Material Content Data Sheet Sales Product Name SAH-XC2361B-40F66L AA MA# MA001046282 Package PG-LQFP-100-8 Issued 29. August 2013 Weight* 753.33 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 28.688 3.81 0.069 0.01 0.275 0.04 365 5.501 0.73 7302 223.351 29.65 30.43 296485 304243 2.532 0.34 0.34 3361 3361 2.362 0.31 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.81 38081 38081 91 3136 63.786 8.47 406.340 53.93 62.71 539392 627200 9.288 1.23 1.23 12330 12330 2.495 0.33 0.33 3312 3312 2.161 0.29 6.482 0.86 84672 2868 1.15 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 8605 11473 1000000