LITEON LTL-1AHG Through hole lamp Datasheet

Through Hole Lamp
Product Data Sheet
LTL-1AHG
Spec No.: DS-20-95-0302
Effective Date: 07/21/2012
Revision: A
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
LITE-ON TECHNOLOGY CORPORATION.
Property of Lite-On Only
Features
* Lead (Pb) free product -RoHs compliant.
* Low power consumption.
* High efficiency.
* Versatile mounting on P.C. Board or panel.
* I.C. Compatible/low current requirement.
* 3.1 mm diameter package.
Package Dimensions
Part No.
Lens
Source Color
LTL-1AHG
Green Diffused
Green
NOTES:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm(.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.
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Absolute Maximum Ratings at TA=25℃
Parameter
Maximum Rating
Unit
100
mW
120
mA
Continuous Forward Current
30
mA
Derating Linear From 50℃
0.4
mA/℃
Operating Temperature Range
-55℃ to + 100℃
Storage Temperature Range
-55℃ to + 100℃
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
Lead Soldering Temperature
[1.6mm(.063") From Body]
Part No. : LTL-1AHG
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260℃ for 5 Seconds
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Electrical Optical Characteristics at TA=25℃
Parameter
Symbol
Min.
Typ.
IV
8.7
29
mcd
2θ1/2
60
deg
Peak Emission Wavelength
λP
565
nm
Dominant Wavelength
λd
569
nm
Δλ
30
nm
Forward Voltage
VF
2.1
Reverse Current
IR
Luminous Intensity
Viewing Angle
Spectral Line Half-Width
Max.
Unit
2.6
V
100
μA
Test Condition
IF = 10mA
Note 1,4
Note 2 (Fig.5)
Measurement
@Peak (Fig.1)
Note 3
IF = 20mA
Note 5
VR = 5V
Note: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
(Commission International De L'Eclairage) eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
4. The Iv guarantee should be added ±15%.
5. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for
reverse operation.
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Typical Electrical / Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
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Packing Spec
1000, 500 or 200,100 pcs per packing bag
10 packing bags per inner carton
Total 10000 pcs per inner carton
8 Inner cartons per outer carton
Total 80000 pcs per outer carton
In every shipping lot, only the last pack will be non-full packing
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Bin Table For Reference
Luminous Intensity
Unit : mcd @ 10mA
Bin Code
Min.
Max.
NO1
34.0
60.0
NO2
19.0
34.0
NO3
12.6
19.0
NO4
8.7
12.6
Note: Tolerance of each bin limit is ±15%
Dominant Wavelength
Unit : nm @ 10 mA
Bin Code
Min.
Max.
GE2
572.0
574.0
GE3
570.0
572.0
GE4
568.0
570.0
GE5
566.0
568.0
GE6
564.0
566.0
Note: Tolerance of each bin limit is ±1nm
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
Soldering iron
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Wave soldering
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
5 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
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6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
 Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
 All devices, equipment, and machinery must be properly grounded
 Work tables, storage racks, etc. should be properly grounded
 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs
plastic lens as a result of friction between LEDs during storage and handing
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Suggested checking list :
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or
conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe
workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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8. Reliability Test
Classification
Test Item
Operation Life
(LT)
Endurance
Test Condition
Ta = under room temperature
IF = per datasheet maximum drive
current
*Test time = 1000 hrs
MIL-STD-750D:1026 (1995)
MIL-STD-883G:1005 (2006)
High temperature/ Ta = 60°C
High humidity
RH = 90%
storage (THS)
Test time = 240hrs
MIL-STD-202G:103B (2002)
JEITA ED-4701:100 103 (2001)
High temperature Ta = 105 ± 5 °C
storage
Test time = 1000 hrs
MIL-STD-750D:1031 (1995)
MIL-STD-883G:1008 (2006)
JEITA ED-4701:200 201 (2001)
Low temperature
storage
Ta= -55 ± 5°C
Test time = 1000 hrs
JEITA ED-4701: 200 202
(2001)
Temperature
cycling
100°C ~ 25°C ~ -40°C ~ 25°C
30 mins 5 mins 30 mins 5 mins
30 cycles
Thermal
Shock
100 ± 5°C ~ -30 ± 5 °C
15 mins
15 mins
30 cycles (< 20 secs transfer)
Solder resistance
(no pre-condition)
T.sol = 260 ± 5°C
Dwell time = 10 ± 1 sec
3mm from the base of the epoxy buib
Test
Environmental
Test
Reference Standard
MIL-STD-750D:1051 (1995)
MIL-STD-883G:1010 (2006)
JEITA ED-4701:100 105 (2001)
JESD22-A104C (2005)
MIL-STD-750D:1056 (1995)
MIL-STD-883G:1011 (2006)
MIL-STD-202G:107G (2002)
JESD22-A106B (2004)
MIL-STD-750D:2031 (1995)
JEITA ED-4701: 300 302
(2001)
Solderability
T.sol = 245 ± 5°C
(no pre-condition) Dwell time = 5 ± 0.5 sec
MIL-STD-750D:2026 (1995)
MIL-STD-883G:2003 (2006)
MIL-STD-202G:208H (2002)
IPC/EIA J-STD-002 (2004)
Soldering Iron
T.sol = 350 ± 5°C
(no pre-condition) Dwell time = 3.5 ± 0.5 sec
MIL-STD-202G:208H (2002)
JEITA ED-4701: 300 302
(2001)
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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