ON NRVB230LSFT1G Surface mount schottky power rectifier Datasheet

MBR230LSFT1G
Surface Mount
Schottky Power Rectifier
Plastic SOD−123 Package
This device uses the Schottky Barrier principle with a large area
metal−to−silicon power diode. Ideally suited for low voltage, high
frequency rectification or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package also provides an easy to work
with alternative to leadless 34 package style. Because of its small size,
it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are AC−DC and
DC−DC converters, reverse battery protection, and “Oring” of
multiple supply voltages and any other application where performance
and size are critical.
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SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 30 VOLTS
SOD−123FL
CASE 498
Features
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Guardring for Stress Protection
Low Forward Voltage
125°C Operating Junction Temperature
Epoxy Meets UL 94 V−0
Package Designed for Optimal Automated Board Assembly
ESD Ratings: Machine Model, C
Human Body Model, 3B
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
Mechanical Characteristics
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July, 2014 − Rev. 1
L3N MG
G
L3N = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Reel Options: MBR230LSFT1G = 3,000 per 7 in reel/8 mm tape
Device Marking: L3N
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy, Molded
Lead Finish: 100% Matte Sn (Tin)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL 1 Requirements
© Semiconductor Components Industries, LLC, 2014
MARKING DIAGRAM
1
MBR230LSFT1G
Package
Shipping†
SOD−123FL 3000/Tape & Reel
(Pb−Free)
NRVB230LSFT1G SOD−123FL 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
MBR230LSFT1/D
MBR230LSFT1G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VRRM
VRWM
VR
30
V
IO
2.0
A
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 100 kHz, TL = 95°C)
IFRM
4.0
A
Non−Repetitive Peak Surge Current
(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)
IFSM
40
A
Storage Temperature
Tstg
−55 to 150
°C
Operating Junction Temperature
TJ
−55 to 125
°C
dv/dt
10,000
V/ms
Rtjl
Rtjl
Rtja
Rtja
26
21
325
82
°C/W
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (At Rated VR, TL = 105°C)
Voltage Rate of Change (Rated VR, TJ = 25°C)
THERMAL CHARACTERISTICS
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Lead (Note 2)
Thermal Resistance, Junction−to−Ambient (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 2)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Mounted with 1 in. copper pad (Cu area 700 mm2).
ELECTRICAL CHARACTERISTICS
VF
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 1.0 A)
(IF = 2.0 A)
IR
Maximum Instantaneous Reverse Current (Note 3)
(VR = 30 V)
TJ = 25°C
TJ = 100°C
0.38
0.43
0.30
0.37
TJ = 25°C
TJ = 100°C
1.0
25
V
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%.
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2
MBR230LSFT1G
TYPICAL CHARACTERISTICS
TJ = 125°C
TJ = 100°C
TJ = 25°C
TJ = −55°C
0.1
0.10
0.30
0.20
0.40
0.50
0.60
0.70
1 T = 125°C
J
TJ = 100°C
0.1
0.10
0.80
0.20
0.30
0.40
0.50
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
TJ = 125°C
10E−3
TJ = 25°C
10E−6
1E−6
TJ = −55°C
100E−9
10E−3
TJ = 100°C
1E−3
TJ = 25°C
0
10
20
VR, REVERSE VOLTAGE (VOLTS)
30
TJ = −55°C
10E−6
0
3.5
dc
3
2.5
freq = 20 kHz
square wave
Ipk/IO = p
Ipk/IO = 5
1.5
1
0.5
0
25
35
45
55
65
75
85
95
10
20
VR, REVERSE VOLTAGE (VOLTS)
30
Figure 4. Maximum Reverse Current
105 115
125
TL, LEAD TEMPERATURE (°C)
PFO, AVERAGE POWER DISSIPATION (WATTS)
Figure 3. Typical Reverse Current
2
TJ = 125°C
100E−6
10E−9
1E−9
1E+0
100E−3
TJ = 100°C
1E−3
0.70
0.60
VF, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (VOLTS)
100E−6
IO, AVERAGE FORWARD CURRENT (AMPS)
TJ = −55°C
TJ = 25°C
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
100E−3
IR, REVERSE CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
1
10
IR, MAXIMUM REVERSE CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
10
1.6
1.4
dc
square wave
Ipk/IO = p
1.2
1.0
Ipk/IO = 5
0.8
0.6
0.4
0.2
0
0
0.5
1.0
1.5
2.0
2.5
3.0
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Forward Power Dissipation
Figure 5. Current Derating
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3
3.5
MBR230LSFT1G
C, CAPACITANCE (pF)
1000
TJ, DERATED OPERATING TEMPERATURE (°C)
TYPICAL CHARACTERISTICS
TJ = 25 °C
100
10
0
5
10
15
20
25
VR, REVERSE VOLTAGE (VOLTS)
30
125
RqJA = 25.6 °C/W
120
115
110
105
RqJA = 130 °C/W
100
95
90
RqJA = 235 °C/W
85
80
75
70
65
RqJA = 324.9 °C/W
RqJA = 400 °C/W
0
r(t), TRANSIENT THERMAL RESISTANCE
Figure 7. Capacitance
2
4
6
8
10 12
14 16
VR, DC REVERSE VOLTAGE (VOLTS)
18
20
Figure 8. Typical Operating Temperature
Derating
1000
D = 0.5
100
0.2
0.1
0.05
P(pk)
10
0.01
t1
t2
1
DUTY CYCLE, D = t1/t2
SINGLE PULSE
qJA = 321.8 °C/W
Test Type > Min Pad < Die Size 38x38 @ 75% mils
0.1
0.000001 0.00001
0.0001
0.001
0.01
0.1
t1, TIME (sec)
Figure 9. Thermal Response
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4
1
10
100
1000
MBR230LSFT1G
PACKAGE DIMENSIONS
SOD−123LF
CASE 498
ISSUE D
q
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
D
1
2
DIM
A
A1
b
c
D
E
L
HE
q
A1
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
END VIEW
TOP VIEW
q
HE
MIN
0.90
0.00
0.70
0.10
1.50
2.50
0.55
3.40
0°
MILLIMETERS
NOM
MAX
0.95
0.98
0.05
0.10
0.90
1.10
0.15
0.20
1.65
1.80
2.70
2.90
0.75
0.95
3.60
3.80
8°
−
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
−
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
RECOMMENDED
SOLDERING FOOTPRINT*
c
SIDE VIEW
4.20
2X
2X
L
b
2X
BOTTOM VIEW
1.22
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
2X
1.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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MBR230LSFT1/D
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