ON NSVD4001DR2G High current led driver Datasheet

NUD4001, NSVD4001
High Current LED Driver
This device is designed to replace discrete solutions for driving
LEDs in low voltage AC−DC applications 5.0 V, 12 V or 24 V. An
external resistor allows the circuit designer to set the drive current for
different LED arrays. This discrete integration technology eliminates
individual components by combining them into a single package,
which results in a significant reduction of both system cost and board
space. The device is a small surface mount package (SO–8).
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PIN CONFIGURATION
AND SCHEMATIC
Features
•
•
•
•
•
•
Supplies Constant LED Current for Varying Input Voltages
External Resistor Allows Designer to Set Current – up to 500 mA
Offered in Surface Mount Package Technology (SO−8)
AEC−Q101 Qualified and PPAP Capable
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
Pb−Free Package is Available
Benefits
•
•
•
•
Vin
1
8
Iout
Boost
2
7
Iout
Rext
3
6
Iout
GND
4
5
Iout
Current
Set Point
Maintains a Constant Light Output During Battery Drain
One Device can be used for Many Different LED Products
Reduces Board Space and Component Count
Simplifies Circuit and System Designs
MARKING
DIAGRAM
Typical Applications
• Portables: For Battery Back−up Applications, also Simple Ni−CAD
•
•
Battery Charging
Industrial: Low Voltage Lighting Applications and Small Appliances
Automotive: Tail Lights, Directional Lights, Back−up Light,
Dome Light
PIN FUNCTION DESCRIPTION
Pin
Symbol
Description
1
Vin
2
Boost
This pin may be used to drive an external transistor
as described in the App Note AND8198/D.
3
Rext
An external resistor between Rext and Vin pins sets
different current levels for different application needs
4
GND
Ground
5, 6, 7, 8
Iout
8
SO−8
CASE 751
STYLE 25
8
1
1
4001
A
Y
WW
G
4001
AYWW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Device
Positive input voltage to the device
The LEDs are connected from these pins to ground
ORDERING INFORMATION
Package
Shipping†
SO−8
2500 / Tape & Reel
NUD4001DR2G
SO−8
(Pb−Free)
2500 / Tape & Reel
NSVD4001DR2G
SO−8
(Pb−Free)
2500 / Tape & Reel
Device
NUD4001DR2
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 7
1
Publication Order Number:
NUD4001/D
NUD4001, NSVD4001
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Symbol
Value
Unit
Continuous Input Voltage
Vin
30
V
Non−repetitive Peak Input Voltage (t v 1.0 ms)
Vp
60
V
Output Current
(For Vdrop ≤ 2.2 V) (Note 1)
Iout
500
mA
Output Voltage
Vout
28
V
Human Body Model (HBM)
ESD
1000
V
Rating
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Vdrop = Vin – 0.7 V − VLEDs.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Operating Ambient Temperature
TA
−40 to +125
°C
Maximum Junction Temperature
TJ
150
°C
TSTG
−55 to +150
°C
PD
1.13
9.0
W
mW/°C
Thermal Resistance, Junction–to–Ambient (Note 2)
RqJA
110
°C/W
Thermal Resistance, Junction–to–Lead (Note 2)
RqJL
77
°C/W
Storage Temperature
Total Power Dissipation (Note 2)
Derating above 25°C (Figure 3)
2. Mounted on FR−4 board, 2 in sq pad, 2 oz coverage.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Output Current1
(Vin = 12 V, Rext = 2.0 W, VLEDs = 10 V)
Iout1
305
325
345
mA
Output Current2
(Vin = 30 V, Rext = 7.0 W, VLEDs = 24 V)
Iout2
95
105
115
mA
Bias Current
(Vin = 12 V, Rext = Open, VLEDs = 10 V)
IBias
−
5.0
8.0
mA
Voltage Overhead (Note 3)
Vover
1.4
−
−
V
3. Vover = Vin – VLEDs.
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2
NUD4001, NSVD4001
TYPICAL PERFORMANCE CURVES
(TA = 25°C unless otherwise noted)
1000
0.9
0.8
0.7
100
Rext, W
Vsense (V)
0.6
10
0.5
0.4
0.3
0.2
0.1
1
1
100
10
0.0
−40 −25 −10 5
1000
IOUT (mA)
20 35 50 65 80 95 110 125 140 155
TJ, JUNCTION TEMPERATURE (°C)
Figure 1. Output Current (IOUT)
vs. External Resistor (Rext)
Figure 2. Vsense vs. Junction Temperature
0.500
1.200
PD, POWER DISSIPATION (W)
0.450
1.000
0.400
PD_control (W)
0.800
0.600
0.400
0.350
0.300
0.250
0.200
0.150
0.100
0.200
0.050
35
45
55
65
75
85
95
105 115 125
0.000
0
5
10
15
20
25
TA, AMBIENT TEMPERATURE (°C)
Vin (V)
Figure 3. Total Power Dissipation (PD)
vs. Ambient Temperature (TA)
Figure 4. Internal Circuit Power Dissipation
vs. Input Voltage
1.2
OUTPUT CURRENT, NORMALIZED
0.000
25
1.0
0.8
0.6
0.4
0.2
0.0
−40 −25 −10 5
20 35 50 65 80 95 110 125 140 155
TJ, JUNCTION TEMPERATURE (°C)
Figure 5. Current Regulation vs. Junction
Temperature
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3
30
NUD4001, NSVD4001
APPLICATION INFORMATION
Design Guide
NUD4001
Vin
1. Define LED’s current:
a. ILED = 350 mA
Boost
2. Calculate Resistor Value for Rext:
a. Rext = Vsense (see Figure 2) / ILED
b. Rext = 0.7 (TJ = 25 °C)/ 0.350 = 2.0 W
Rext
GND
3. Define Vin:
a. Per example in Figure 6, Vin = 12 V
1
8
2
7
3
4
Current
Set Point
6
5
12 V
4. Define VLED @ ILED per LED supplier’s data
sheet:
a. Per example in Figure 6,
VLED = 3.5 V + 3.5 V + 3.5 V = 10.5 V
Figure 6. 12 V Application
(Series LED’s Array)
5. Calculate Vdrop across the NUD4001 device:
a. Vdrop = Vin – Vsense – VLED
b. Vdrop = 12 V – 0.7 V (TJ = 25 °C) – 10.5 V
c. Vdrop = 0.8 V
6. Calculate Power Dissipation on the NUD4001
device’s driver:
a. PD_driver = Vdrop * Iout
b. PD_driver = 0.8 V x 0.350 A
c. PD_driver = 0.280 Watts
7. Establish Power Dissipation on the NUD4001
device’s control circuit per Figure 4:
a. PD_control = Figure 4, for 12 V input voltage
b. PD_control = 0.055 W
8. Calculate Total Power Dissipation on the device:
a. PD_total = PD_driver + PD_control
b. PD_total = 0.280 W + 0.055 W = 0.335 W
9. If PD_total > 1.13 W (or derated value per
Figure 3), then select the most appropriate
recourse and repeat steps 1 through 8:
a. Reduce Vin
b. Reconfigure LED array to reduce Vdrop
c. Reduce Iout by increasing Rext
d. Use external resistors or parallel device’s
configuration (see application note AND8156)
10. Calculate the junction temperaure using the
thermal information on Page 7 and refer to Figure
5 to check the output current drop due to the
calculated junction temperature. If desired,
compensate it by adjusting the value of Rext.
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4
Iout
Iout
Iout
Iout
NUD4001, NSVD4001
TYPICAL APPLICATION CIRCUITS
D1
1N4004
R1
2.7 W, 1/4 W
1
Q1
R3
2.7 W, 1/4 W
8
7
2
3 NUD4001 6
5
4
Vbat +
13.5 Vdc −
1
Q2
8
7
3 NUD4001 6
2
5
4
R4
32 W, 5.0 W
R2
32 W, 5.0 W
R3
6.7 W, 4.0 W
LED1
Luxeon
Emitter
550 mA
0
Figure 7. Stop light automotive circuit using the NUD4001 device
to drive one high current LED (550 mA).
D1
1N4004
R1
7.0 W, 1/4 W
1
2
Q1
R2
7.0 W, 1/4 W
8
7
3 NUD4001 6
4
5
1
Q2
8
7
3 NUD4001 6
2
4
5
Vbat +
13.5 Vdc −
R3
27 W, 2.0 W
LED1
Luxeon
Emitter
220 mA
0
Figure 8. Dome light automotive circuit using the NUD4001 device
to drive one LED (220 mA).
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5
NUD4001, NSVD4001
1
Rext1
2.0 W, 1/4 W
Q1
8
7
3 NUD4001 6
2
5
4
Rext2
110 k, 1/4 W
LED1
LXHL−MW1D
Vbat +
12 Vdc −
LED2
LXHL−MW1D
Q2
2N2222
LED3
LXHL−MW1D
PWM
0
Figure 9. NUD4001 Device Configuration for PWM
D1
MURA105T3
D2
MURA105T3
R2
2.0 W, 1/4 W
1
8
7
3 NUD4001 6
2
4
12 Vac from:
60 Hz Transformer or
Electronic Transformer
Q2
5
C1
220 mF
LED1
Luxeon Emitter
350 mA
LED2
Luxeon Emitter
350 mA
D3
MURA105T3
D4
MURA105T3
LED3
Luxeon Emitter
350 mA
0
Figure 10. 12 Vac landscape lighting application circuit using the
NUD4001 device to drive three 350 mA LEDs.
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6
NUD4001, NSVD4001
THERMAL INFORMATION
NUD4001, NSVD4001 Power Dissipation
reduce the thermal resistance. Figure 11 shows how the
thermal resistance changes for different copper areas.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad®. Using a
board material such as Thermal Clad or an aluminum core
board, the power dissipation can be even doubled using the
same footprint.
The power dissipation of the SO−8 is a function of the pad
size. This can vary from the minimum pad size for soldering
to a pad size given for maximum power dissipation. Power
dissipation for a surface mount device is determined by
TJ(max), the maximum rated junction temperature of the die,
RqJA, the thermal resistance from the device junction to
ambient, and the operating temperature, TA. Using the
values provided on the data sheet for the SO−8 package, PD
can be calculated as follows:
180
160
T
* TA
PD + Jmax
RqJA
140
qJA (°C/W)
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device which in this
case is 1.13 W.
120
100
PD + 150° C * 25° C + 1.13 W
110° C
80
The 110°C/W for the SO−8 package assumes the use of a
FR−4 copper board with an area of 2 square inches with 2 oz
coverage to achieve a power dissipation of 1.13 W. There are
other alternatives to achieving higher dissipation from the
SOIC package. One of them is to increase the copper area to
60
0
1
2
3
4
5
6
7
8
10
9
BOARD AREA (in2)
Figure 11. qJA versus Board Area
250
1S −36.9 sq. mm −0.057 in sq.
1S −75.8 sq. mm −0.117 in sq.
200
R(q) (C°/W)
1S −150.0 sq. mm −0.233 in sq.
150
1S −321.5 sq. mm −0.498 in sq.
1S −681.0 sq. mm −1.056 in sq.
100
1S −1255.0 sq. mm −1.945 in sq.
50
0
0.000001
0.00001
0.0001
0.001
0.1
0.01
1
TIME (sec)
Figure 12. Transient Thermal Response
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7
10
100
1000
NUD4001, NSVD4001
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
S
M
J
SOLDERING FOOTPRINT*
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
STYLE 25:
PIN 1. VIN
2. N/C
3. REXT
4. GND
5. IOUT
6. IOUT
7. IOUT
8. IOUT
1.52
0.060
7.0
0.275
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Thermal Clad is a registered trademark of the Bergquist Company.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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