0.75 x VIN
2.00
VIN = 4.0V
S U P P LY C U R R E N T (µA)
S U PP L Y C U R RE N T ( μA )
2.50
2.00
1.50
VIN = 3.3V
1.00
0.50
+25°C
1.50
+85°C
1.00
-40°C
0.50
VIN = 1.2V
0.00
0.00
-40
-15
10
35
60
85
1.0
1.5
2.0
TJ, JUNCTION TEMPERATURE (°C)
Figure 14. Quiescent Current vs. Temperature
(VON=0.75 x VIN)
2.5
3.0
S U P P LY V O LTA G E (V )
3.5
4.0
Figure 15. Quiescent Current vs. Supply Voltage
at VON=1.2V
300
120
VON = VIN
IOUT = 200mA
VIN = 1.2V
100
)
VON=VIN
IOUT=200mA
250
O N R E SIS TA N C E (m Ω )
Ω
200
80
150
60
VIN = 3.3V
100
40
FPF1107 / FPF1108 — Advance Load Management Switch
Typical Performance Characteristics
ON RESI STANCE (m
50
-40°C
0
0
-40
-15
10
25°C
85°C
VIN = 4.0V
20
35
60
1.0
85
1.5
2.0
2.5
3.0
3.5
4.0
SUPPLY VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (°C)
Figure 16. RON vs. Temperature
Figure 17. RON vs. Supply Voltage
V ON INPUT LO GIC VO L TAGE (V)
1.00
25°C
0.90
0.80
V IH
0.70
0.60
0.50
V IL
0.40
0.30
0.20
1.0
1.5
2.0
2.5
3.0
3.5
4.0
SUPPLY VOL TAGE (V)
Figure 18. ON-Pin Threshold vs. VIN
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
www.fairchildsemi.com
8
t
1000
V IN = 3.3V
C L = 0.1μ F
R L = 10 Ω
R
O N /O F F D ELAY T IM E (µ s)
RIS E/FA L L TIM E ( µ s)
100 0
10 0
10
t
V IN = 3.3V
C L = 0.1μF
R L = 10 Ω
tDON
100
10
F
tDOFF
1
1
-40
-15
10
35
60
85
-40
-15
T J , JUN C T IO N T EM PERA T UR E (°C )
Figure 19. VOUT Rise and Fall Time vs. Temperature
at RL=10Ω
35
60
V IN = 3.3V
C L = 0.1μF
R L = 500Ω
100
90
F
V IN = 3.3V
C L = 0.1μF
R L = 500Ω
90
ON/OF F DELAY TIME (µ s)
110
t
85
Figure 20. VOUT Turn-On and Turn-Off Delay vs.
Temperature at RL=10Ω
100
120
R IS E/FA L L TIM E ( µ s)
10
T J , JUNCTION TEMP ERATURE (°C)
tR
80
70
60
80
tDON
70
60
50
40
30
20
tDOFF
10
50
FPF1107 / FPF1108 — Advance Load Management Switch
Typical Performance Characteristics
0
-40
-15
10
35
60
85
-40
T J , JU N CTION TEMP ER ATU RE (°C)
-15
10
35
60
85
T J , JU N CTION TEMPER ATU RE (°C)
Figure 21. VOUT Rise and Fall Time vs. Temperature
at RL=500Ω
Figure 22. VOUT Turn-On and Turn-Off Delay
vs. Temperature at RL=500Ω
1 60
1 40
R ISE / D ELAY T IM E [µs]
1 20
tR
1 00
80
60
t DON
40
20
10
1 00
O U T PU T LO AD [
10 00
]
Figure 23. VOUT Turn-On and Turn-Off Delay
vs. Output Load at VIN=3.3V
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
www.fairchildsemi.com
9
Figure 24. Turn-On Response
(VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=10Ω)
Figure 25. Turn-Off Response
(VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=10Ω)
Figure 26. Turn-On Response
(VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω)
Figure 27. Turn-Off Response
(FPF1107 – No Output Pull-Down Resistor)
(VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω)
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
FPF1107 / FPF1108 — Advance Load Management Switch
Typical Performance Characteristics
www.fairchildsemi.com
10
Input Capacitor
Fall Time
TM
The IntelliMAX switch doesn’t require input capacitor.
To reduce device inrush current effect, a 0.1µF ceramic
capacitor, CIN, is recommended close to the VIN pin. A
higher value of CIN can be used to further reduce the
voltage drop experienced as the switch is turned on into
a large capacitive load.
Device output fall time can be calculated based on RC
constant of external components as follows:
tF = RL × CL × 2.2
(1)
where tF is 90% to 10% fall time, RL is output load and
CL is output capacitor.
Output Capacitor
The same equation works for a device with a pull-down
output resistor, then RL is replaced by a parallel
connected pull-down and external output resistor
combination, as follows:
TM
The IntelliMAX
switch works without an output
capacitor. However, if parasitic board inductance forces
VOUT below GND when switching off, a 0.1µF capacitor,
COUT, should be placed between VOUT and GND.
tF =
R L × R PD
× C L × 2. 2
R L + R PD
(2)
where tF is 90% to 10% fall time, RL is output load,
RPD=65Ω is output pull-down resistor, and CL is the
output capacitor.
Resistive Output Load
TM
If resistive output load is missing, the IntelliMAX
switch without pull-down output resistor is not
discharging output voltage. Output voltage drop
depends, in that case, mainly on external device leaks.
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
FPF1107 / FPF1108 — Advance Load Management Switch
Application Information
www.fairchildsemi.com
11
For best thermal performance and minimal inductance
and parasitic effects, it is recommended to keep input
and output traces short and capacitors as close to the
device as possible. Below is a recommended layout
for this device to achieve optimum performance.
FPF1107 / FPF1108 — Advance Load Management Switch
Recommended Land Pattern and Layout
Figure 28. Recommended Land Pattern and Layout
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
www.fairchildsemi.com
12
FPF1107 / FPF1108 — Advance Load Management Switch
Physical Dimensions
0.03 C
E
2X
F
A
PIN A1 AREA
B
0.50
D
0.50
(Ø0.250)
Cu Pad
(Ø0.350)
Solder Mask
0.03 C
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.332±0.018
0.250±0.025
0.625
0.539
0.05 C
C
D
SEATING PLANE
SIDE VIEWS
0.005
0.50
C A B
Ø0.315±0.025
4X
B
A
0.50
A. NO JEDEC REGISTRATION APPLIES.
(Y)±0.018
F
1 2
NOTES:
(X)±0.018
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
BOTTOM VIEW
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: MKT-UC004ABrev2.
Figure 29. 4 Ball, 1.0 x 1.0mm Wafer Level Chip Scale WLCSP Packaging
Product-Specific Dimensions
Product
D
E
X
Y
FPF1107
960µm ± 30µm
960µm ± 30µm
0.230mm
0.230mm
FPF1108
960um ± 30µm
960um ± 30µm
0.230mm
0.230mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
www.fairchildsemi.com
13
FPF1107 / FPF1108 — Advance Load Management Switch
© 2009 Fairchild Semiconductor Corporation
FPF1107 / FPF1108 • Rev. 1.0.1
www.fairchildsemi.com
14
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