LSTD BTM441 Modules from laird technologies have been designed to meet the needs of developer Datasheet

A
Datasheet
BTM44x
Version 3.6
BTM44x
Datasheet
REVISION HISTORY
Revision
1.0
Date
9/10/2011
Description
Initial Release
Approved By
Jonathan Kaye
1.1
2.0
04/2012
08/2012
Up to Build 240
General Formatting
Jonathan Kaye
Jonathan Kaye
3.0
01/14/2013
Jonathan Kaye
3.1
09 Dec 2013
Reformatting, Updates to FCC/IC Statements, Updates to
Mechanical Specs
A. Dobbing’s signature added to DoC
3.2
02 Feb 2014
Jonathan Kaye
3.3
06 Feb 2014
Separated document into two docs: User Guide and
Hardware Integration Guide
Updated Bluetooth SIG Qualification section
3.4
18 Aug 2014
Jonathan Kaye
3.5
3 Sept 2014
3.6
18 Aug 2016
Updated shipping tray image and added module package
dimension image.
Updated EU Declaration of Conformity for BTM441 /
BTM443
Changed from Hardware Integration Guide to Datasheet
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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© Copyright 2015 Laird. All Rights Reserved
Jonathan Kaye
Jonathan Kaye
Jonathan Kaye
Sue White
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BTM44x
Datasheet
CONTENTS
1
2
Product Description ............................................................................................................................................5
1.1
Features and Benefits
........................................................................................................................5
1.2
Applications............................................................................................................................................5
1.3
Bluetooth® Profiles Supported ..............................................................................................................5
Hardware Specifications .....................................................................................................................................6
2.1
Pin Definitions ........................................................................................................................................6
2.3
Physical Specifications ...........................................................................................................................8
2.4
Electrical Specifications..........................................................................................................................8
2.5
Operational Specifications .....................................................................................................................8
2.6
Voltage Parameters ...............................................................................................................................8
2.7
I/O Details ........................................................................................................................................... 10
3
Mechanical Considerations ............................................................................................................................. 11
4
FCC Regulatory Statements ............................................................................................................................. 18
4.1
5
4.1.1
Considerations for OEM Integration ................................................................................................... 18
4.1.3
FCC Labeling requirement................................................................................................................... 19
Declarations of Compliance............................................................................................................................. 20
5.1
EU Declaration of Conformity – BTM440 / BTM442........................................................................... 20
5.1.1
Reference standards used for presumption of conformity: ............................................................... 20
5.1.2
Declaration: ......................................................................................................................................... 20
5.2
6
FCC and Industry Canada Statements ................................................................................................. 18
EU Declaration of Conformity – BTM441 / BTM443........................................................................... 21
5.2.1
Reference Standards used for Presumption of Conformity................................................................ 21
5.2.2
Declaration: ......................................................................................................................................... 21
Bluetooth Approvals ........................................................................................................................................ 22
6.1
Subsystem Combinations.................................................................................................................... 22
6.2
Assumptions........................................................................................................................................ 22
6.3
Additional Assistance .......................................................................................................................... 23
7
Ordering Information ...................................................................................................................................... 23
8
Application Note for Surface Mount Modules ................................................................................................ 24
8.1
Introduction ........................................................................................................................................ 24
8.2
Shipping............................................................................................................................................... 24
8.3
Reflow Parameters.............................................................................................................................. 24
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BTM44x
Datasheet
9
References ....................................................................................................................................................... 26
10
Glossary of Terms................................................................................................................................ 27
11
Related Documents and Files.............................................................................................................. 28
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BTM44x
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1 PRODUCT DESCRIPTION
The BTM44x Bluetooth® modules from Laird Technologies have been designed to meet the needs of developers
who wish to add robust, short range Bluetooth data connectivity to their products. They are based on the
market leading Cambridge Silicon Radio BC04 chipset, providing exceptionally low power consumption with
outstanding range. They support the latest Bluetooth® Version 2.1 Specification, providing the important
advantage of Secure Simple Pairing, which improves security and enhances the ease of use for end customers.
With physical sizes as small as 12.5 x 18.0mm and best of class, low-power operation, these modules are the
ideal choice for applications where designers need both performance and minimum size. For maximum
flexibility in systems integration, the modules are designed to support a separate power supply for I/O.
To aid product development and integration, Laird Technologies has integrated a complete Bluetooth protocol
stack within the modules, including support for multiple Bluetooth Profiles. The modules are fully qualified as
Bluetooth End Products, allowing designers to integrate them within their own products with no further
Bluetooth Qualification. They can then list and promote their products on the Bluetooth website free of charge.
Support for Serial Port Profile (SPP), Human Interface Device (HID) profile and Health Device Profile (HDP) are
included in the module. The support of the Bluetooth Sig’s Health Device Profile makes this the ideal module for
development of Continua compliant medical and wellness devices. By default the Health Device Profile supports
the ISO/IEEE 11073-10415 device specialization for weigh scales, but additional specializations for glucose and
thermometer are available with more upon request.
Communication is available to the module over a serial UART utilizing either a custom Multi-point Packet
Protocol API or comprehensive AT commands. Combined with a low cost developer’s kit, this ensures that the
choice of Laird Technologies modules guarantees the fastest route to market.
Applications
Features and Benefits











Bluetooth® v2.1+EDR
Adaptive Frequency Hopping to cope
with interference from other
wireless devices
Secure Simple Pairing support
External or internal antenna options
Comprehensive AT interface for
simple programming
Alternate Packet based interface for
complex programming
Bluetooth® END Product Qualified
Compact size
Class 2 output – 4dBm
Low power operation
UART interface
Embedded Wireless Solutions Support Center:
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www.lairdtech.com/wireless






Embedded Devices
Phone Devices
Phone Accessories
Security Devices
Medical and Wellness Devices
Automotive Applications
Bluetooth® Profiles Supported






Serial Port Profile (SPP)
Human Interface Device (HID) Profile Host
and device supported
Health Device Profile (HDP): Agent supported
IEEE Device Specialization 11073-10415 (Weight Scale)
IEEE Device Specialization 11073 - 10408 (Thermometer)
IEEE Device Specialization 11073 – 10417 (Glucose)
5
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BTM44x
Datasheet
2 HARDWARE SPECIFICATIONS
Pin Definitions
Table 1: Pin definitions
Description
Voltage Specification
1
2
Signal
Unused
GND
3
4
UART_CTS
UART_RXD
Clear to Send I/P
Receive data I/P
VUSB
VUSB
5
6
UART_RTS
UART_TXD
Request to Send O/P
Transmit data O/P
VUSB
VUSB
7
8
GND
SPI_CSB
SPI bus chip select I/P
VIO
9
10
11
12
13
14
15
16
17
18
SPI_MISO
SPI_MOSI
SPI_CLK
VDD_USB
VDD_IO
VDD_IN
GND
PCM_IN
PCM_SYNC
PCM_CLK
SPI bus serial O/P
SPI bus serial I/P
SPI bus clock I/P
USB & UART supply voltage
I/O supply voltage
Main supply voltage
VIO
VIO
VIO
PCM Data I/P
PCM sync I/P
PCM clock I/P
VIO
VIO
VIO
19
20
PCM_OUT
RESET
PCM Data O/P
Module reset I/P
VIO
See note 2
21
22
23
24
25
26
27
28
29
GPIO4
GPIO2 / UART_DCD
GND
Unused
Unused
Unused
Unused
GND
ANT (BTM440 / 442 only)
I/O for host- BT_Active BT_State
I/O for host
VIO
VIO
30
31
32
33
34
GND
Unused
Unused
Unused
Unused
See note 3
See note 3
See note 3
See note 3
See note 3
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See note 3
See note 3
See note 3
See note 3
Antenna connection (50 ohm
matched)
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See note 3
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35
36
Signal
Unused
Unused
Description
See note 3
See note 3
Voltage Specification
37
38
Unused
Unused
See note 3
39
40
Unused
Unused
41
42
GND
GPIO1 / UART_RI
I/O for host
VIO
43
44
GPIO7 / UART_DTR
GPIO8 / UART_DSR
I/O for host
I/O for host
VIO
VIO
45
46
47
48
49
50
GND
DD+
GPIO6
GPIO5
GPIO3
Not used for AT module variants
Not used for AT module variants
I/O for host- RF_Active
I/O for host – WLAN_Active
I/O for host – BT_Priority
VUSB
VUSB
VIO
VIO
VIO
Notes:
Unused pins may have internal connections and must not be connected.
Reset input is active low. Input is pulled up to VDD_IN via 22k. Minimum reset pulse width is 5ms.
Pins 25-37 should be left not connected on modules with integrated antenna (BTM441/3)
Pins 8 – 11 (SPI related) are only for Laird internal production purposes.
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Datasheet
Physical Specifications
Table 2: Physical Specifications
Categories
Physical
Environmental
Miscellaneous
Feature
Dimensions
Implementation
12.5mm x 18.0 x 3.4mm (BTM440 / 442)
Weight
Operating Temperature
Storage Temperature
Lead free
12.5mm x 24.0mm x 3.4mm (BTM441/3)
12.5mm x 22.0 x 3.4mm (BTM441 / 443)
3 grams
-40°C to +85°C
-40°C to +85°C
Lead-free and RoHS compliant
Electrical Specifications
Table 3: Electrical Specifications
Categories
Wireless Specification
Feature
Bluetooth®
Transmit Class
Frequency
Channels
Max Transmit Power
Min Transmit Power
Receive Sensitivity
Range
Data Transfer Rate
Implementation
Version 2.1+EDR
Class 2
2.402 – 2.480 GHz
79 channels Frequency Hopping
Adaptive Frequency Hopping
+4 dBm at antenna pad (BTM440/2)
+4 dBmi from integrated antenna (BTM441/3)
-27 dBm at antenna pad (BTM440/2)
-27 dBmi from integrated antenna (BTM441/3)
-84 dBm
30 m
Up to 350 kbps
Operational Specifications
Table 4: Operational Specifiations
Recommended Operating Conditions
VDD_USB (USB compatibility not required)
VDD_USB (USB compatibility required)
MIN
1.7
3.1
MAX
3.6
3.6
VDD_IO
VDD_IN
1.7
3.0
3.3
3.3
Voltage Parameters
Table 5: Voltage Parameters (VUSB)
Logic Levels (VUSB)
INPUT VOLTAGE LEVELS
Vih
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MIN
TYP
MAX
0.7VDD_USB
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Logic Levels (VUSB)
Vil 2.7<VDD_USB<3.0
1.7<VDD_USB<1.9
MIN
-0.4
-0.4
TYP
MAX
+0.8
+0.4
OUTPUT VOLTAGE LEVELS (1.7<VDD_USB<1.9)
Voh (Iout = -4mA)
VDD_USB – 0.4
Vol (Iout = 4mA)
OUTPUT VOLTAGE LEVELS (2.7<VDD_USB<3.0)
Voh (Iout = -4mA)
Vol (Iout = 4mA)
0.4
VDD_USB – 0.2
0.2
Note: VDD_USB must be connected to power the USB and UART interfaces.
Table 6: Voltage Parameters (VIO)
Logic Levels (VIO)
MIN
INPUT VOLTAGE LEVELS
Vih
0.7VDD_IO
Vil 2.7<VDD_IO<3.0
-0.4
1.7<VDD_IO<1.9
-0.4
OUTPUT VOLTAGE LEVELS (1.7 < VDD_IO < 1.9)
Voh (Iout = -4mA)
VDD_IO – 0.4
Vol (Iout = 4mA)
OUTPUT VOLTAGE LEVELS (2.7 < VDD_IO < 3.0)
Voh (Iout = -4mA)
VDD_IO – 0.2
Vol (Iout = 4mA)
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TYP
MAX
+0.8
+0.4
0.4
0.2
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I/O Details
Table 7: I/O Details
Categories
Command
Interface
Feature
AT Instructions set
Implementation
Comprehensive control of connection
and module operation
S Registers for non-volatile storage of parameters
UART Interface
Baud Rate
AT Mode Default Baud Rate: 9600 bps
MP Mode Default Baud Rate: 115,200 bps
Supply Voltage
Supply
I/O
USB & UART
3.0V – 3.3V DC
1.7V – 3.3V DC (independent of Supply)
1.7V – 3.6V DC (independent of Supply)
Coexistence /
Compatibility
WLAN (802.11)
2-wire and 3-wire hardware coexistence
schemes supported
Connections
Interface
External Antenna (BTM440/2)
Bluetooth
FCC
Surface Mount Pads
Pad for 50 Ohm antenna
Qualified as an END product
Limited Modular Approval (BTM440/2)
Full Modular Approval (BTM441/3)
Limited Modular Approval (BTM440/2)
Full Modular Approval (BTM441/3)
Meets CE and R&TTE requirements
Lead-free and RoHS compliant
1-Year Warranty
Development board and software tools DVK-BTM440/2
Dev Kit with BTM440/2 module fitted
DVK-BTM441/3 Dev Kit with BTM441/3 module fitted
Approvals
Industry Canada (IC)
Miscellaneous
Development
Tools
CE & R&TTE
Lead free
Warranty
Development Kit
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3 MECHANICAL CONSIDERATIONS
Mechanical Layout - BTM440/442 Mechanical Details
Module Keep-Out Area:An area of 1.5mm around the module should be reserved as a keep-out area.
No other components should be placed in this area.
Note:
Development Kit Schematics for this product can be accessed from the the BTM44x product page.
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Mechanical layout - BTM440/442 Mechanical Details
Module Keep-Out Area:An area of 1.5mm around the module should be reserved as a keep-out area.
No other components should be placed in this area.
Note:
Development Kit Schematics for this product can be accessed from the the BTM44x product page.
Embedded Wireless Solutions Support Center:
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Mechanical layout - BTM440/442 Mechanical Details
WARNING: Test point dimensions are for reference only. DO NOT make electrical connections to these test
points, this will void the warranty. Laird does not recommend routing on the top layer underneath
the module.
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BTM44x
Datasheet
Mechanical layout - BTM441/443 Mechanical Details
Module Keep-Out Area:An area of 1.5mm around the module should be reserved as a keep-out area.
No other components should be placed in this area.
Note:
Development Kit Schematics for this product can be accessed from the BTM44x product page.
Embedded Wireless Solutions Support Center:
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www.lairdtech.com/wireless
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Mechanical layout - BTM441/443 Mechanical Details
Module Keep-Out Area:An area of 1.5mm around the module should be reserved as a keep-out area.
No other components should be placed in this area.
Note:
Development Kit Schematics for this product can be accessed from the following link: DVK Schematics
– BTM44x
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Mechanical layout - BTM441/443 Mechanical Details
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BTM44x
Datasheet
Mechanical layout - BTM441/443 Mechanical Details
WARNING: Test point dimensions are for reference only. DO NOT make electrical connections to these test
points, this will void the warranty. Laird does not recommend routing on the top layer underneath
the module.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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BTM44x
Datasheet
4 FCC REGULATORY STATEMENTS
FCC and Industry Canada Statements
The OEM’s final equipment user manual must show the following statement:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
4.1.1 Considerations for OEM Integration
Changes or modifications not expressly approved by Laird Technologies could void the user’s authority to
operate the equipment.
Designers should note the distinction that the FCC makes regarding portable and mobile devices. Mobile devices
are defined as products that are not used closer than 20cm to the human body, whereas portable devices can be
used closer that 20cm to the body. A device may be used in portable exposure conditions with no restrictions on
host platforms when the averaged output power is less than the low power threshold for an uncontrolled
environment ≤ 60/f(GHz) i.e. 25mW for a 2.4Ghz device. The Maximum Power Exposure for the BTM44x has
been evaluated and found to comply with the low power threshold for an uncontrolled environment. Refer to
FCC document KDB 447498 for more information on RF exposure procedures and equipment authorization
policies for mobile and portable devices.
The BTM44x comply with the FCC RF radiation exposure limits set forth for an uncontrolled environment. This
device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter
except in accordance with FCC multi-transmitter product procedures. These procedures could require RF
exposure evaluation to be re-evaluated on the complete product.
The installer of this module into host equipment must ensure his equipment complies with the FCC RF Exposure
requirements set forth in 47 CFR 2.1091 or 2.1093
The BTM44x comply with the RSS-102RF radiation exposure limits set forth for an uncontrolled environment. If
this device and its antenna is co-located or operating in conjunction with any other antenna or transmitter RF
exposure evaluation should be re-evaluated on the complete product by a qualified test house.
The installer of this module into host equipment must ensure his equipment complies with the Industry Canada
RSS-102 RF Exposure requirements.
BTM440 / BTM442
These modules hold a limited modular approval. Approval with any other antenna configuration or layout other
than that approved will necessitate additional radiated emission testing to be performed.
The modules were approved with the following antenna:
RF Solutions: ANT-24G-WHJ-SMA 0dBi
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4.1.3 FCC Labeling requirement
4.1.3.1 BTM440 / BTM442
If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into
which the module is installed must also display a label referring to the enclosed module. This exterior label can
use wording such as the following: “Contains Transmitter Module FCC ID: PI4410B” or “Contains FCC ID:
PI4410B”. Any similar wording that expresses the same meaning may be used.
4.1.3.2 BTM441 / BTM443
If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into
which the module is installed must also display a label referring to the enclosed module. This exterior label can
use wording such as the following: “Contains Transmitter Module FCC ID: PI4411B” or “Contains FCC ID:
PI4411B.” Any similar wording that expresses the same meaning may be used.
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5 DECLARATIONS OF COMPLIANCE
EU Declaration of Conformity – BTM440 / BTM442
Manufacturer:
Product:
Laird Technologies
BTM440/2
EU Directive:
Conformity Assessment:
RTTE 1995/5/EC
Annex IV
5.1.1 Reference standards used for presumption of conformity:
Article Number:
3.1a
Requirement
Health and Safety
Reference standard(s):
EN 60950-1:2006
3.1b
Protection requirements
with respect to
electromagnetic
Compatibility
3.2
Means of the efficient use of
the radio frequency
spectrum
EN 301 489-1 V1.8.1
EN 301 489-17 2.1.1
Emissions:
EN55022:2006/A1:2000/A2:2006(ClassB)
Immunity:
EN61000-4-2:1995/A1:1998/A2:2001
EN61000-4-3:2002/A1:2002
EN 300 328 V1.7.1 (2006-10)
5.1.2 Declaration:
We, Ezurio Ltd, declare under our sole responsibility that the essential radio test suites have been carried out
and that the above product to which this declaration relates is in conformity with all the applicable essential
requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose.
Place of Issue:
Date of Issue:
Name of Authorised Person:
Ezurio Ltd dba Laird Technologies
Saturn House, Mercury Park
Wooburn Green
HP100HH,
United Kingdom
tel: +44 (0)1628 858 940
fax: +44 (0)1628 528 382
October 2009
Andrew Dobbing, Engineering Manager
Signature:
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EU Declaration of Conformity – BTM441 / BTM443
Manufacturer:
Product:
Laird
BTM410 / BTM411 / BTM420 / BTM421 /
BTM430 / BTM431 / BTM441 / BTM443 /
BTM461
RTTE 1995/5/EC
Annex IV
EU Directive:
Conformity Assessment:
5.2.1 Reference Standards used for Presumption of Conformity
Article Number
3.1a
Requirement
Health and Safety
3.1a
3.1b
RF Exposure
Protection requirements
with respect to
electromagnetic
compatibility
3.2
Means of the efficient use
of the radio frequency
spectrum
Reference standard(s)
EN 60950-1:2005 (2nd Ed); +Am1:2009 +Am2:2013
EN 609501:2006+A11+a1:2010+A12:2011+A2:2013
EN 62479:2010
EN 301 489-1 V1.9.2 (2011-09)
EN 301 489-17 V2.2.1 (2012-09)
Emissions:
EN55022:2010 /AC:2011 (ClassB)
Immunity:
EN61000-4-2:2009
EN61000-4-3:2006 /A1:2008 /A2:2010
EN 300 328 V1.8.1 (2012-06)
5.2.2 Declaration:
We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and
that the above product to which this declaration relates is in conformity with all the applicable essential
requirements of Article 3 of the EU Directive 1995/5/EC, when used for its intended purpose.
Place of Issue:
Date of Issue:
Name of Authorized Person:
Signature:
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
Laird
11160 Thompson Ave.
Lenexa, KS 66219
October 2009
Daniel Waters / Certifications Specialist
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6 BLUETOOTH APPROVALS
Subsystem Combinations
This application note covers the procedure for generating a new Declaration ID for a Subsystem combination on
the Bluetooth SIG website. In the instance of subsystems, a member can combine two or more subsystems to
create a complete Bluetooth End Product solution.
Subsystem listings referenced as an example:
Design
Name
BTM44x
Owner
Laird
Declaration
Link to listing on the SIG website
ID
B016072
https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=16072
Interface
Cambridge B017578
Express
Consultants
subsystem Ltd
https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=17578
Assumptions
This procedure assumes that the member is simply combining two subsystems to create a new design, without
any modification to the existing, qualified subsystems. This is achieved by using the Listing interface on the
Bluetooth SIG website. Figure 1 shows the basic subsystem combination of a controller and host subsystem. The
Controller provides the RF/BB/LM and HCI layers, with the Host providing L2CAP, SDP, GAP, RFCOMM/SPP and
any other specific protocols and profiles existing in the Host subsystem listing. The design may also include a
Profile Subsystem.
Figure 1: Basic subsystem combination of a controller and host subsystem
The Qualification Process requires each company to registered as a member of the Bluetooth SIG –
www.bluetooth.org
The following link provides a link to the Bluetooth Registration page:
https://www.bluetooth.org/login/register/
For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new
qualification, either through invoicing or credit card payment. The fees for the Declaration ID depend on your
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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BTM44x
Datasheet
membership status, please refer to the following webpage:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees
For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG
document:
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486
To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm
In step 1, select Reference a Qualified Design and enter the Declaration IDs of each subsystem used in the End
Product design. You can then select your pre-paid Declaration ID from the drop down menu or go to the
Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a credit
card, it will not be possible to proceed until the SIG invoice is paid.
Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help
document. Your new Design will be listed on the SIG website and you can print your Certificate and DoC.
For further information please refer to the following training material:
https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates
Additional Assistance
Please contact your local sales representative or our support team for further assistance:
Laird Technologies Connectivity Products Business Unit
Support Centre: http://ews-support.lairdtech.com
Email: [email protected]
Phone: Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
Web:
http://www.lairdtech.com/bluetooth
7 ORDERING INFORMATION
Part Number
BTM440
BTM441
BTM442
BTM443
DVK – BTM440
Description
Bluetooth MP Data Module (external antenna)
Bluetooth MP Data Module (with integrated antenna)
Bluetooth AT Data Module (external antenna)
Bluetooth AT Data Module (with integrated antenna)
Development board with BTM440 module soldered in place
DVK – BTM442
Development board with BTM442 module soldered in place
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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Europe: +44-1628-858-940
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BTM44x
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8
APPLICATION NOTE FOR SURFACE MOUNT MODULES
Introduction
Laird Technologies surface mount modules are designed to conform to all major manufacturing guidelines. This
application note is intended to provide additional guidance beyond the information that is presented in the User
Manual. This Application Note is considered a living document and will be updated as new information is
presented.
The modules are designed to meet the needs of several commercial and industrial applications. The modules are
designed to be easily manufactured and conform to current automated manufacturing processes.
Shipping
Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick
and place machines. Layouts of the trays are provided in Figures 8 and 9.
Figure 8: BTM44x Shipping Tray Details
Reflow Parameters
Laird Technologies surface mount modules are designed to be easily manufactured including reflow soldering to
a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure
oven temperatures during reflow meet the requirements of the solder paste. Laird Technologies’ surface mount
modules conform to J-STD-020D1 standards for reflow temperatures.
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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BTM44x
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IMPORTANT: During reflow, modules should not be above 260°C and not for more than 30
seconds.
Figure 10: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in Table 21.
Table 8: Recommended Maximum and minimum temperatures
Recommended Max & Min's
Specification
Temperature Inc./Dec. Rate (max)
Temperature Decrease rate (goal)
Value
3
2-3
Unit
°C / Sec
°C / Sec
Soak Temp Increase rate (goal)
Flux Soak Period (Min)
.5 - 1
60
°C / Sec
Sec
Flux Soak Period (Max)
Flux Soak Temp (Min)
90
150
Sec
°C
Flux Soak Temp (max)
Time Above Liquidous (max)
Time Above Liquidous (min)
Time In Target Reflow Range (goal)
Time At Absolute Peak (max)
Liquidous Temperature (SAC305)
Lower Target Reflow Temperature
Upper Target Reflow Temperature
Absolute Peak Temperature
190
60
20
30
30
217
225
250
260
°C
Sec
Sec
Sec
Sec
°C
°C
°C
°C
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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9 REFERENCES
[1] “Bluetooth Specification Version 2.1 + EDR [vol3]”, 26 July 2007
http://www.bluetooth.com/Bluetooth/Technology/Building/Specifications/
(click on “Core Specification v2.1 + EDR”)
[2] “Serial Port Profile“ Specification
http://www.bluetooth.com/Bluetooth/Technology/Works/SPP.htm
(link at the bottom of page “Need more? View the Serial Port Profile (SPP)”)
[3] “Bluetooth Assigned Numbers”
http://www.bluetooth.com/Bluetooth/Technology/Building/Specifications/
select “Items per page: ALL”, go to end of page, there click on “Assigned Numbers – Baseband”, for a complete
list of Profile UUIDs: click on “Assigned Numbers – Service Discovery”
[4] Class of Device Generator: this link might be helpful for creating a particular CoD
http://bluetooth-pentest.narod.ru/software/bluetooth_class_of_device-service_generator.html
Caution: this tool allows selection of more than one minor device classes, so make sure that only one minor
device class is select and verify the result with [3] anyway.
[5] “Bluecore 4 External” Data Sheet, Cambridge Silicon Radio (CSR)
http://www.csrsupport.com (log in or new account required)
[6] “Winbond 681360 Codec Board User Guide”, Ezurio Application Note
[7] “BTM44x AppNote: Getting Started”
[8] “BTM44x AppNote: Firmware Upgrade”
[9] “BTM44x AppNote: Throughput Analysis”
[10] “BTM44x AppNote: Health Device Profile”
[11] “BTM44x AppNote: Latency Optimization”
[12] “BTM44x AppNote: RF Testing”
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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10 GLOSSARY OF TERMS
Term
A2DP
ACL
ADC
AGHFP
AT
AVRCP
BISM
CoD
Codec
DAC
DSP
DUN
EIR
eSCO
FTP
GOEP
GPIO
HF
HFG
HFP
HID
HS
HSG
HSP
I/O
(IO)
Mic
MITM
OPP
PBAP
PT
PWM
SBC
SCO
SLC
SPP
SSO
SSP
SUI
Sxxx
TDL
UART
UI
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
Description
Advanced Audio Distribution Profile
Asynchronous Connection-Oriented Link
Analogue to Digital Converter
Audio Gateway Hands-Free Profile
Command prefix, ‘Attention’
Audio/Video Remote Control Profile
Bluetooth Intelligent Serial Module
Class Of Device (also referred to as “device class”)
Device capable of encoding / decoding an analogue / digital signal
Digital to Analogue Converter
Digital Signal Processor
Dial-Up Network Profile
Extended Inquiry Response
Enhanced Synchronous Connection Oriented Link (used for Audio)
File Transfer Profile
Generic Object Access Exchange Profile
General Purpose Input Output
Hands-free Role of Hands-free Profile (“Hands-free Unit”)
Audio Gateway Role of Hands-free Profile (“Hands-free Gateway”)
Hands Free Profile
Human Interface Device Profile
Headset Role of Headset Profile (“Headset”)
Audio Gateway Role of Headset Profile (“Headset Gateway”)
Headset Profile
Input/Output
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
Microphone
Man In The Middle
Object Push Profile
Phone Book Access Profile
PASS THROUGH Command
Pulse Width Modulation
Sub Band Codec
Synchronous Connection Oriented Link (used for Audio)
Service Level Connection
Serial Port Profile
Serial Stream Oriented
Secure Simple Pairing
SUBUNIT INFO Command
S-Register No. xxx
Trusted Device List
Universal Asynchronous Receiver / Transmitter
UNIT INFO Command
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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11 RELATED DOCUMENTS AND FILES
The following additional BTM44x technical documents are also available from the Laird BTM44x product page
under the Documentation tab:




Product Brief
User Manual
Firmware Release Notes
Development Kit Schematics
Application Notes






Getting Started
Firmware Upgrade
Throughput Analysis
Health Device Profile
Latency Optimization
RF Testing
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/wireless
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Europe: +44-1628-858-940
Hong Kong: +852 2923 0610
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