TI1 HPA00892DWPR 6-w stereo audio power amplifier Datasheet

TPA1517
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SLOS162D – MARCH 1997 – REVISED FEBRUARY 2007
6-W STEREO AUDIO POWER AMPLIFIER
•
•
•
•
FEATURES
•
•
•
TDA1517P Compatible
High Power Outputs (6 W/Channel)
Surface Mount Availability 20-Pin Thermal
SOIC PowerPAD™
Thermal Protection
Fixed Gain: 20 dB
Mute and Standby Operation
Supply Range: 9.5 V - 18 V
DWP PACKAGE
(TOP VIEW)
NE PACKAGE
(TOP VIEW)
IN1
SGND
SVRR
OUT1
PGND
OUT2
VCC
M/SB
IN2
GND/HS
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
GND/HS
GND/HS
GND/HS
GND/HS
GND/HS
GND/HS
GND/HS
GND/HS
GND/HS
GND/HS
GND/HS
IN1
NC
SGND
SVRR
NC
OUT1
OUT1
PGND
GND/HS
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
GND/HS
IN2
NC
M/SB
VCC
NC
OUT2
OUT2
PGND
GND/HS
Cross Section View Showing PowerPAD
NC – No internal connection
DESCRIPTION
The TPA1517 is a stereo audio power amplifier that contains two identical amplifiers capable of delivering 6 W
per channel of continuous average power into a 4-Ω load at 10% THD+N or 5 W per channel at 1% THD+N.
The gain of each channel is fixed at 20 dB. The amplifier features a mute/standby function for power-sensitive
applications. The amplifier is available in the PowerPAD™ 20-pin surface-mount thermally-enhanced package
(DWP) that reduces board space and facilitates automated assembly while maintaining exceptional thermal
characteristics. It is also available in the 20-pin thermally enhanced DIP package (NE).
AVAILABLE OPTIONS
PACKAGED DEVICES (1)
(1)
(2)
TA
THERMALLY ENHANCED
PLASTIC DIP
THERMALLY ENHANCED
SURFACE MOUNT (DWP) (2)
-40°C to 85°C
TPA1517NE
TPA1517DWP (2)
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI Web site at www.ti.com.
The DWP package is available taped and reeled. To order a taped and reeled part, add the suffix R
(e.g., TPA1517DWPR).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1997–2007, Texas Instruments Incorporated
TPA1517
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SLOS162D – MARCH 1997 – REVISED FEBRUARY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Terminal Functions
TERMINAL
DWP
NO.
NE
NO.
I/O
IN1
2
1
I
IN1 is the audio input for channel 1.
SGND
4
2
I
SGND is the input signal ground reference.
SVRR
5
3
OUT1
7, 8
4
PGND
9, 12
5
OUT2
13, 14
6
O
OUT2 is the audio output for channel 2.
VCC
16
7
I
VCC is the supply voltage input.
M/SB
17
8
I
M/SB is the mute/standby mode enable. When held at less than 2 V, this signal enables the
TPA1517 for standby operation. When held between 3.5 V and 8.2 V, this signal enables the
TPA1517 for mute operation. When held above 9.3 V, the TPA1517 operates normally.
19
9
I
IN2 in the audio input for channel 2.
1, 10,
11, 20
10-20
NAME
IN2
GND/HS
DESCRIPTION
SVRR is the midrail bypass.
O
OUT1 is the audio output for channel 1.
PGND is the power ground reference.
GND/HS are the ground and heatsink connections. All GND/HS terminals are connected directly to
the mount pad for thermal-enhanced operation.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
UNIT
VCC
Supply voltage
VI
Input voltage (IN1, IN2)
22 V
22 V
Internally limited
(See Dissipation Rating Table)
Continuous total power dissipation
TA
Operating free-air temperature range
-40°C to 85°C
TJ
Operating junction temperature range
-40°C to 150°C
Tstg
Storage temperature range
-65°C to 85°C
DISSIPATION RATING TABLE
(1)
PACKAGE
TA ≤ 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
DWP (1)
2.94 W
23.5 mW/°C
1.88 W
1.53 W
NE (1)
2.85 W
22.8 mW/°C
1.82 W
1.48 W
See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (literature number SLMA002), for
more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section
entitled Texas Instruments Recommended Board for PowerPAD on page 33 of the before mentioned document.
RECOMMENDED OPERATING CONDITIONS
MIN
2
NOM
MAX
UNIT
VCC
Supply voltage
9.5
18
V
TA
Operating free-air temperature
-40
85
°C
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ELECTRICAL CHARACTERISTICS
VCC = 12 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
ICC
Supply current
VO(DC)
DC output voltage
V(M/SB)
Voltage on M/SB terminal for normal operation
VO(M)
Mute output voltage
ICC(SB)
Supply current in standby mode
(1)
See Note
MIN
(1)
TYP
MAX
45
80
6
V
2
7
mA
V
9.6
VI = 1 V (max)
UNIT
mV
100
µA
At 9.5 V < VCC < 18 V the DC output voltage is approximately VCC/2.
OPERATING CHARACTERISTIC
VCC = 12 V, RL = 4Ω , f = 1 kHz, TA = 25°C
PARAMETER
PO
Output power (1)
SNR
Signal-to-noise ratio
THD
Total harmonic distortion
IO(SM)
Non-repetitive peak output current
IO(RM)
Repetitive peak output current
TEST CONDITIONS
3
THD = 10%
6
PO = 1 W, RL = 8Ω ,
3 dB
1 dB
Supply ripple rejection ratio
M/SB = On, f = 1 kHz
Vn
Noise output voltage
(2)
f = 1 kHz
4
A
2.5
A
45
Hz
20
kHz
-65
dB
60
kΩ
Rs = 0,
M/SB = On
50
µV(rms)
Rs= 10 kΩ,
M/SB = On
70
µV(rms)
50
µV(rms)
Rs = 10 kΩ
-58
Gain
18.5
Channel balance
(1)
(2)
dB
0.1%
M/SB = Mute
Channel separation
UNIT
W
84
High-frequency roll-off
Input impedance
TYP MAX
THD = 0.2%
Low-frequency roll-off
ZI
MIN
dB
20
21
0.1
1
TYP
MAX
50
90
dB
Output power is measured at the output terminals of the IC.
Noise voltage is measured in a bandwidth of 20 Hz to 20 kHz.
ELECTRICAL CHARACTERISTICS
VCC = 14.5 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
ICC
Supply current
VO(DC)
DC output voltage
V(M/SB)
Voltage on M/SB terminal for normal operation
VO(M)
Mute output voltage
ICC(SB)
Supply current in standby mode
(1)
See Note
(1)
MIN
7.25
V
2
7
mA
V
9.6
VI = 1 V (max)
UNIT
mV
100
µA
At 9.5 V < VCC < 18 V the DC output voltage is approximately VCC/2.
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OPERATING CHARACTERISTIC
VCC = 14.5 V, RL = 4Ω , f = 1 kHz, TA = 25°C
PARAMETER
PO
Output power (1)
SNR
Signal-to-noise ratio
THD
Total harmonic distortion
IO(SM)
Non-repetitive peak output current
IO(RM)
Repetitive peak output current
TEST CONDITIONS
W
W
84
dB
PO = 1 W
0.1%
4
1 dB
Supply ripple rejection ratio
M/SB = On
Noise output voltage (2)
A
2.5
A
45
Hz
20
kHz
-65
dB
60
kΩ
Rs = 0,
M/SB = On
50
µV(rms)
Rs= 10 kΩ,
M/SB = On
70
µV(rms)
50
µV(rms)
M/SB = Mute
Channel separation
Rs = 10 kΩ
Gain
-58
18.5
Channel balance
(1)
(2)
UNIT
6
High-frequency roll-off
Vn
MAX
THD < 10%
3 dB
Input impedance
TYP
4.5
Low-frequency roll-off
ZI
MIN
THD = 0.2%
dB
20
21
dB
0.1
1
dB
Output power is measured at the output terminals of the IC.
Noise voltage is measured in a bandwidth of 22 Hz to 22 kHz.
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
ICC
Supply current
vs Supply voltage
Power supply rejection ratio
vs Frequency
2, 3
vs Frequency
4, 5, 6
VCC = 12 V
vs Power output
10, 11
vs Frequency
7, 8, 9
vs Power output
12, 13
Crosstalk
vs Frequency
14, 15
Gain
vs Frequency
16
Phase
vs Frequency
16
Vn
Noise voltage
vs Frequency
17, 18
PO
Output power
vs Supply voltages Load resistance
1920
PD
Power dissipation
vs Output power
21, 22
THD + N
Total harmonic distortion plus noise
VCC = 14.5 V
4
1
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SUPPLY CURRENT
vs
SUPPLY VOLTAGE
SUPPLY RIPPLE REJECTION RATIO
vs
FREQUENCY
100
0
VCC = 12 V
RL = 4 Ω
CB = 100 µF
Supply Ripple Rejection Ratio - dB
I CC - Supply Current - mA
- 10
75
50
25
- 20
- 30
- 40
- 50
- 60
- 70
- 80
- 90
0
8
10
12
14
16
18
- 100
100
20
Figure 1.
Figure 2.
SUPPLY RIPPLE REJECTION RATIO
vs
FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
10%
VCC = 14.5 V
RL = 4 Ω
THD+N - Total Harmonic Distortion + Noise
Supply Ripple Rejection Ratio - dB
10 k
f - Frequency - Hz
0
- 10
1k
VCC - Supply Voltage - V
- 20
- 30
- 40
- 50
- 60
- 70
- 80
- 90
VCC = 12 V
RL = 4 Ω
PO = 3 W
Both Channels
1%
0.1%
0.01%
- 100
100
1k
f - Frequency - Hz
10 K
20
100
1k
10 k 20 k
f - Frequency - Hz
Figure 3.
Figure 4.
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TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
10%
VCC = 12 V
RL = 8 Ω
PO = 1 W
Both Channels
THD+N - Total Harmonic Distortion + Noise
THD+N - Total Harmonic Distortion + Noise
10%
1%
0.1%
0.01%
100
1k
0.1%
20
10 k 20 k
100
1k
10 k 20 k
f - Frequency - Hz
f - Frequency - Hz
Figure 5.
Figure 6.
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
10%
10%
VCC = 14.5 V
RL = 4 Ω
PO = 3 W
THD+N - Total Harmonic Distortion + Noise
THD+N - Total Harmonic Distortion + Noise
1%
0.01%
20
1%
0.1%
0.01%
VCC = 14.5 V
RL = 8 Ω
PO = 1.5 W
1%
0.1%
0.01%
20
6
VCC = 12 V
RL = 32 Ω
PO = 0.25 W
100
1k
10 k 20 k
20
100
1k
f - Frequency - Hz
f - Frequency - Hz
Figure 7.
Figure 8.
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TOTAL HARMONIC DISTORTION + NOISE
vs
FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs
POWER OUTPUT
10%
VCC = 14.5 V
RL = 32 Ω
PO = 0.25 W
THD+N - Total Harmonic Distortion + Noise
THD+N - Total Harmonic Distortion + Noise
10%
1%
0.1%
0.01%
20
100
f = 20 kHz
1%
f = 20 Hz
0.1%
f = 1 kHz
0.01%
0.01
10 k 20 k
f - Frequency - Hz
0.1
1
PO - Power Output - W
Figure 9.
Figure 10.
TOTAL HARMONIC DISTORTION + NOISE
vs
POWER OUTPUT
TOTAL HARMONIC DISTORTION + NOISE
vs
POWER OUTPUT
1%
10%
VCC = 12 V
RL = 8 Ω
Both Channels
THD+N - Total Harmonic Distortion + Noise
10%
THD+N - Total Harmonic Distortion + Noise
1k
VCC = 12 V
RL = 4 Ω
Both Channels
f = 20 kHz
f = 20 Hz
0.1%
f = 1 kHz
0.01%
0.01
0.1
1
PO - Power Output - W
10
10
VCC = 14.5 V
RL = 4 Ω
Both Channels
f = 20 kHz
1%
f = 20 Hz
0.1%
f = 1 kHz
0.01%
0.01
Figure 11.
0.1
1
PO - Power Output - W
10
Figure 12.
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TOTAL HARMONIC DISTORTION + NOISE
vs
POWER OUTPUT
- 40
VCC = 14.5 V
RL = 8 Ω
Both Channels
VCC = 12 V
RL = 4 Ω
PO = 3 W
Both Channels
- 45
- 50
f = 20 kHz
1%
Crosstalk - dB
THD+N - Total Harmonic Distortion + Noise
10%
CROSSTALK
vs
FREQUENCY
f = 20 Hz
- 55
- 60
- 65
0.1%
- 70
f = 1 kHz
- 75
0.01%
0.01
- 80
0.1
1
PO - Power Output - W
20
10
100
1k
f - Frequency - Hz
Figure 13.
Figure 14.
CROSSTALK
vs
FREQUENCY
- 40
VCC = 14.5 V
RL = 4 Ω
PO = 5 W
Both Channels
- 45
Crosstalk - dB
- 50
- 55
- 60
- 65
- 70
- 75
- 80
20
100
1k
f - Frequency - Hz
Figure 15.
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10 k 20 k
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GAIN AND PHASE
vs
FREQUENCY
20
VCC = 12 V
RL = 4 Ω
Gain
200°
10
100°
- 10
Phase
Gain - dB
0
0°
Phase
- 20
-100°
- 30
- 40
-200°
10
100
1k
10 k
100 k
1M
f - Frequency - Hz
Figure 16.
NOISE VOLTAGE
vs
FREQUENCY
NOISE VOLTAGE
vs
FREQUENCY
1
1
VCC = 14.5 V
BW = 22 Hz to 22 kHz
RL = 4 Ω
Both Channels
V n - Noise Voltage - mV
V n - Noise Voltage - mV
VCC = 12 V
BW = 22 Hz to 22 kHz
RL = 4 Ω
Both Channels
0.1
0.01
20
100
1k
10 k 20 k
0.1
0.01
20
100
1k
f - Frequency - Hz
f - Frequency - Hz
Figure 17.
Figure 18.
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OUTPUT POWER
vs
SUPPLY VOLTAGE
OUTPUT POWER
vs
LOAD RESISTANCE
8
6
THD < 1%
THD < 1%
5
PO - Output Power - W
PO - Output Power - W
6
RL = 4 Ω
4
RL = 8 Ω
2
VCC = 14.5 V
4
VCC = 12 V
3
2
1
0
0
8
9
10
11
12 13 14 15
VCC - Supply Voltage - V
16
17
18
2 4 6
Figure 19.
Figure 20.
POWER DISSIPATION
vs
OUTPUT POWER
POWER DISSIPATION
vs
OUTPUT POWER
3.5
3.5
VCC = 14.5 V
VCC = 12 V
3
PD - Power Dissipation - W
PD - Power Dissipation - W
3
2.5
RL = 4 Ω
2
1.5
RL = 8 Ω
1
RL = 4 Ω
2.5
2
RL = 8 Ω
1.5
1
0.5
0.5
0
1
2
3
4
PO - Output Power - W
5
6
0
Figure 21.
10
8 10 12 14 16 18 20 22 24 26 28 30 32
RL - Load Resistance - Ω
1
2
3
4
PO - Output Power - W
Figure 22.
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APPLICATION INFORMATION
AMPLIFIER OPERATION
The TPA1517 is a stereo audio power amplifier designed to drive 4-Ω speakers at up to 6 W per channel.
Figure 23 is a schematic diagram of the minimum recommended configuration of the amplifier. Gain is internally
fixed at 20 dB (gain of 10 V/V).
VCC
7
1
IN1
1 µF
+
60 k
COR
–
+
–
+
OUT1 4
×1
470 µF
2.1 Vref
2
Ref
1 µF
CS
CIR
Right
VCC
5
VCC
SGND
VCC
18 kΩ
PGND
2 kΩ
15 kΩ
×1
3 SVRR
CB
Mute
Standby
M/SB 8
2 kΩ
15 kΩ
2.2 µF
10 kΩ
S1
Mute/Standby Switch
(see Note A)
18 kΩ
6.8 kΩ
2.1 Vref
S2
Mute/Standby Select
(see Note B)
COL
60 k
CIL
–
+
9 IN2
Left
+
–
+
1 µF
OUT2 6
×1
470 µF
GND/HS
10 – 20
Copper Plane
A.
When S1 is open, the TPA1517 operates normally. When this switch is closed, the device is in mute/standby mode.
B.
When S2 is open, activating S1 places the TPA1517 in mute mode. When S2 is closed, activating S1 places the
TPA1517 in standby mode.
C.
The terminal numbers are for the 20-pin NE package.
Figure 23. TPA1517 Minimum Configuration
The following equation is used to relate gain in V/V to dB:
ǒ
Ǔ
G dB + 20 LOG G VńV
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APPLICATION INFORMATION (continued)
The audio outputs are biased to a midrail voltage which is shown by the following equation:
V
V MID + CC
2
The audio inputs are always biased to 2.1 V when in mute or normal mode. Any dc offset between the input
signal source and the input terminal is amplified and can seriously degrade the performance of the amplifier. For
this reason, it is recommended that the inputs always be connected through a series capacitor (ac coupled). The
power outputs, also having a dc bias, must be connected to the speakers via series capacitors.
MUTE/STANDBY OPERATION
The TPA1517 has three modes of operation; normal, mute, and standby. They are controlled by the voltage on
the M/SB terminal as described in Figure 24. In normal mode, the TPA1517 amplifies the signal applied to the
two input terminals providing low impedance drive to speakers connected to the output terminals. In mute mode,
the amplifier retains all bias voltages and quiescent supply current levels but does not pass the input signal to
the output. In standby mode, the internal bias generators and power-drive stages are turned off, thereby
reducing the supply current levels.
V I(M/SB) - Input Voltage on M/SB - V
22
NORMAL
9.3
8.2
Undetermined State
MUTE
3.5
Undetermined State
2
STANDBY
0
Figure 24. Standby, Mute, and Normal (On) Operating Conditions
The designer must take care to place the control voltages within the defined ranges for each desired mode,
whenever an external circuit is used to control the input voltage at the M/SB terminal. The undefined area can
cause unpredictable performance and should be avoided. As the control voltage moves through the undefined
areas, pop or click sounds may be heard in the speaker. Moving from mute to normal causes a very small click
sound. Whereas moving from standby to mute can cause a much larger pop sound. Figure 25 shows external
circuitry designed to help reduce transition pops when moving from standby mode to normal mode.
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APPLICATION INFORMATION (continued)
Figure 25 is a reference schematic that provides TTL-level control of the M/SB terminal. A diode network is also
included which helps reduce turn-on pop noises. The diodes serve to drain the charge out of the output coupling
capacitors while the amplifier is in shutdown mode. When the M/SB voltage is in the normal operating range, the
diodes have no effect on the ac performance of the system.
VCC
7
1 µF
CS
CIR
1
Right
VCC
IN1
1 µF
+
60 k
COR 470 µF
–
+
–
+
OUT1 4
×1
1N914
2.1 Vref
220 Ω
18 kΩ
2
Ref
5
SGND
S1
See
Note A
VCC
VCC
2 kΩ
PGND
10 kΩ
10 kΩ
15 kΩ
×1
3 SVRR
Mute
Standby
M/SB 8
47 kΩ
47 kΩ
47 kΩ
Q1
CB
2.2 µF
15 kΩ
Q2
2 kΩ
1N914
S2
See
Note B
6.8 kΩ
18 kΩ
TTL Control
Low – Mute
High – On
10 kΩ
2.1 Vref
COL
60 k
CIL
9 IN2
Left
1 µF
–
+
+
–
+
OUT2 6
×1
470 µF
GND/HS
10 – 20
Copper Plane
A.
When S1 is closed, the depop circuitry is active during standby mode.
B.
When S2 is open, activating S1 places the TPA1517 in mute mode. When S2 is closed, activating S1 places the
TPA1517 in standby mode.
C.
The terminal numbers are for the 20-pin NE package.
Figure 25. TTL Control with POP Reduction
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APPLICATION INFORMATION (continued)
COMPONENT SELECTION
Some of the general concerns for selection of capacitors are:
• Leakage currents on aluminum electrolytic capacitors
• ESR (equivalent series resistance)
• Temperature ratings
LEAKAGE CURRENTS
Leakage currents on most ceramic, polystyrene, and paper capacitors are negligible for this application.
Leakage currents for aluminum electrolytic and tantalum tend to be higher. This is especially important on the
input terminals and the SVRR capacitor. These nodes encounter from 3 V to 7 V, and need to have leakage
currents less than 1 µA to keep from affecting the output power and noise performance.
EQUIVALENT SERIES RESISTANCE
ESR is mainly important on the output coupling capacitor, where even 1Ω of ESR in CO with an 8-Ω speaker can
reduce the output drive power by 12.5%. ESR should be considered across the frequency range of interest,
(i.e., 20 Hz to 20 kHz). The following equation calculates the amount of power lost in the coupling capacitor:
% Power in C O + ESR
RL
The power supply decoupling requires a low ESR as well to take advantage of the full output drive current.
TEMPERATURE RANGE
The temperature range of the capacitors are important. Many of the high-density capacitors perform differently at
different temperatures. When consistent high performance is required from the system overtemperature in terms
of low THD, maximum output power, and turn-on/off popping, then interactions of the coupling capacitors and
the SVRR capacitors need to be considered, as well as the change in ESR on the output capacitor with
temperature.
TURN-ON POP CONSIDERATION
To select the proper input coupling capacitor, the designer should select a capacitor large enough to allow the
lowest desired frequency pass and small enough that the time constant is shorter than the output RC time
constant to minimize turn-on popping. The input time constant for the TPA1517 is determined by the input 60-kΩ
resistance of the amplifier, and the input coupling capacitor according to the following generic equation:
1
TC +
2pRC
For example, 8-Ω speakers and 220-µF output coupling capacitors would yield a 90-Hz cut-off point for the
output RC network. The input network should be the same speed or faster ( > 90 Hz TC). A good choice would
be 180 Hz. As the input resistance is 60 kΩ, a 14-nF input coupling capacitor would do.
The bypass-capacitor time constant should be much larger (×5) than either the input coupling capacitor time
constant or the output coupling capacitor time constants. In the previous example with the 220-µF output
coupling capacitor, the designer should want the bypass capacitor, TC, to be in the order of 18 Hz or lower. To
get an 18-Hz time constant, CB is required to be 1 µF or larger because the resistance this capacitor sees is
7.5 kΩ.
In summary, follow one of the three simple relations presented below, depending on the tradeoffs between low
frequency response and turn-on pop.
1. If depop performance is the top priority, then follow:
7500 C B u 5RLC O u 300000 C I
2. If low frequency ac response is more important but depop is still a consideration then follow:
1
t 10 Hz
2p60000 C I
14
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TPA1517
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SLOS162D – MARCH 1997 – REVISED FEBRUARY 2007
APPLICATION INFORMATION (continued)
3. If low frequency response is most important and depop is not a consideration then follow:
1
1
≤
≤ f low
2p60000 C I 2pRL C I
THERMAL APPLICATIONS
Linear power amplifiers dissipate a significant amount of heat in the package under normal operating conditions.
A typical music CD requires 12 dB to 15 dB of dynamic headroom to pass the loudest portions without distortion
as compared with the average power output. Figure 19 shows that when the TPA1517 is operating from a 12-V
supply into a 4-Ω speaker that approximately 3.5 W peaks are possible. Converting watts to dB using the
following equation:
ǒ Ǔ
P
P dB + 10Log
P
W
ref
ǒ Ǔ
+ 10Log 3.5
1
+ 5.44 dB
Subtracting dB for the headroom restriction to obtain the average listening level without distortion yields the
following:
5.44 dB * 15 dB + * 9.56 dB (15 dB headroom)
5.44 dB * 12 dB + * 6.56 dB (12 dB headroom)
Converting dB back into watts:
P ń10
P W + 10 dB
Pref
+ 111 mW (15 dB headroom)
+ 221 mW (12 dB headroom)
This is valuable information to consider when attempting to estimate the heat dissipation requirements for the
amplifier system. Comparing the absolute worst cast, which is 3.5 W of continuous power output with 0 dB of
headroom, against 12-dB and 15-dB applications drastically affects maximum ambient temperature ratings for
the system. Using the power dissipation curves for a 12-V, 4-Ω system, internal dissipation in the TPA1517 and
maximum ambient temperatures are shown in Table 1.
Table 1. TPA1517 Power Rating
PEAK OUTPUT POWER
(W)
AVERAGE OUTPUT POWER
POWER DISSIPATION
(W/Channel)
MAXIMUM AMBIENT
TEMPERATURE
3.5
3.5 W
2.1
-34°C
3.5
1.77 W (3 dB)
2.4
-61°C
3.5
884 mW (6 dB)
2.25
-48°C
3.5
442 mW (9 dB)
1.75
-4°C
3.5
221 mW (12 dB)
1.5
18°C
3.5
111 mW (15 dB)
1.25
40°C
Submit Documentation Feedback
15
TPA1517
www.ti.com
SLOS162D – MARCH 1997 – REVISED FEBRUARY 2007
The maximum ambient temperature depends on the heatsinking ability of the PCB system. The derating factor
for the NE package with 7 square inches (17.78 cm) of copper area is 22.8 mW/°C. Converting this to θJA:
1
θ JA +
Derating
For 0 CFM :
+
1
0.0228
+ 43.9°CńW
To calculate maximum ambient temperatures, first consider that the numbers from the dissipation graphs are per
channel so the dissipated heat needs to be doubled for two channel operation. Given θJA, the maximum
allowable junction temperature and the total internal dissipation, the maximum ambient temperature can be
calculated with the following equation. The maximum recommended junction temperature for the TPA1517 is
150°C.
T A Max + T J Max * q JA P D
+ 150 * 43.9(1.25
2) + 40°C (15 dB headroom, 0 CFM)
Table 1 clearly shows that for most applications some airflow is required to keep junction temperatures in the
specified range. The TPA1517 is designed with thermal protection that turns the device off when the junction
temperature surpasses 150°C to prevent damage to the IC. Using the DWP package on a multilayer PCB with
internal ground planes can achieve better thermal performance. Table 1 was calculated for a maximum volume
system; when the output level is reduced, the numbers in the table change significantly. Also using 8-Ω
speakers dramatically increases the thermal performance by increasing amplifier efficiency.
NE THERMAL RESISTANCE, θJA
vs
COPPER AREA
90
80
θJA– Theta JA – oC/W
70
60
50
40
30
20
10
0
0
1
2
3
4
5
6
7
Copper Area
Figure 26.
16
Submit Documentation Feedback
8
9
10
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
HPA00892DWPR
ACTIVE SO PowerPAD
DWP
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPA1517
TPA1517DWP
ACTIVE SO PowerPAD
DWP
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPA1517
TPA1517DWPG4
ACTIVE SO PowerPAD
DWP
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPA1517
TPA1517DWPR
ACTIVE SO PowerPAD
DWP
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPA1517
TPA1517DWPRG4
ACTIVE SO PowerPAD
DWP
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPA1517
TPA1517NE
ACTIVE
PDIP
NE
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TPA1517NE
TPA1517NEE4
ACTIVE
PDIP
NE
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TPA1517NE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Apr-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPA1517DWPR
Package Package Pins
Type Drawing
SO
Power
PAD
DWP
20
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
10.8
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.3
2.7
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Apr-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPA1517DWPR
SO PowerPAD
DWP
20
2000
367.0
367.0
45.0
Pack Materials-Page 2
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