SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS FEATURES: • Wide temperature range (-55C to +180C) • High current capability (up to 8A) • Excellent signal integrity at high frequencies • Low and stable contact resistance for reliable production yield • Highly compliant to accommodate wide co-planarity variations • Automated probe manufacturing enables low cost and short lead time 49.225 42.60 48.56 60.3837 9.4615 Description: Socket Specification Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6010 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 137.44 STATUS: Released SHEET: 1 OF 5 DRAWN BY: E. Smolentseva SCALE: 1:1 FILE: CBT-BGA-6010 DATE: 08/15/2012 REV. B 26.7250 BACKING PLATE Note: BGA pattern is not symmetrical with respect to the mounting holes 24.6000 SOCKET BASE 1.9875 2.7375 1.71 NON-PLATED HOLE (x4) 17.00 2.54 2.3625 26.725 BACKING PLATE 0.85 NON-PLATED HOLE (x2) 17.00 24.225 SOCKET BASE 21.7250 5.08 1.2500 1.2500 21.725 Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: same or higher than solder mask Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6010 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 137.44 STATUS: Released SHEET: 2 OF 5 DRAWN BY: E. Smolentseva SCALE: 2:1 FILE: CBT-BGA-6010 DATE: 08/15/2012 REV. B Ironwood Package COde: BGA324G D A C B E A1 0.15 C DETAIL H SCALE 8 : 1 H e DIM Minimum Maximum A 2.2 2.7 A1 0.4 0.6 b 0.5 0.7 D 19.0 +/- 0.2mm E 19.0 +/- 0.2mm e 1.00 ARRAY 18 x 18 PIN COUNT 324 b .25 C A B .10 SEE NOTE #3 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6010 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 137.44 STATUS: Released SHEET: 3 OF 5 DRAWN BY: E. Smolentseva SCALE: 1:50 FILE: CBT-BGA-6010 DATE: 08/15/2012 REV. B ITEM NO. 1 2 3 4 5 6 7 8 9 10 11 12 11 12 2 13 21 5 15 DESCRIPTION QTY. 1 1 1 1 1 1 1 1 1 1 1 2 16 Base for Clam shell socket 19mm IC Socket Lid CBT Ni compression plate 19mm 0.375mm shift Backing plate 19mm IC Ni plate Latch Customer's target PCB Insulation Plate Floating Guide 19mm 18x18 array 1mm pitch Middle Guide 19mm 18x18 1mm pitch Bottom Guide for 19mm 18x18 array 1mm pitch Compression Screw Screw, M3 x 12mm, Low Head Cap, SS Precision Compression Spring, Zinc-Plated Music Wire, 1/2" Length, .12" OD, .016" Wire Customer's IC Hinge Pin and Snap Ring, 3mm OD, 30mm long, 1045 Stl, Blk Oxide #0-80 X .75 LG, SOC HD CAP SCREW, ALLOY STL, BLK OXIDE 17 18 19 20 21 Dowel Pin, 1/32" x 3/8", SS Screw, #0-80 x .25", Pan, SS Pogo Pin, 1mm Pitch SBT BGA pin Floating Guide Spring Spring Clamshell lid assembly 2 4 324 8 2 13 14 SBT PIN 15 3 1 17 20 14 19 1.61±0.10 (x4) 15 1 1 2 4 8 9 10 18 6 1.27 7 4 16 2.50 21.725 1.5875 2.50 Insulation Plate Specification Description: Socket Assy, Insulation Plate Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6010 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 137.44 STATUS: Released SHEET: 4 OF 5 DRAWN BY: E. Smolentseva SCALE: 1:1 FILE: CBT-BGA-6010 DATE: 08/15/2012 REV. B Rev A Date 08/15/12 Initials ELS B 12/06/12 DH Description Original Changed M2816 to M1308, and Changed M2815 to M1302 Description: Revisions Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6010 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Finish: Weight: STATUS: Released SHEET: 5 OF 5 DRAWN BY: E. Smolentseva SCALE: 1:1 FILE: CBT-BGA-6010 DATE: 08/15/2012 REV. B