IQS316 Datasheet IQ Switch® - ProxSense® Series Multi-channel Capacitive Sensing Controller with Advanced Signal Processing Functions The IQS316 is a 20 channel surface capacitive touch and proximity controller with advanced onchip signal processing features, including Antenna Tuning Implementation (ATI). Proximity detection can be distributed over all keys, or only selected keys, providing high flexibility for stable operation in varying designs. The controller is based on patented capacitive sensing technology that yields stability with high sensitivity and excellent noise immunity. This controller can operate with a small number of external components to provide a low cost solution for medium to high channel count applications. Main Features 16 Touch Keys with distributed Proximity Sensing Internal Capacitor Implementation (ICI). No external reference capacitors required Class leading proximity sensitivity with dedicated Prox Mode charging scheme User selectable gain through Antenna Tuning Implementation (ATI) All channels individually configurable for maximum design flexibility Advanced on-chip signal processing User selectable I2C and SPI communication High sensitivity Internal voltage regulator Supply voltage 2.85V-5.5V Low power modes (45uA) Active shield options RF detection Available in QFN(5x5)-32 package Representation only, not actual marking 8 General Purpose I/O‟s Applications Office machines Consumer Electronics Digital cameras White goods and appliances Keypads Kiosk and POS Terminals High-end kitchen appliances Launch a menu on user approaching Personal Media Players Available options TA -40°C to 85°C Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. QFN32 IQS316 IQS316 Datasheet Revision 1.03 Page 1 of 28 November 2015 IQ Switch® ProxSense® Series 5.2.2 5.2.3 5.2.4 5.2.5 Contents IQS316 Datasheet ........................................................... 1 1 Overview ................................................................ 3 2 Packaging and Pin-out ............................................ 4 3 2.1 QFN32............................................................... 4 2.2 ICTRL ................................................................. 5 ® ProxSense Module ................................................ 5 3.1 Charge Transfer Concepts ................................ 5 3.2 Charging Modes ............................................... 6 3.2.1 Prox Mode Charging .................................... 6 3.2.2 Touch Mode Charging .................................. 6 3.2.3 Interaction Between Prox and Touch Mode 7 3.2.4 Low Power Charging .................................... 7 6 Cx Sensors Requiring Shield ....................... 12 Cx Sensors Used For Prox ........................... 12 Cx Sensors plus I/O’s .................................. 13 Unused Cx’s................................................ 13 Communication ....................................................13 6.1 Communication Selection ............................... 13 6.2 Watchdog Timeout and MCLR ....................... 13 6.3 SPI ................................................................... 13 6.3.1 SPI read ...................................................... 14 6.3.2 SPI write ..................................................... 14 6.3.3 SPI Communications Window Terminate Command ................................................................ 15 2 6.4 I C ................................................................... 15 6.4.1 Control byte and Device Address ............... 15 2 6.4.2 I C read....................................................... 15 2 6.4.3 I C write ..................................................... 15 2 6.4.4 I C Communications Window Terminate Command ................................................................ 16 3.3 Prox Module Setup ........................................... 8 6.5 Circuit diagrams (all features) ........................ 16 3.3.1 Report rate ................................................... 8 3.3.2 Transfer Frequency ...................................... 8 7 Electrical specifications .........................................18 3.3.3 Count Value.................................................. 8 7.1 Absolute maximum specifications .................. 18 3.3.4 Prox Mode Channel Filters ........................... 8 3.3.5 Environmental Drift ..................................... 8 7.2 Operating conditions (Measured at 25°C) ...... 18 3.3.6 LTA Filter ...................................................... 8 7.3 Moisture Sensitivity Level ............................... 18 3.3.7 Filter Halt ..................................................... 8 3.3.8 Touch Sensitivity (Touch Mode channels 7.4 Recommended storage environment for IC’s . 19 only) 9 7.5 Timing characteristics (Measured at 25°C) .... 20 3.3.9 Proximity Sensitivity (Prox and Touch Mode channels) ................................................................... 9 Mechanical Dimensions ........................................21 3.3.10 Antenna Tuning Implementation ............ 9 8 8.1 IQS316 Mechanical Dimensions ..................... 21 4 Additional Features .............................................. 10 8.1.2 QFR package differences to QNR package . 22 4.1 RF Immunity ................................................... 10 8.2 IQS316 Landing Pad Layout............................ 23 4.1.1 Design Guidelines....................................... 10 4.1.2 RF detection ............................................... 10 9 Datasheet and Part-number Information .............24 5 4.2 Active Shield ................................................... 10 9.1 Ordering Information ..................................... 24 4.3 Proximity Output (POUT) ................................ 11 9.2 Package Marking............................................ 24 4.4 Zero Cross Synchronising ................................ 11 9.3 Tape and Reel ................................................. 25 4.5 Device Sleep.................................................... 11 9.5 Revision History .............................................. 27 4.6 Communication Bypass .................................. 11 4.7 General Purpose I/O’s .................................... 12 Appendix A. Contact Information.............................28 Application Design ............................................... 12 5.1 Physical Layout ............................................... 12 5.2 Cx Selection .................................................... 12 5.2.1 Cx Sensor Close to Noise Source ................ 12 Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 2 of 28 November 2015 IQ Switch® ProxSense® Series 1 Overview each sensor (key) can be viewed as the positive plate of a capacitor and the environment as the negative plate (virtual ground reference). When a conductive object such as a human finger approaches the sensor, it will increase the detected capacitance. The IQS316 is a multi-key capacitive sensing controller designed for touch applications requiring up to 16 touch inputs. The device has proximity (PROX) detection integrated with the existing 16 touch sense electrode, providing a total of 4 additional PROX channel Advanced signal processing is implemented to outputs. suppress and detect noise, track slow varying The electrodes used for PROX are selectable, environmental conditions, and avoid effects of to allow keys in noisy/unreliable areas to not possible drift. The Antenna Tuning influence the PROX stability and sensitivity. Implementation (ATI) allows for adapting to a All 20 device channels (16 touch, 4 proximity) wide range of application environments, can be individually configured. It can be without requiring external components. selected that 4, or 8 of the channels are setup to be used as general purpose I/O‟s. Functions such as simple LED control can be implemented with these I/O‟s. The device provides active driven shields to protect the integrity of sensor line signals if required. The device has a high immunity to RF interference. For severe conditions, the RF detection pin allows for noise detection when connected to a suitable RF antenna, providing suppression of noise on the influenced data. The device has an internal voltage regulator and Internal Capacitor Implementation (ICI) to reduce external components required. Advanced on-chip signal processing capabilities and a dedicated PROX charging The IQS316 provides SPI and I2C mode yields a stable capacitive controller with communication options. A typical implementation of a 16 key touch panel is high sensitivity. shown in Figure 1.1. With the charge transfer method implemented, Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 3 of 28 November 2015 IQ Switch® ProxSense® Series 25 CxB4 / GPIO_0 26 CxB5/ GPIO_1 27 CxB6 / GPIO_4 24 CxA3 SOMI-SDA 2 23 CxA2 RDY 3 22 CxA1 PWWYY SCK-SCL 4 /SS-IRDY 5 POUT 21 CxA0 20 CxB3 19 CxB2 IQS316 Datasheet Revision 1.03 VREG 16 SHLD_A 15 SHLD_B 14 ZC 13 17 CxB0 ICTRL 12 /MCLR 8 RFIN 10 18 CxB1 VddHI 9 SPI_ENABLE 7 Figure 2.1 Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. 28 CxB7 / GPIO_5 MOSI-I2CAO 1 IQS316 1iz The pin-out for the IQS316 in the QFN32 package is illustrated below in Figure 2.1. VSS 11 2.1 QFN32 29 CxA4 / GPIO_2 The IQS316 is available in a QFN32 package. 30 CxA5 / GPIO_3 2 Packaging and Pin-out 31 CxA6 / GPIO_6 Typical implementation 32 CxA7 / GPIO_7 Figure 1.1 QFN32 Top View Page 4 of 28 November 2015 IQ Switch® ProxSense® Series Table 2.1 QFN32 top view Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Name MOSI-I2CA0 SOMI-SDA RDY SCK-SCL /SS-IRDY POUT SPI_ENABLE /MCLR VDDHI RFIN VSS ICTRL ZC SHLD_B SHLD_A VREG 17 18 19 20 21 22 23 24 25 CxB0 CxB1 CxB2 CxB3 CxA0 CxA1 CxA2 CxA3 CxB4 GPIO_0 CxB5/ GPIO_1 CxB6 GPIO_4 CxB7 GPIO_5 CxA4 GPIO_2 CxA5 GPIO_3 CxA6 GPIO_6 CxA7 GPIO_7 26 27 28 29 30 31 32 Description Refer to Table 2.2 Refer to Table 2.2 Refer to Table 2.2 Refer to Table 2.2 Refer to Table 2.2 Proximity output Comms Selection Master Clear Supply Voltage RF Noise Input Ground Reference Current Reference ZC Input Shield Shield Internal Regulator Voltage Cx Sensor Line Cx Sensor Line Cx Sensor Line Cx Sensor Line Cx Sensor Line Cx Sensor Line Cx Sensor Line Cx Sensor Line / Cx Sensor Line / I/O In Table 2.2 a description communication pins are given. Table 2.2 of all Communication pins SPI Name Description MOSI Master Out Slave In Out SOMI Slave Master In /SS Slave Select SCK Serial Clock RDY SPI Ready Name I2CA0 SDA I2C Description Sub-Address 0 Data IRDY I2C Ready SCL Clock Not used Pins are used as defined in the standard communications protocols, except for the additional RDY pin in SPI mode and the IRDY pin in I2C mode. The ready is an indication to the master that data transfer is ready to be initiated (that the communication window is available). 2.2 ICTRL A reference resistor of 39k MUST be placed from the ICTRL I/O to ground, as shown in Figure 1.1. It is very important that the track to the resistor must be as short as possible, with the other side having a good connection to ground. ® 3 ProxSense Module / Cx Sensor Line / I/O The device contains a ProxSense® module that uses patented technology to provide detection of PROX/TOUCH on the numerous sensing lines. The ProxSense™ module is a combination of hardware and software, based on the principles of charge transfer. A set of measurements are taken and used for calculating the touch controller outputs. / Cx Sensor Line / I/O 3.1 Charge Transfer Concepts Cx Sensor Line / I/O / Cx Sensor Line / I/O / Cx Sensor Line / I/O / Cx Sensor Line / I/O / Cx Sensor Line / I/O Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. Capacitance measurements are taken with a charge transfer process that is periodically initiated. The measuring process is referred to as a charge transfer cycle and consists of the following: IQS316 Datasheet Revision 1.03 Page 5 of 28 November 2015 IQ Switch® ProxSense® Series Discharging of an internal sampling capacitor (Cs) and the sense electrode (Cx) on a channel. Charging of Cx‟s connected to the channel and then a series of charge transfers from the Cx‟s to the associated internal sampling capacitor (Cs), until the trip voltage is reached. The number of charge transfers required to reach the trip voltage on a channel is referred to as the count value. The device continuously repeats charge transfers on the sense electrode connected to the Cx Pin. For each channel a Long Term Average (LTA) is calculated (12 bit unsigned integer values). The count value (12 bit unsigned integer values) are processed and compared to the LTA to detect TOUCH and PROX. For more information regarding capacitive sensing, refer to the application note “AZD004 Azoteq Capacitive Sensing”. 3.2 Charging Modes The IQS316 has 16 sensor lines (Cx). The device has four internal sampling capacitors, with the touch channels charging in 4 timeslots, equating to the 16 channels. Each active sensor line is connected to a channel to determine touch button actuations. For PROX channels, a selection of the 16 touch sensor lines are combined to provide up to 4 dedicated PROX channels. For example, CxB0, CxB1, CxB2 and CxB3 are connected together, and charge as one PROX channel, namely CH1. In the IQS316, charge transfers are implemented in two charging „Modes‟, namely Prox Mode, and Touch Mode. 3.2.1 Prox Mode Charging processing performed to improve stability and sensitivity, for optimum PROX operation. The sensor lines connected to these channels are also selectable. By default, only CH0 and CH1 are active in Prox Mode Charging, with CxA0 – CxA3 connected to CH0 and CxB0 – CxB3 connected to CH1. This means that CxA0, CxA1, CxA2 and CxA3 form a combined sense plate for CH0. It is possible to connect between 2 and 16 of the Cx sensor lines to the PROX channels. Group 0 Group 0 Group 0 CH0 CH0 (CxA0-CxA3) CH0 CH1 CH1 (CxB0-CxB3) CH1 CH2 CH2 (CxA4-CxA7) CH2 CH3 CH3 (CxB4-CxB7) CH3 Figure 3.1 Prox Mode Charging 3.2.2 Touch Mode Charging In Touch Mode, all active touch channels are sampled. If all 16 channels are enabled (default), charge transfers occur in 4 groups, namely Group1, 2, 3 and 4. In Touch Mode, this cycle is continually repeated. Figure 3.2 shows how the channels are connected to the respective sensor lines. The channel number is written, and below in brackets the respective sensor line is shown. For example: CH12 is the touch button output of sensor line CxA2. The touch channels are optimised for touch response time, and less signal processing is performed compared to the Prox Mode channels. In Prox Mode, CH0 to CH3 are repeatedly charged. Collectively, they are referred to as the Group 0 charge transfers. These channels are optimised for PROX sensing by having specific digital signal Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 6 of 28 November 2015 IQ Switch® ProxSense® Series Group 1 Group 2 Group 3 CH4 (CxA0) CH8 (CxA1) CH12 (CxA2) CH16 (CxA3) CH5 (CxB0) CH9 (CxB1) CH13 (CxB2) CH17 (CxB3) CH6 (CxA4) CH10 (CxA5) CH14 (CxA6) CH18 (CxA7) CH7 (CxB4) CH11 (CxB5) Figure 3.2 CH15 (CxB6) Group 4 CH19 (CxB7) Touch Mode Charging 3.2.3 Interaction Between Prox and Touch Mode In Prox Mode, charging takes place until any proximity has been detected on CH0 to CH3, then the charging changes to Touch Mode. In Prox Mode, every Tmode the IC will force Touch Mode charging for one cycle, so that the Touch Channels (CH4-CH19) can update their averaging filters. In Touch Mode, if no touch is pressed or released for Tmode, the system will return to Prox Mode charging. While touches are made or released, the system will remain in Touch Mode Interaction between Prox and Touch Mode Charging occurs automatically as follows: 0 0 0 0 0 0 0 0 1 2 3 4 0 0 0 0 0 0 0 0 0 0 0 0 1 2 3 4 1 2 3 4 Prox Mode Touch Mode Update Prox Mode Figure 3.3 A 1 2 3 4 1 2 3 4 0 0 0 0 0 0 0 0 Touch Mode Prox Mode Charging Mode Interaction The interaction between charging modes is In an ideal situation, the concept is easily understood by means of the following implemented to operate as follows: example, refer to Figure 3.3. In steady-state (no user interaction), the For the first stage, the charging is in Prox Mode, device operates in the Prox Mode charging. with Group 0 charging repeatedly. A timeout The IQS316 will then sense a user (TMODE) occurs, and a brief Touch Mode update approaching by means of the optimised PROX is performed, after which Prox Mode charging is sensing, and will flip the charging to Touch resumed. Mode. Now touch button interaction is At point marked „A‟, a proximity event occurs, constantly monitored. Once touch interaction which forces the system into Touch Mode, and has subsided, Prox Mode is resumed. This charging of Group 1 to 4 is now repeated. provides stable and sensitive proximity Touch Mode is continued until a Tmode period of detection, as well as rapid touch response. no touch interaction is monitored, upon which the device returns to the Prox Mode charging, as 3.2.4 Low Power Charging shown in the last stage of the figure. Low current consumption charging modes are The master can override the automatic available. These only apply to the Prox Mode interaction between Prox- and Touch Mode, charging, since when in Touch Mode, by forcing the IQS316 into either mode by interaction with the device is assumed, and then slow response is not acceptable. In low means of specific commands. Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 7 of 28 November 2015 IQ Switch® ProxSense® Series power, charging takes place less often, and naturally this decreases the response time for a proximity event, this does however allow the device to sleep for long periods between conversions, decrease the power consumption considerably. 3.3 Prox Module Setup 3.3.1 Report rate The report rate of the device depends on the charge transfer frequency and the LTA of the channels. The length of communications performed by the master device will also have an effect on the report rate of the IQS316. A typical value is shown in the characteristic data in Table 7.5. 3.3.2 Transfer Frequency The frequency of the transfers can be selected by the main oscillator (Main_OSC) and main oscillator divider (CxDIV) settings. Conversion frequencies are given in Table 3.1 with the Main_Osc fixed at 8MHz. An optimal transfer frequency must be selected for a specific application by choosing the optimal CxDIV setting. Table 3.1 Charge transfer frequency CxDIV Conversion Frequency 000 4MHz 001 2MHz 010 1MHz (default) 011 0.5MHz 100 0.25MHz 101-111 0.125MHz 3.3.3 Count Value sensitivity. The Touch Mode channels (CH4 – CH19) are usually considerably lower (200 – 500), because the same sensitivity as required for PROX is not usually required for touch. 3.3.4 Prox Mode Channel Filters The Prox Mode channel filter provides a major improvement on the proximity performance of the device. The filter is implemented on CH0 – CH3, and is default ON at start-up. It is recommended to keep this filter enabled. To improve the filters effectiveness with rejecting AC mains noise, the charge transfers are synchronised to a base frequency (roughly 9ms, to accommodate both 50Hz and 60Hz). Numerous factors (charge transfer frequency, high counts, long communication time, more than two active Prox Mode channels etc) could cause this timing to be extended, which would simply reduce the effectiveness of the filter. Refer to Table 7.5. 3.3.5 Environmental Drift The Long Term Average (LTA) can be seen as the baseline or reference value. The LTA is calculated to continuously adapt to any environmental drift. 3.3.6 LTA Filter The LTA filter is calculated from the count value of each channel. The LTA filter allows the device to adapt to environmental (slow moving) drift. Touch and PROX information is calculated by comparing the count value with this LTA reference value. For an illustration of the working of the LTA filter (and filter halt), refer to application note “AZD024 Graphical Representation of the IIR Filter”. 3.3.7 Filter Halt To ensure that the LTA filters do not adapt during a PROX or TOUCH, a filter halt scheme is implemented on the device. The designer can choose between four options as given in Table 3.2. As a rough guideline, the Prox Mode channels (CH0 – CH3) are usually set to higher count values (800 – 1500), to optimise PROX Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 8 of 28 November 2015 IQ Switch® ProxSense® Series Table 3.2 THALT Short Long (default) Filter halt options Filter During PROX filter halts for reseeds During PROX Filter halts for reseeds or TOUCH, ~20s, then or TOUCH, ~40s, then Never Filter NEVER halts Always Filter is HALTED, always With the Short and Long option, the filter operates as follows: The LTA filter will freeze on a touch or proximity for THALT seconds. After THALT, if prox/touch condition still exists, the system will assume a stuck condition, and the LTA will reseed to the count value. In applications where long user interaction is expected, the „Long Halt‟ option is recommended. The THALT timer is reset every time a touch is made or released. count value to drop. A touch threshold of 1/32 will be the most sensitive setting and 10/16 will result in the least sensitive. Table 3.3 Touch Thresholds Setting 00 LOW Range 1/32 (default) HIGH Range 4/16 01 1/16 6/16 10 2/16 8/16 11 3/16 10/16 Four values exist for each channel. Two ranges of settings can be selected, but the range is a global setting and applies to all channels; whereby each channel can then individually be setup to a value within the selected range. 3.3.9 Proximity Sensitivity (Prox and Touch Mode channels) The proximity sensitivity of each individual channel is a user defined threshold calculated as a delta value below the LTA. A PROX For the „Never Halt‟ setting, the filter will status is detected when the count value drops immediately begin to adapt, without ever below the selected delta relative to the LTA. freezing the filter. This setting is not Table 3.4 Prox Thresholds recommended. Setting LOW Range HIGH Range The „Always Halt‟ setting can be used to 8 (default) 00 2 enable a master device to implement a 01 3 16 custom filter halt scheme. The master device can monitor the LTA and count values to 10 4 20 determine when a stuck condition has occurred. This setting is useful since the 11 6 30 master device can decide when the touch key is in a „stuck‟ condition, and a „Reseed‟ Again four values exist for each channel, and command could be initiated from the master to again a global secondary range can be rectify this. selected, changing the 4 available settings for On the IQS316, all channels can be all channels to a new set of 4 possibilities. individually reseeded if need be, otherwise a 3.3.10 Antenna Tuning Implementation global reseed is available. The ATI is a sophisticated technology 3.3.8 Touch Sensitivity (Touch Mode implemented in the new ProxSense® series channels only) devices. It allows optimal performance of the The touch sensitivity of each individual devices for a wide range of sensing electrode channel is a user defined threshold, calculated capacitances, without modification or addition as a ratio of the count value to the LTA. Note of external components. The ATI allows the that a user touching the sensor will cause the tuning of two parameters, an ATI Multiplier Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 9 of 28 November 2015 25 CxB4 / GPIO_0 26 CxB5/ GPIO_1 27 CxB6 / GPIO_4 28 CxB7 / GPIO_5 29 CxA4 / GPIO_2 30 CxA5 / GPIO_3 MOSI-I2CAO 1 24 CxA3 SOMI-SDA 2 23 CxA2 RDY 3 22 CxA1 PWWYY SCK-SCL 4 /SS-IRDY 5 IQS316 1iz ATI allows the designer to optimise a specific design by adjusting the sensitivity and stability of each channel through the adjustment of the ATI parameters. Please refer to Azoteq Application Note AZD027 for more information regarding ATI. 32 CxA7 / GPIO_7 and an ATI Compensation, to adjust the count value for an attached sensing electrode. 31 CxA6 / GPIO_6 IQ Switch® ProxSense® Series 21 CxA0 20 CxB3 IQS316 Datasheet Revision 1.03 VREG 16 SHLD_A 15 SHLD_B 14 ZC 13 ICTRL 12 RFIN 10 VddHI 9 Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. VSS 11 19 CxB2 The IQS316 has an automated ATI function. SPI_ENABLE 7 18 CxB1 This allows the designer to specify a count /MCLR 8 17 CxB0 target value for either the Prox- or Touch Mode channels, and then when activated, the system will increment the relevant ATI GND Compensation settings until the channels reach the target value. Figure 4.1 Ground plane routing Note that the ATI algorithm (and the ATI Busy indication) bit will only take effect once the 4.1.2 RF detection communication window where the AutoATI is In cases of extreme RF interference, the onrequested has been ended. chip RF detection is suggested. By connecting a suitable antenna to the RF pin, it 4 Additional Features allows the device to detect RF noise and notify the master of possible corrupt data. A 50Ω 4.1 RF Immunity pull-down resistor should be placed on RFIN. The IQS316 has immunity to high power RF Note that the value of the resistor should noise. In this section general design match the impedance of the antenna. guidelines will be given to improve noise immunity and the noise detection functionality Noise affected samples are not allowed to influence the LTA filter, and also do not is explained. contribute to PROX or TOUCH detection. 4.1.1 Design Guidelines If this function is not implemented in design, it To improve the RF immunity, extra decoupling is recommended to disable the noise detection capacitors are suggested on VREG and VDDHI. in the firmware. Place a 100pF in parallel with the 1uF ceramic 4.2 Active Shield on VREG and VDDHI. All decoupling capacitors should be placed as close as possible to the The IQS316 has two active driven shield outputs, shielding the sensor lines from false VDDHI and VREG device pins. touches and proximities, and countering the PCB ground planes also improve noise effect of parasitic ground sources. Using immunity. Care must be taken to not pour internal driven shields in applications where these planes near the tracks/pins of the the environment requires shielding lowers the sensing lines, see Figure 4.1. Ground/voltage cost of the final solution by avoiding the planes close to the sensing channels have a necessity of external shield components. negative effect on the sensitivity of the sensors. Note, if I/O‟s are used instead of the Manual control of the shield is provided by the sensor lines, the ground pour can also go IQS316 (allowing CxA0/CxB0 to CxA6/CxB6 to be shielded). Additionally, an automatic under these pins. shield implementation can be selected, allowing automatic setup of the shield each cycle. The channels that are set by the POUT Page 10 of 28 November 2015 IQ Switch® ProxSense® Series automatic selection are highlighted in the table. 4.3 Proximity Output (POUT) Group 0 SHLD_A CxA0 SHLD_B CxB0 1 CxA0 CxB0 2 CxA1 CxB1 All the individual PROX status for each channel is available through the device memory map, but an additional POUT I/O has been added. This I/O is active HIGH when any of the PROX channels (CH0 – CH3) sense a PROX. This could, for example, be used to control the backlighting of an application. 3 CxA2 CxB2 4.4 Zero Cross Synchronising 4 CxA3 CxB3 When an application is operated in a noisy AC environment, it could be required to synchronise the charging to the AC. This reduces the noise influence on the count value. This is not normally required since the Prox Mode filters should remove this AC component, but is available if needed. Table 4.1 Automatic Shield Setting Channels The active driven shields follow the waveforms of the sensor lines. A screenshot of two pairs of shield and sensor lines are illustrated in Figure 4.2. It can be seen that generally 2 different channels have very similar signals, and it has been found that the shield of a specific channel can be effectively used to If unused, it is best to connect directly to GND. shield the other channels in the same timeslot 4.5 Device Sleep (Group). The IQS316 can be placed in low power SLEEP mode. This however is a totally inactive state, and no channel sensing is performed. This could be used if an application does not require the keys to be sensed, or if custom low power mode is implemented. All the device settings and data is retained after waking from the sleep. 4.6 Communication Bypass Figure 4.2 Active shields Pull-up resistors are required on each shield line as shown in Figure 6.9 and Figure 6.10. A suggested value for the pull-up resistors are 2kΩ when using the controller at 3.3V, and 4.7kΩ when using the controller at 5V. Smaller resistor values will increase the driving ability of the shield, but will also increase the current consumption. The IQS316 can be set up to bypass the communication window. This could be useful if a master does not want to be interrupted during every charging cycle of the IQS316. The communication will be resumed (Ready will indicate available data) if the IQS316 senses a proximity. The master can also initiate communication if required (only in SPI). Therefore the master sends a command to bypass the communication. The IQS316 then continually does conversions without interaction with the master, until a proximity occurs, which is most likely the first time that the master will be interested in the IQS316 data. For more information regarding shielding, refer to the application note “AZD009 If the master wants to force the Implementation of Driven Shield”. communication to resume in SPI mode, then Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 11 of 28 November 2015 IQ Switch® ProxSense® Series the /SS must be pulled LOW to select the device. Then the master must still wait for the RDY to go HIGH, then communication is resumed. After communication is resumed, both by the master or the slave, then the bypass is removed. Thus if required again, it must be reconfigured. 4.7 General Purpose I/O’s The IQS316 has 8 GPIO‟s available. It is possible to use 0, 4 or 8 I/O‟s, leaving 16, 12 or 8 Cx channels respectively. These I/O‟s can be controlled via the memory map. The following considerations should be given when using these I/O‟s: - They provide only a logic level indication (no current sourcing capabilities), thus for example, if LED‟s are to be switched, the I/O must connect to the gate of a FET (thus only capacitive loads). decisions are highlighted here, referring to Figure 5.1 to illustrate the options. This is mostly important when less than 16 keys are required, and the Cx‟s that are to be used in the design are chosen. Group 0 Group 1 Group 2 Group 3 Group 4 Row 0 CH0 (CxA0-CxA3) CH4 (CxA0) CH8 (CxA1) CH12 (CxA2) CH16 (CxA3) Row 1 CH1 (CxB0-CxB3) CH5 (CxB0) CH9 (CxB1) CH13 (CxB2) CH17 (CxB3) Row 2 CH2 (CxA4-CxA7) CH6 (CxA4) CH10 (CxA5) CH14 (CxA6) CH18 (CxA7) Row 3 CH3 (CxB4-CxB7) CH7 (CxB4) CH11 (CxB5) CH15 (CxB6) CH19 (CxB7) Figure 5.1 Cx Channel Selection 5.2.1 Cx Sensor Close to Noise Source - Updating the TRIS of the I/O‟s is only done after the termination of the communication window. - The state of a GPIO can only be read/written during a communication window, since it is controlled via the memory map. If the design is such that some channels will be in close proximity to a noisy environment, it is always good to group these channels together in the same row, where rows are illustrated in Figure 5.1. This is so that if channels are affected by noise, they will influence less of the Prox Mode channels (noise could reduce the effectiveness of proximity sensing). These Prox Mode channel(s) can then be set up with an insensitive PROX threshold, or can be disabled. - The I/O‟s switch to Vreg voltage. 5.2.2 Cx Sensors Requiring Shield If the design requires the use of shields, it can be useful to select the Cx‟s according to those used by the automatic shield function (Section 5.1 Physical Layout 4.2). The Cx‟s used by this are circled in For more information regarding the layout of Figure 5.1. the buttons / electrode, please refer to the 5.2.3 Cx Sensors Used For Prox application note “AZD008 Design Guidelines for Touch Pads.” Information such as button If specific channels are required to provide proximity sensing, then it is size and shape, overlay type and thickness, good recommended to also keep these in the same sensor line routing, and ground effects on row, preferably row0 and row1 as circled sensing are highlighted. (since these are part of CH0 and CH1 which 5.2 Cx Selection are default active). If you require independent proximity information, then these channels A few points need to be considered when must be chosen to be in different rows (since designing a multi-key application. Factors all channels in the same row charge together such as noise, shielding and proximity to give a collective PROX result). requirements need to be evaluated. A few key 5 Application Design Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 12 of 28 November 2015 IQ Switch® ProxSense® Series 5.2.4 Cx Sensors plus I/O’s @ 8Mhz) to be serviced. If the device is not serviced within this time, a reset will occur. The watchdog is disabled by default and can be enabled in the Memory Map. It is advised to disable the watchdog timer during the development phase. If the I/O‟s are to be used, the Cx‟s must be selected appropriately. If 8 I/O‟s are used, then the 8 Cx‟s available are again those circled in the figure, the remaining are then converted to I/O‟s. If 12 Cx‟s are required with The watchdog is also not crucial, since a 4 I/O‟s, then the I/O‟s used will be either: MCLR pin is available for the master to reset CxA4, CxA5, CxB4 and CxB5 or the IQS316. The MCLR has an internal pullCxA6, CxA7, CxB6 and CxB7. up resistor. To reset, pull the MCLR LOW The remaining 12 will thus be the sensor lines. (active LOW). 5.2.5 Unused Cx’s It is important to disable unused Cx‟s, since this increases the response time of the device, as shown in Table 7.5. 6 Communication The IQS316 can communicate in SPI or I2C using the respective standard communication Figure 6.1 Communication start-up protocols. Both communication protocols are time implemented with similar interaction with the memory map. For both of the communication It can be seen in Figure 6.1 that it takes protocols, the respective Ready I/O will be set roughly 16ms for communication to start after when data is available. the MCLR pin has been released. The IC 2 A general I C and SPI Memory Map is defined does an initial conversion, while performing so that all ProxSense® devices can use a device initialisation and calculations, after standard framework. The complete Memory which the communication window is available. Map is defined in the “AZD032 IQS316 Communication Interface” document. This document is a design guideline covering all the specific device details, device information, and settings. In I2C and SPI mode a WRITE = 00 and a READ = 01. 6.3 SPI SPI uses a memory mapped structure when sending or retrieving data to/from the IC. The device must be selected by pulling the /SS low. At the beginning of a communication window, the pointer will be set to a default value. This 6.1 Communication Selection value can be overwritten to change the default The IQS316 uses I2C communication by pointer position. Note that the clock polarity is default. To enable SPI communication, the idle high, and the data is sampled at the SPI enable pin must be pulled HIGH at start- second edge of the clock pin (rising edge). up, which will configure the device to SPI mode. The SPI_ENABLE input pin can be connected to VDDHI or a pull-up resistor smaller than 39kΩ can be used. 6.2 Watchdog Timeout and MCLR When data is available, and Ready is set, the device will allow a full watchdog period (16ms Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 13 of 28 November 2015 IQ Switch® ProxSense® Series data read from the IC will be from that specific address, as long as that address is a valid Read Address from the memory map. This speeds up the reading of sporadic addresses, by allowing addresses to be specified „on the fly‟. When an illegal address is specified in a read operation, the device will return a „27‟ decimal, the IQS316 product number. /SS RDY SCK MOSI bit7 SOMI 7 bit6 Figure 6.2 bit5 bit5 bit3 bit2 bit1 bit0 0 SPI timing illustration 6.3.1 SPI read The SPI read is performed by sending the „Read‟ bit in the control byte during the first data time-slot. The pointer will increment and step through the relevant memory mapped blocks, as long as the value sent in to the device is „FE‟. If an „FF‟ is sent, the SPI read cycle is terminated. If any value other than a „FE‟ or an „FF‟ is received, that value will be loaded into the address pointer, and the next An example of the read process is illustrated in Figure 6.3. Header FF MCU Data @ pointer Data @ pointer+1 Data @ Adr 12 Data @ Adr 13 SOMI Stop Control R 01 FE 12 FF FE MOSI Overwrite Pointer with address ‘12’ Figure 6.3 SPI Read Header MCU 00 FF 01 00 01 Control W 00 SOMI Stop Address n Figure 6.4 6.3.2 SPI write Similar to the read, while receiving the „header‟ byte, a WRITE must be selected in the control byte. The address to which to write to always precedes the data (address, data, address, data…) Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. 00 Data n Address n+1 Data n+1 FF MOSI SPI Write An example of the SPI write process is given in Figure 6.4. If an „FF‟ is sent as an address, the Write cycle is terminated. The value „FF‟ is sent in the Read and Write cycle to terminate the respective cycles, but will not terminate the communication window. IQS316 Datasheet Revision 1.03 Page 14 of 28 November 2015 IQ Switch® ProxSense® Series 6.3.3 SPI Communications Terminate Command Window 6.4.2 I2C read With the R/W bit SET in the control byte, a read is initiated. Data will be read from the address specified by the internal address pointer (Figure 6.6). This pointer will be automatically incremented to read through the memory map data blocks. If a random address is to be read, a Random Read must be performed. The process for a Random Read is as follows: write to the pointer (Word 6.4 I2C Address in Figure 6.7), initiate a repeated2 The IQS316 can communicate on an I C Start, read from the address. compatible bus structure. Note that 4.7kΩ Current Address Read pull-up resistors should be placed on SDA and Start Control Byte Data n Data n+1 Stop SCL. NACK S S ACK ACK Once the master received all required data from the device, and has written any required settings to the device, the communication must be ended, so that the IC can perform another charge transfer. To achieve this, a value of „FE‟ must be written in the Address time slot of a WRITE cycle. 6.4.1 Control byte and Device Address The Control byte indicates the 7-bit device address and the Read/Write indicator bit. The structure of the control byte is shown in Figure 6.5. Figure 6.6 I2C Current Address Read Random Read Start Control Byte S Start Word Address(n) ACK ACK Control Byte S Data n Stop NACK ACK S 7 bit address Figure 6.7 MSB 1 1 1 0 I2C Group Figure 6.5 1 I2CA1 I2CA0 R/W LSB Sub-addresses I2C control byte The I2C device has a 7 bit Slave Address in the control byte as shown in Figure 6.5. To confirm the address, the software compares the received address with the device address. Sub-address 0 of the device address is a static variable read from state of the I2CA0 pin at start-up. The default value of Sub-address 1 (I2CA1) is „0‟, please contact your local Azoteq distributor for devices with I2CA1 set to „1‟. The two sub-addresses allow 4 IQS316 slave devices to be used on the same I2C bus, as well as to prevent address conflict. The fixed device address is „11101‟ followed by the 2 sub-address bits, giving a default 7bit address of „1110100‟. Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. I2C Random Read 6.4.3 I2C write With the R/W bit cleared in the control byte, a write is initiated. An I2C write is performed by sending the address, followed by the data. Unlike the SPI write, the Address is only sent once, followed by data bytes. A block of data can be written by sending the address followed by multiple blocks of data. The internal address pointer is incremented automatically for each consecutive write, if the pointer increments to an address which doesn‟t exist in the memory map, no write will take place. Note that the pointer doesn‟t automatically jump from the end of the LT average block to the settings block. An example of the write process is given in Figure 6.8. DATA WRITE Start S Control Byte Word Address(n) ACK ACK Figure 6.8 IQS316 Datasheet Revision 1.03 Data n Data n+1 ACK Stop ACK S I2C write Page 15 of 28 November 2015 IQ Switch® ProxSense® Series 6.4.4 I2C Communications Terminate Command Window Circuit diagrams of implementations using additional features are shown in Figure 6.9 and Figure 6.10. Additional 100pF decoupling To terminate the communication window in capacitors are placed on VDDHI and VREG to I2C, a STOP is given. When sending increase the noise immunity of the controller. numerous Read and Write commands in one In Figure 6.9 the controller is configured to communication cycle, a „Repeated Start‟ communicate in SPI mode and in Figure 6.10 command must be used to stack them the controller is configured to communicate in together (since a STOP will jump out of the I2C mode. communication window, which is not desired). 6.5 Circuit diagrams (all features) VDDHI VDDHI IQS316 VDDHI SPI_ENABLE VREG (Optional) C1 1uF C2 100pF (Optional) C3 1uF C4 100pF CXA[7:0] CXA0 CXA1 CXA2 CXA3 CXB0 CXB1 CXB2 CXB3 CXA4 CXA5 CXA6 CXA7 CXB4 CXB5 CXB6 CXB7 CXB[7:0] GND GND MOSI SOMI RDY SCK /SS SPI Interface to Master Controller VDDHI VDDHI R2 R3 4k7 GND 4k7 GND Shield (Optional) SHLD_A SHLD_B MCLR MCLR C5 10nF (RF Optional) GND ZC ZC_IN (Zero-Cross Optional) RF antenna RF ICTRL 39k R4 R1 GND Figure 6.9 Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. GND 51R VSS GND GND Circuit diagram for SPI implementation IQS316 Datasheet Revision 1.03 Page 16 of 28 November 2015 IQ Switch® ProxSense® Series VDDHI IQS316 VDDHI SPI_ENABLE VREG 1uF (Optional) C3 100pF C4 1uF VDDHI VDDHI 100pF (Standard I2C pull-ups) GND R1 R2 CXA2 CXA3 CXB0 CXB1 CXB2 CXB3 CXA4 CXA5 CXA6 CXA7 CXB4 CXB5 CXB6 CXB7 VDDHI VDDHI SDA SCL IRDY I2CA0 I2C Interface to Master Controller CXA1 CXB[7:0] GND 10k GND 10k GND CXA0 CXA[7:0] R4 R5 4k7 C2 4k7 (Optional) C1 Shield (Optional) SHLD_A GND SHLD_B MCLR MCLR C5 10nF (RF Optional) GND RF antenna RF ZC VSS 39k ICTRL R6 R3 GND GND GND 51R ZC_IN (Zero-Cross Optional) GND 2 Figure 6.10 Circuit diagram for I C implementation VDDHI BACKLIGHTING LED VDDHI VDDHI IQS316 VDDHI SPI_ENABLE R VREG GPIO (7:0) GPIO (7:0) C2 100pF GND GND C3 1uF GND D 1 G Q1 S 3 C4 100pF GND GND VDDHI VDDHI MOSI SOMI RDY SCK /SS SPI Interface to Master Controller R2 R3 4k7 C1 1uF (Optional) 4k7 (Optional) 4 GPIO_0 Shield (Optional) SHLD_A SHLD_B MCLR MCLR CXA0 CXA1 CXA2 CXA3 CXB0 CXB1 CXB2 CXB3 CXA[3:0] CXB[3:0] C5 10nF (RF Optional) GND ZC ZC_IN (Zero-Cross Optional) RF antenna RF ICTRL 39k R4 R1 GND GND 51R VSS GND GND Figure 6.11 Circuit Diagram for 8 GPIO implementation Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 17 of 28 November 2015 IQ Switch® ProxSense® Series 7 Electrical specifications 7.1 Absolute maximum specifications Operating temperature Supply Voltage (VDDHI-VSS) Max pin voltage for ESD=VDDHI Maximum pin voltage for ESD=VREG Min pin voltage Min power on slope ESD protection (Human Body Model) Latch-up current -40°C to 85°C 5.5V VDDHI + 0.5V VREG + 0.5V VSS - 0.5V 100V/s 3kV 100mA 7.2 Operating conditions (Measured at 25°C) Table 7.1 Description Internal regulator output Supply voltage Normal operating current Normal operating current Low power operating current (LP1) Low power operating current (LP2) Low power operating current (LP3) Current in SLEEP mode Main Oscillator (8MHz setting) Electrical operating conditions Conditions 2.85V<VDDHI<5.5V 2. 85V<VDDHI<5.5V VDDHI=3.3V+4shields 2. 85V<VDDHI<5.5V 2. 85V<VDDHI<5.5V 2. 85V<VDDHI<5.5V 2. 85V<VDDHI<5.5V 2. 85V<VDDHI<5.5V Parameter VREG VDDHI INP INP ILP1 ILP2 ILP3 ISL Fosc Min 2.3 2.85 7.36 Typ 2.4 640 4 100 60 45 20 8 Max 2.5 5.5 680 25 8.64 Unit V V µA mA µA µA µA µA MHz Please Note: LP1, LP2 and LP3 are dependent on a variety of settings and thus a MIN/MAX value cannot sensibly be given. 7.3 Moisture Sensitivity Level Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device is allowed to be exposed to ambient room conditions (approximately 30°C/60%RH) before reflow must occur. Table 7.2 Package QFN5x5-32 QFR5x5-32 Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. MSL Level (duration MSL 3 (168 hours) MSL 3 (168 hours) IQS316 Datasheet Revision 1.03 Page 18 of 28 November 2015 IQ Switch® ProxSense® Series 7.4 Recommended storage environment for IC’s This storage environment assumes that the IC‟s are packed properly inside a humidity barrier bag Table 7.3 IC Storage Parameter Description Min Typ Max Unit Notes TSTG Storage Temperature -55 25 150 °C Recommended storage temperature is 25 °C ± 25 °C. Extended duration storage at temperatures above 85 °C degrades reliability as well as reduces data retention performance Tj Junction Temperature 150 °C Supplementary notes according to Jedec recommendations: Optimal Storage Temperature Range: 5 °C to 30 °C Humidity: between 40 to 70% RH Air should be clean Avoid harmful gasses and dust Avoid outdoor exposure or storage in areas subject to rain or water spraying Avoid storage in areas subject to corrosive gas or dust. Products shall not be stored in areas exposed to direct sunlight Avoid rapid changes of temperature Avoid condensation Mechanical stress such as vibration and impact shall be avoided The products shall not be placed directly on the floor The products shall be stored on a plane area. They should not be turned upside down. They should not be placed against the wall Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 19 of 28 November 2015 IQ Switch® ProxSense® Series 7.5 Timing characteristics (Measured at 25°C) Table 7.4 Description SPI clock frequency Timing characteristics Symbol FSCK Min Typical Max 0.4 0.8 Unit MHz I2C clock frequency FSCL Charge transfer oscillator (setting = osc/8) FCX Filter Halt Short tFHS 20 s Filter Halt Long tFHL 40 s TMODE 4 s Mode timer Table 7.5 Charging Mode Total Groups Charging Prox Mode 1 Prox Mode Prox Mode 1 1 0.1 0.92 1 MHz 1.08 MHz IQS316 Data Report Rate2 Number of Channels per Group 4 Total Channels Typical Unit 4 110 Note1 Hz 3 110 Note1 Hz 110 Note1 Hz 110 Note1 Hz 3 2 2 Prox Mode 1 1 1 Touch Mode 4 4 16 41 Hz Touch Mode Touch Mode Touch Mode Touch Mode Touch Mode Touch Mode 3 2 1 1 1 1 4 4 4 3 2 1 12 8 4 3 2 1 54 82 161 192 238 250 Hz Hz Hz Hz Hz Hz Note 1: In Prox Mode, the target charging frequency can decrease if certain situations exist. For example if lengthy communication is done, the frequency will decrease, of if the charge transfer is long (slower prox oscillator divider, or very high count values). Note 2: Measurements in Table 7.5 where obtained with the following settings: - Prox Mode count values = ±1000 - Touch Mode count values = ±500 - 4 bytes read per cycle (XY info, Prox, Touch and Group). Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 20 of 28 November 2015 IQ Switch® ProxSense® Series 8 Mechanical Dimensions 8.1 IQS316 Mechanical Dimensions P W F B Tt Wt C2 C1 A H T Figure 8.1 IQS316 Package. Drawings not too scale - illustration only. Packaging Dimensions. Table 8.1 QNR QFR DESCRIPTION MIN MAX A 4.90 5.10 4.90 5.10 mm B 4.90 5.10 4.90 5.10 mm C1 0 0.05 0 0.05 mm C2 0.203TYP F 0.600TYP H P T Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. 0.85 0.95 0.5TYP 0.3 0.5 Tt 3.3 TYP W 0.25TYP Wt 3.3 TYP Unit 0.203TYP mm 0.3 0.4 mm 0.85 0.95 mm 0.5TYP mm 0.3 0.5 mm 3.55 3.75 mm 0.25TYP 3.55 IQS316 Datasheet Revision 1.03 3.75 mm mm Page 21 of 28 November 2015 IQ Switch® ProxSense® Series 8.1.2 QFR package differences to QNR package The overall physical size of the part (l x w x h) and pitch of the pins did not change. The mechanical dimensions of the saddle (Tt & W t) and length of the pins (F) have changed from the old part (IQS316-0-QNR) to the new part (IQS316-0-QFR). The new dimensions are given below: IQS3160-QNR Figure 8.2 IQS3160-QFR Changes in Package. Only affected dimensions are shown. Drawing for illustration only, not too scale. Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 22 of 28 November 2015 IQ Switch® ProxSense® Series 8.2 IQS316 Landing Pad Layout X2 Y1 32 X1 31 30 29 28 27 26 25 1 24 2 23 3 22 4 21 33 5 20 6 19 7 18 8 17 10 9 11 12 14 13 15 Y2 C2 16 C1 Figure 8.3 IQS316 Footprint. Illustration not to scale. *NOTE: Pad 33 must be connected to GND. Table 8.2 Dimensions from Figure 8.3 QFN QFR Dimension Dimension Unit C1 4.90 4.85 mm C2 4.90 4.85 mm X1 0.30 0.25 mm X2 3.25 3.65 mm Y1 0.90 0.8 mm Y2 3.25 3.65 mm DESCRIPTION Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 23 of 28 November 2015 IQ Switch® ProxSense® Series 9 Datasheet and Part-number Information 9.1 Ordering Information IQS316 z pp b IC NAME BULK PACKAGING IC CONFIGURATION PACKAGE TYPE IC CONFIGURATION z = = 0 : I2C Sub-address 1 = 0 1 : I2C Sub-address 1 = 1 PACKAGE TYPE QN = QFN32 QF = QFR32 R = Reel (3000 pcs/reel) BULK PACKAGING QFN5x5-32 MOQ = 1 reel. Mass production orders shipped as full reels 9.2 Package Marking IQS316 x i z PWWYY IC NAME DATE CODE REVISION IC CONFIGURATION TEMPERATURE RANGE REVISION X = IC Revision Number TEMPERATURE RANGE i = -40°C to 85°C (Industrial) IC CONFIGURATION z = = I2C Sub-address 1 = 0 I2C Sub-address 1 = 1 DATE CODE P WW = = Package House Week Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 24 of 28 November 2015 IQ Switch® ProxSense® Series YY = Year 9.3 Tape and Reel Figure 9.1 Tape Dimensions Figure Table 9.1 LABEL A0 B0 D0 D1 E F K0 Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. Dimensions (mm) 5.3 ± 0.10 5.3 ± 0.10 1.5 ± 0.10 1.5 ± 0.25 1.75 ± 0.10 5.5 ± 0.05 1.1 ± 0.10 Tape Dimensions Table LABEL P0 P1 P2 10xP0 T W IQS316 Datasheet Revision 1.03 Dimensions (mm) 4.0 ± 0.10 8.0 ± 0.10 2.0 ± 0.05 40.0 ± 0.2 0.3 ± 0.05 12.0 ± 0.30 Page 25 of 28 November 2015 IQ Switch® ProxSense® Series Figure 9.2 Table 9.2 Tape Size 12 A(+0.25/-4.0) 330 13/04-04-1 N(±2.0) W1(+2/-0) 100 12.4 Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. Reel Dimension Figure Reel Dimension Table Combination 13/04-08-1 W2(Max) 18.4 IQS316 Datasheet Revision 1.03 Part Number T12-13/04-A1 W3(Min/Max) Sw 11.9/15.4 6.0 Page 26 of 28 November 2015 IQ Switch® ProxSense® Series 9.5 Revision History Revision Number V0.03 V0.04 History Added Section 2.2 Updated Figure 2.1 (new qfn package) Update Section 8.1. Fixed Section 9.1 bulk packaging description and removed tube option Added Section 9.3 (tape and reel details) Updated 7.1 (ESD Model) Updated patents Fixed text Section 3.2 V0.05 Terminology updated Updated to Section 4.6 Updated to Section 2.2 Updated Section 4.4 Connected ZC to ground in Figure 1.1 Added ground tab information to Section 8.1.2 Updated Figure 2.1 Updated Section 4.1.2 Added MSL details Section 7.3 Added footer first page Updated Table 3.3 and Table 3.4 to show selection bits Updated Section 3.3.10 Updated Table 7.4 Updated contacts section V1.01 Add QFR32 package descriptions V1.02 Updated contacts section V1.03 Updated current consumption values in Table 7.1 Added storage temperature Section 7.4 V1.00 Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 27 of 28 November 2015 IQ Switch® ProxSense® Series Appendix A. Contact Information USA Asia South Africa Physical 6507 Jester Blvd Address Bldg 5, suite 510G Austin TX 78750 USA Rm2125, Glittery City Shennan Rd Futian District Shenzhen, 518033 China 109 Main Street Paarl 7646 South Africa Postal Address 6507 Jester Blvd Bldg 5, suite 510G Austin TX 78750 USA Rm2125, Glittery City Shennan Rd Futian District Shenzhen, 518033 China PO Box 3534 Paarl 7620 South Africa Tel +1 512 538 1995 +86 755 8303 5294 ext 808 +27 21 863 0033 Fax +1 512 672 8442 Email [email protected] +27 21 863 1512 [email protected] [email protected] Please visit www.azoteq.com for a list of distributors and worldwide representation. The following patents relate to the device or usage of the device: US 6,249,089 B1; US 6,621,225 B2; US 6,650,066 B2; US 6,952,084 B2; US 6,984,900 B1; US 7,084,526 B2; US 7,084,531 B2; US 7,265,494 B2; US 7,291,940 B2; US 7,329,970 B2; US 7,336,037 B2; US 7,443,101 B2; US 7,466,040 B2 ; US 7,498,749 B2; US 7,528,508 B2; US 7,755,219 B2; US 7,772,781 B2; US 7,781,980 B2; US 7,915,765 B2; US 7,994,726 B2; US 8,035,623 B2; US RE43,606 E; US 8,288,952 B2; US 8,395,395 B2; US 8,531,120 B2; US 8,659,306 B2; US 8,823,273 B2; EP 1 120 018 B2; EP 1 206 168 B1; EP 1 308 913 B1; EP 1 530 178 A1; EP 2 351 220 B1; EP 2 559 164 B1; CN 1330853; CN 1783573; AUS 761094; HK 104 1401 ® ® TM IQ Switch , SwipeSwitch™, ProxSense , LightSense™, AirButton , ProxFusion™, Crystal Driver™ and the logo are trademarks of Azoteq. The information in this Datasheet is believed to be accurate at the time of publication. Azoteq uses reasonable effort to maintain the information up-to-date and accurate, but does not warrant the accuracy, completeness or reliability of the information contained herein. All content and information are provided on an “as is” basis only, without any representations or warranties, express or implied, of any kind, including representations about the suitability of these products or information for any purpose. Azoteq disclaims all warranties and conditions with regard to these products and information, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party intellectual property rights. Azoteq assumes no liability for any damages or injury arising from any use of the information or the product or caused by, without limitation, failure of performance, error, omission, interruption, defect, delay in operation or transmission, even if Azoteq has been advised of the possibility of such damages. The applications mentioned herein are used solely for the purpose of illustration and Azoteq makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Azoteq products are not authorized for use as critical components in life support devices or systems. No licenses to patents are granted, implicitly, express or implied, by estoppel or otherwise, under any intellectual property rights. In the event that any of the abovementioned limitations or exclusions does not apply, it is agreed that Azoteq‟s total liability for all losses, damages and causes of action (in contract, tort (including without limitation, negligence) or otherwise) will not exceed the amount already paid by the customer for the products. Azoteq reserves the right to alter its products, to make corrections, deletions, modifications, enhancements, improvements and other changes to the content and information, its products, programs and services at any time or to move or discontinue any contents, products, programs or services without prior notification. For the most up-to-date information and binding Terms and Conditions please refer to www.azoteq.com. www.azoteq.com/ip [email protected] Copyright © Azoteq (Pty) Ltd 2015 All rights reserved. IQS316 Datasheet Revision 1.03 Page 28 of 28 November 2015