TI1 LM258A-EP Dual operational amplifier Datasheet

LM258A-EP
DUAL OPERATIONAL AMPLIFIERS
www.ti.com
SLOS506 – OCTOBER 2006
FEATURES
•
•
•
•
•
•
•
•
(1)
Controlled Baseline
– One Assembly/One Test Site, One
Fabrication Site
Extended Temperature Performance of –55°C
to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree (1)
Wide Supply Range:
– Single Supply . . . 3 V to 30 V
– Dual Supplies . . . ±1.5 V to ±15 V
Low Supply-Current Drain, Independent of
Supply Voltage . . . 0.7 mA Typ
Common-Mode Input Voltage Range Includes
Ground, Allowing Direct Sensing Near
Ground
•
•
•
•
Low Input Bias and Offset Parameters:
– Input Offset Voltage . . . 2 mV Typ
– Input Offset Current . . . 2 nA Typ
– Input Bias Current . . . 15 nA Typ
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . 32 V
Open-Loop Differential Voltage Amplification
. . . 100 V/mV Typ
Internal Frequency Compensation
D PACKAGE
(TOP VIEW)
1OUT
1IN–
1IN+
GND
1
2
3
4
8
7
6
5
VCC
2OUT
2IN–
2IN+
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
The LM258A consists of two independent, high-gain, frequency-compensated operational amplifiers designed to
operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the
difference between the two supplies is 3 V to 30 V, and VCC is at least 1.5 V more positive than the input
common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier
circuits that now can be implemented more easily in single-supply-voltage systems. For example, this device can
be operated directly from the standard 5-V supply used in digital systems and easily can provide the required
interface electronics without additional ±5-V supplies.
ORDERING INFORMATION
TA
VIOmax
AT 25°C
MAX
TESTED
VCC
–55°C to 125°C
3mV
30V
(1)
PACKAGE (1)
SOIC – D
Reel of 2500
ORDERABLE
PART NUMBER
LM258AMDREP
TOP-SIDE MARKING
258AM
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
LM258A-EP
DUAL OPERATIONAL AMPLIFIERS
www.ti.com
SLOS506 – OCTOBER 2006
SYMBOL (EACH AMPLIFIER)
IN+
IN-
+
-
OUT
SCHEMATIC (EACH AMPLIFIER)
VCC+
»6-mA
Current
Regulator
»100-mA
Current
Regulator
»6-mA
Current
Regulator
OUT
IN–
»50-mA
Current
Regulator
IN+
GND (or VCC-)
To Other Amplifier
COMPONENT COUNT
Epi-FET
Diodes
Resistors
Transistors
Capacitors
2
1
2
7
51
2
Submit Documentation Feedback
LM258A-EP
DUAL OPERATIONAL AMPLIFIERS
www.ti.com
SLOS506 – OCTOBER 2006
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
±16 or 32
V
Differential input voltage (3)
±32
V
Input voltage (either input)
–0.3 to 32
V
Duration of output short circuit (one amplifier) to ground
at (or below) 25°C free-air temperature (VCC ≤ 15 V) (4)
Unlimited
VCC
Supply voltage (2)
VID
VI
θJA
Package thermal impedance (5) (6)
97
°C/W
TA
Operating free-air temperature range
–55 to 125
°C
TJ
Operating virtual junction temperature
150
°C
Tstg
Storage temperature range (7)
–65 to 150
°C
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages and VCC specified for measurement of IOS, are with respect to the network ground
terminal.
Differential voltages are at IN+ with respect to IN–.
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
Submit Documentation Feedback
3
LM258A-EP
DUAL OPERATIONAL AMPLIFIERS
www.ti.com
SLOS506 – OCTOBER 2006
Electrical Characteristics
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
VIO
Input offset voltage
aI
Average temperature
coefficient of
input offset voltage
IO
IIO
Input offset current
aI
Average temperature
coefficient of
input offset current
IO
TEST CONDITIONS (1)
VCC = 5 V to 30 V,
VIC = VICR(min),
VO = 1.4 V
TYP (3)
MAX
2
3
Full range
4
Full range
7
15
25°C
2
15
Full range
Input bias current
VO = 1.4 V
VICR
Common-mode
input voltage range
VCC = 5 V to Max
VOH
High-level
output voltage
30
Full range
10
25°C
–15
Full range
25°C
Full range
RL ≥ 2 kΩ
25°C
VCC = 30 V
VOL
Low-level
output voltage
RL ≤ 10 kΩ
AVD
Large-signal
differential
voltage amplification
VCC = 15 V,
VO = 1 V to 11 V,
RL ≥ 2 kΩ
CMRR
Common-mode
rejection ratio
kSVR
VO1/VO2
200
–80
–100
0 to VCC – 1.5
RL = 2 kΩ
Full range
26
RL ≥ 10 kΩ
Full range
27
µV/°C
nA
pA/°C
nA
V
28
5
20
mV
25°C
50
Full range
25
VCC = 5 V to Max
VIC = VICR(min)
25°C
70
80
dB
Supply-voltage
rejection ratio
(∆VDD/∆VIO)
VCC = 5 V to Max
25°C
65
100
dB
Crosstalk
attenuation
f = 1 kHz to 20 kHz
25°C
120
dB
Output current
Source
VCC = 15 V,
VID = –1 V,
VO = 15 V
Sink
25°C
–20
Full range
–10
25°C
10
Full range
5
12
100
V/mV
–30
–60
mA
20
µA
VID = –1 V, VO = 200 mV
25°C
IOS
VCC at 5 V, GND at –5 V,
VO = 0
25°C
±40
±60
ICC
Supply current
(two amplifiers)
VO = 2.5 V, No load
Full range
0.7
1.2
VCC = Max, VO = VCC/2, No load
Full range
1
2
(2)
(3)
mV
VCC – 1.5
Short-circuit
output current
(1)
UNIT
V
0 to VCC – 2
Full range
VCC = 15 V,
VID = 1 V,
VO = 0
4
MIN
25°C
VO = 1.4 V
IIB
IO
TA (2)
30
mA
mA
All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. MAX
VCC for testing purposes is 30 V.
Full range is –55°C to 125°C.
All typical values are at TA = 25°C.
Submit Documentation Feedback
LM258A-EP
DUAL OPERATIONAL AMPLIFIERS
www.ti.com
SLOS506 – OCTOBER 2006
Operating Characteristics
VCC = ±15 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
UNIT
SR
Slew rate at unity gain
RL = 1 MΩ, CL = 30 pF, VI = ±10 V, See Figure 1
0.3
V/µs
B1
Unity-gain bandwidth
RL = 1 MΩ, CL = 20 pF, See Figure 1
0.7
MHz
Vn
Equivalent input noise voltage
RS = 100 Ω, VI = 0 V, f = 1 kHz, See Figure 2
40
nV/√Hz
VCC+
–
VO
VI
+
VCC-
CL
RL
Figure 1. Unity-Gain Amplifier
900 W
VCC+
100 W
–
VI = 0 V
VO
RS
+
VCC-
Figure 2. Noise-Test Circuit
Submit Documentation Feedback
5
PACKAGE OPTION ADDENDUM
www.ti.com
31-May-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM258AMDREP
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
258AM
LM258AMDREPG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
258AM
V62/07605-01XE
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
258AM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-May-2014
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM258A-EP :
• Catalog: LM258A
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM258AMDREP
Package Package Pins
Type Drawing
SOIC
D
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
6.4
B0
(mm)
K0
(mm)
P1
(mm)
5.2
2.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM258AMDREP
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
Similar pages