CD54HCT373, CD74HCT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS453B – FEBRUARY 2001 – REVISED MAY 2003 D D D D D D CD54HCT373 . . . F PACKAGE CD74HCT373 . . . E OR M PACKAGE (TOP VIEW) 4.5-V to 5.5-V VCC Operation Wide Operating Temperature Range of –55°C to 125°C Balanced Propagation Delays and Transition Times Standard Outputs Drive Up To 10 LS-TTL Loads Significant Power Reduction Compared to LS-TTL Logic ICs Inputs Are TTL-Voltage Compatible OE 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND description/ordering information 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q LE The ’HCT373 devices are octal transparent D-type latches. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is low, the Q outputs are latched at the logic levels of the D inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PDIP – E –55°C 55°C to 125°C ORDERABLE PART NUMBER PACKAGE† TA SOIC – M CDIP – F Tube CD74HCT373E Tube CD74HCT373M Tape and reel CD74HCT373M96 Tube CD54HCT373F3A TOP-SIDE MARKING CD74HCT373E HCT373M CD54HCT373F3A † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CD54HCT373, CD74HCT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS453B – FEBRUARY 2001 – REVISED MAY 2003 FUNCTION TABLE (each latch) INPUTS OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z logic diagram (positive logic) OE LE 1 11 C1 1D 3 2 1D 1Q To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output drain current per output, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA Continuous output source or sink current per output, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CD54HCT373, CD74HCT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS453B – FEBRUARY 2001 – REVISED MAY 2003 recommended operating conditions (see Note 3) VCC VIH Supply voltage VIL VI Low-level input voltage VO ∆t/∆v Output voltage TA = 25°C TA = –55°C TO 125°C TA = –40°C TO 85°C MIN MAX MIN MAX MIN MAX 4.5 5.5 4.5 5.5 4.5 5.5 High-level input voltage 2 2 Input voltage Input transition rise or fall rate 2 UNIT V V 0.8 0.8 0.8 V VCC VCC VCC VCC VCC VCC V 500 500 500 ns V NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH VI = VIH or VIL IOH = –20 µA IOH = –6 mA 45V 4.5 VOL VI = VIH or VIL IOL = 20 µA IOL = 6 mA 45V 4.5 II IOZ VI = VCC or 0 VO = VCC or 0 ICC VI = VCC or 0, ∆ICC‡ IO = 0 TA = 25°C TA = –55°C TO 125°C TA = –40°C TO 85°C MIN MIN MIN MAX 4.4 4.4 4.4 3.98 3.7 3.84 UNIT MAX V 0.1 0.1 0.1 0.26 0.4 0.33 V 5.5 V ±0.1 ±1 ±1 µA 5.5 V ±0.5 ±10 ±5 µA 5.5 V 8 160 80 µA 360 490 450 µA 10 10 10 pF 4.5 V to 5.5 V One input at VCC – 2.1 V, Other inputs at 0 or VCC MAX Ci Co 10 10 10 pF ‡ Additional quiescent supply current per input pin, TTL inputs high, 1 unit load. For dual-supply systems, theoretical worst-case (VI = 2.4 V, VCC = 5.5 V) specification is 1.8 mA. HCT INPUT LOADING TABLE INPUT UNIT LOAD OE 1.5 Any D 0.4 LE 1 Unit load is ∆ICC limit specified in electrical characteristics table (e.g., 360 µA max at 25°C). POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CD54HCT373, CD74HCT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS453B – FEBRUARY 2001 – REVISED MAY 2003 timing requirements over recommended operating free-air temperature range, VCC = 4.5 V (unless otherwise noted) (see Figure 1) TA = 25°C TA = –55°C TO 125°C TA = –40°C TO 85°C MIN MIN MIN MAX MAX UNIT MAX tw Pulse duration, LE high 16 24 20 ns tsu Setup time, data before LE↓ 13 20 16 ns th Hold time, data after LE↓ 10 15 13 ns switching characteristics over recommended operating free-air temperature range, VCC = 4.5 V (unless otherwise noted) (see Figure 1) PARAMETER tpd d FROM (INPUT) D LE TO (OUTPUT) LOAD CAPACITANCE Q CL = 50 pF TA = 25°C TA = –55°C TO 125°C TA = –40°C TO 85°C MIN MIN MIN MAX MAX UNIT MAX 32 48 40 35 53 44 ns ten OE Q CL = 50 pF 35 53 44 ns tdis OE Q CL = 50 pF 35 53 44 ns Q CL = 50 pF 12 18 15 ns tt operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd 4 TYP Power dissipation capacitance 53 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT pF CD54HCT373, CD74HCT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCLS453B – FEBRUARY 2001 – REVISED MAY 2003 PARAMETER MEASUREMENT INFORMATION VCC Test Point From Output Under Test PARAMETER S1 ten 1 kΩ tdis CL (see Note A) S2 S1 S2 tPZH Open Closed tPZL Closed Open tPHZ Open Closed tPLZ Closed Open Open Open tpd or tt tw LOAD CIRCUIT 3V 1.3 V Input 1.3 V 0V VOLTAGE WAVEFORMS PULSE DURATION CLR Input 3V Reference Input 3V 1.3 V 1.3 V 0V 0V tsu trec Data 1.3 V Input 0.3 V 3V 1.3 V CLK th 2.7 V 3V 2.7 V 1.3 V 0.3 V 0 V tf tr 0V VOLTAGE WAVEFORMS RECOVERY TIME VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES 3V Input 1.3 V 1.3 V 0V tPLH In-Phase Output 1.3 V 10% 90% tPHL 90% 1.3 V 1.3 V 0V tPHL 90% tr Out-of-Phase Output 3V Output Control VOH 1.3 V 10% tf VOL 1.3 V 10% tf 1.3 V 10% tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES 1.3 V Output Waveform 2 (see Note B) 10% VOL tPHZ tPZH VOH VOL ≈VCC Output Waveform 1 (see Note B) tPLH 90% tPLZ tPZL 1.3 V 90% VOH ≈0 V VOLTAGE WAVEFORMS OUTPUT ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. For clock inputs, fmax is measured with the input duty cycle at 50%. E. The outputs are measured one at a time with one input transition per measurement. F. tPLZ and tPHZ are the same as tdis. G. tPZL and tPZH are the same as ten. H. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74HCT373M96 Package Package Pins Type Drawing SOIC DW 20 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.8 13.0 2.7 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HCT373M96 SOIC DW 20 2000 346.0 346.0 41.0 Pack Materials-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) CD54HCT373F ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 CD54HCT373F CD54HCT373F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8686701RA CD54HCT373F3A CD74HCT373E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT373E CD74HCT373EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT373E CD74HCT373M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT373M CD74HCT373M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT373M CD74HCT373M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT373M CD74HCT373MG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT373M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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OTHER QUALIFIED VERSIONS OF CD54HCT373, CD74HCT373 : • Catalog: CD74HCT373 • Military: CD54HCT373 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74HCT373M96 Package Package Pins Type Drawing SOIC DW 20 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 10.8 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 13.0 2.7 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HCT373M96 SOIC DW 20 2000 367.0 367.0 45.0 Pack Materials-Page 2 PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 TYP 9.97 SEATING PLANE PIN 1 ID AREA A 0.1 C 20 1 13.0 12.6 NOTE 3 18X 1.27 2X 11.43 10 11 B 7.6 7.4 NOTE 4 20X 0.51 0.31 0.25 C A B 2.65 MAX 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0 -8 0.3 0.1 1.27 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 11 10 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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