SMD Low Power LED EAPL2835RA0 Preliminary Features ‧PLCC-2 package ‧Top view Red LED ‧Wide viewing angle ‧Pb-free ‧RoHS compliant Description The Everlight EAPL2835RA0 package has high efficacy, low power consumption, wide viewing angle and a compact form factor. These features make this package an ideal LED for all lighting applications. Applications ‧Decorative and Entertainment Lighting ‧Agriculture Lighting ‧General use 1 Copyright Revision :1 © LifecyclePhase: Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever DATASHEET SMD Low Power LED EAPL2835RA0 Mass Production List Product Wd(nm) Φ(lm) Min. (2) Φ(lm) Max. (2) EAPL2835RA0 615-630 0.5 1.5 Notes: 1. Tolerance of Color Rendering Index: ±2 2. Tolerance of Luminous flux: ±11%. 2 Copyright Revision :1 © LifecyclePhase: Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever DATASHEET SMD Low Power LED EAPL2835RA0 Device Selection Guide Chip Emitted Color Materials AlGaInP Resin Color Red Water Clear Absolute Maximum Ratings (TSoldering=25℃) Parameter Symbol Rating Unit Forward Current Peak Forward Current (Duty 1/10 @10ms) Power Dissipation IF IFP Pd 20 40 50 mA mA mW Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Rth J-S 50 ℃/W Junction Temperature Tj 115 ℃ Soldering Temperature Tsol Thermal Resistance (Junction / Soldering point) Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. Note: The products are sensitive to static electricity and must be carefully taken when handling products Electro-Optical Characteristics (TSoldering=25℃) Parameter Symbol Min. Typ. Max. Unit Condition Luminous flux (1) Ø 0.5 ----- 1.5 lm IF=20mA Forward Voltage VF 1.9 ----- 2.5 V IF=20mA 2θ1/2 ----- 120 ----- deg IF=20mA IR ----- ----- 50 μA VR =5V Viewing Angle Reverse Current Notes: 1. Tolerance of Radiometric Luminous flux: ±11%. 2. Tolerance of Forward Voltage: ±0.1V. 3 Copyright Revision :1 © LifecyclePhase: Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever DATASHEET SMD Low Power LED EAPL2835RA0 Bin Range of Photometric Bin Code Min. Max. Unit Condition D1 D2 0.5 1.0 1.0 1.5 lm IF=20mA Notes: Tolerance of Luminous flux: ±11% Bin Range of Forward Voltage Bin Code Min. Max. Unit Condition 19B 21B 23B 1.9 2.1 2.3 2.1 2.3 2.5 V IF=20mA Note: Tolerance of Forward Voltage: ±0.1V. Dominant Wavelength Bins Bin Code Min. Max. Unit Condition O54 R51 R52 615 620 625 620 625 630 nm IF=20mA Notes: Dominant / Peak wavelength measurement tolerance: ±1nm. 4 Copyright Revision :1 © LifecyclePhase: Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever DATASHEET SMD Low Power LED EAPL2835RA0 Spectrum Distribution Relative Luminous Intenstiy 1.0 0.8 0.6 0.4 0.2 0.0 560 580 600 620 640 660 680 700 Wavelength(nm) Typical Electro-Optical Characteristics Curves Fig.2 - Relative Radiometric Power vs. Forward Current Fig.1 – Forward Voltage Shift vs. Junction Temperature 1.0 0.00 Relative Radiometric Power Forward Voltage Shift (V) 0.05 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30 25 35 45 55 65 75 85 95 o Tj - Junction Temperature ( C) 5 Copyright Revision :1 © LifecyclePhase: 105 115 0.8 0.6 0.4 0.2 0.0 0 5 10 15 20 Forward Current(mA) Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever DATASHEET SMD Low Power LED EAPL2835RA0 Typical Electro-Optical Characteristics Curves Fig.4 - Forward Current vs. Forward Voltage Fig.3 - Relative Luminous Intensity vs. Junction Temperature o TS=25 C 20 1.2 IF-Forward Current(mA) Relative Luminous Flux 1.0 0.8 0.6 0.4 0.2 0.0 25 15 10 5 0 1.80 35 45 55 65 75 85 95 105 1.85 1.90 o 2.00 2.05 VF- Forward Voltage (V) Tj - Junction Temperature( C ) Fig.5 – Max. Driving Forward Current vs. Soldering Temperature 。 Rth j-s=50 C/W Fig.6 – Radiation Diagram 25 Forward Current (mA) 1.95 115 0° 10° 20° 30° 20 15 5 0 40° 1.0 10 0 10 20 30 40 50 60 70 80 90 100 0.9 0.8 50° 0.7 70° 80° 90° 60° o Soldering Temperature ( C) 0.5 0.3 6 Copyright Revision :1 © LifecyclePhase: 0.1 0.2 0.4 0.6 Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever DATASHEET SMD Low Power LED EAPL2835RA0 Package Dimension Note: Tolerance unless mentioned is ±0.15 mm; Unit = mm 7 Copyright Revision :1 © LifecyclePhase: Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever DATASHEET SMD Low Power LED EAPL2835RA0 Moisture Resistant Packing Materials Label Explanation ‧CPN: Customer’s Product Number ‧P/N: Product Number ‧QTY: Packing Quantity ‧CAT: Luminous Intensity Rank ‧HUE: Dom. Wavelength Rank ‧REF: Forward Voltage Rank ‧LOT No: Lot Number Reel Dimensions Note: Tolerances unless mentioned ±0.1mm. Unit = mm 8 Copyright Revision :1 © LifecyclePhase: Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever DATASHEET SMD Low Power LED EAPL2835RA0 Carrier Tape Dimensions: Loaded Quantity 2000 pcs. Per Reel Progressive direction 1.5+0.1 Note: Tolerance unless mentioned is ±0.1mm; Unit = mm Moisture Resistant Packing Process Label 9 Copyright Revision :1 © LifecyclePhase: Aluminum moisture-proof bag Desiccant Label Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever DATASHEET SMD Low Power LED EAPL2835RA0 Reliability Test Items and Conditions The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re 1 Reflow Soldering Temp. : 260℃/10sec. 6 Min. 22 PCS. 0/1 Thermal Shock H : +100℃ 20min ∫ 10 sec 200 Cycles 22 PCS. 0/1 200 Cycles 22 PCS. 0/1 2 L : -10℃ 20min H : +100℃ 30min ∫ 5 min 3 Temperature Cycle 4 High Temperature/Humidity Storage Ta=85℃,85%RH 1000 Hrs. 22 PCS. 0/1 5 High Temperature/Humidity Operation Ta=85℃,85%RH, IF = 10mA 1000 Hrs. 22 PCS. 0/1 6 Low Temperature Storage Ta=-40℃ 1000 Hrs. 22 PCS. 0/1 7 High Temperature Storage Ta=85℃ 1000 Hrs. 22 PCS. 0/1 8 Low Temperature Operation Life Ta=-40℃, IF = 20 mA 1000 Hrs. 22 PCS. 0/1 9 High Temperature Operation/ Life#1 Ta=25℃, IF = 20 mA 1000 Hrs. 22 PCS. 0/1 10 High Temperature Operation/ Life#2 Ta=55℃, IF =20mA 1000 Hrs. 22 PCS. 0/1 11 High Temperature Operation/ Life#3 Ta=85℃, IF = 10 mA 1000 Hrs. 22 PCS. 0/1 L : -40℃ 30min 10 Copyright Revision :1 © LifecyclePhase: Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever DATASHEET SMD Low Power LED EAPL2835RA0 Precautions for Use 1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 168 Hrs under 30℃ or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. . .x x a aM M. c Ce 0s 60 21 C. x 5a 5M 2. ec ve os b0 A3 Baking treatment: 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile . x a M . c e s / C 3 . x a M . c e s / C 6 . c 7e 1s 20 e5 v1 o~ b0 A6 g n i t a e h e r P . c Ce 0s 00 22 ~1 0~ 50 16 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5. Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 11 Copyright Revision :1 © LifecyclePhase: Release Date:2015-06-11 16:35:02.0 2014, Everlight Americas Inc.. Release Date: 20.May 2015. Issue No:DSE-0013403_Rev.1 www.everlight.com Expired Period: Forever