NUP4107UPMU Product Preview Low Capacitance ESD Protection Array for High Speed Data Line Protection http://onsemi.com The NUP4107UPMU ESD protection array is designed to protect high speed data lines from ESD. Ultra−low capacitance and high level of ESD protection makes this device well suited for use in USB 2.0 applications. 4 5 6 Features • Low Capacitance (< 2 pF Typical Between I/O Lines and Ground) • ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model and Class C (Exceeding 400 V) per Machine Model • Protection for the Following IEC Standards: IEC 61000−4−2 (12 kV Contact) 3 • UL Flammability Rating of 94 V−0 • This is a Pb−Free Device 1 MARKING DIAGRAM Typical Applications • • • • • USB 2.0 Data Line and Power Line Protection MIDDI Ports SIM Ports Gigabit Ethernet Notebook Computers 1 XX M G XX MG G = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Operating Junction Temperature Range TJ −40 to +125 °C Storage Temperature Range Tstg −55 to +150 °C Lead Solder Temperature − Maximum (10 Seconds) TL 260 °C ESD 16000 400 12000 V Human Body Model (HBM) Machine Model (MM) IEC 61000−4−2 Contact (ESD) 1 UDFN6 1.6x1.6 MU SUFFIX CASE 517AP 6 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. PIN CONNECTIONS I/O 1 NC 2 GND I/O 3 6 I/O 5 VBUS 4 I/O ORDERING INFORMATION Device NUP4107UPMUTAG Package Shipping† UDFN6 3000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. © Semiconductor Components Industries, LLC, 2008 November, 2008 − Rev. P0 1 Publication Order Number: NUP4107UPMU/D NUP4107UPMU ELECTRICAL CHARACTERISTICS (TJ=25°C unless otherwise specified) Parameter Reverse Working Voltage Breakdown Voltage Symbol VRWM VBR Conditions Min Typ (Note 1) IT = 1 mA, (Note 2) Max Unit 5.0 V 6.0 Reverse Leakage Current IR VRWM = 5 V Junction Capacitance CJ VR = 0 V, f = 1 MHz between I/O Pins and GND Junction Capacitance CJ VR = 0 V, f = 1 MHz between I/O Pins V 1.0 mA 1.9 3.0 pF 0.8 1.0 pF 1. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC or continuous peak operating voltage level. 2. VBR is measured at pulse test current IT. http://onsemi.com 2 NUP4107UPMU PACKAGE DIMENSIONS UDFN6, 1.6x1.6, 0.5P CASE 517AP−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X E DETAIL A OPTIONAL CONSTRUCTION 0.10 C A (A3) DETAIL B 0.05 C A1 0.05 C SIDE VIEW DETAIL A 6X C A1 SEATING PLANE DIM A A1 A3 b D E e D2 E2 K L L1 MOLD CMPD EXPOSED Cu TOP VIEW 6X L L1 ÉÉÉ ÉÉÉ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. ÉÉÉ ÉÉÉ A3 DETAIL B OPTIONAL CONSTRUCTION SOLDERMASK DEFINED MOUNTING FOOTPRINT* D2 L 1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.20 0.30 1.60 BSC 1.60 BSC 0.50 BSC 1.10 1.30 0.45 0.65 0.20 −−− 0.20 0.40 0.00 0.15 1.26 3 E2 6X 6X K 6 5 6X 0.52 b e 0.10 C A B BOTTOM VIEW 0.05 C NOTE 3 0.61 1.90 1 0.50 PITCH 6X 0.32 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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