NLAS3257 Mux / Demux Analog Switch The NLAS3257 Mux / Demux Analog Switch is an advanced high−speed single pole double throw (SPDT) analog switch in ultra−small footprint. Features • • • • • • High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V RON: 7.5 , Typ @ VCC = 4.2 V CON: 7.5 pF, Typ @ VCC = 3.3 V VCC Range: 1.65 V to 4.5 V Ultra−Small 1 x 1 mm Package These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications www.onsemi.com MARKING DIAGRAM XLLGA6 1.0 x 1.0 CASE 713AD L M LM = Specific Device Code = Date Code • Mobile Phones, PDAs, Camera ORDERING INFORMATION B1 1 6 S GND 2 5 VCC B0 3 4 A See detailed ordering and shipping information on page 6 of this data sheet. Figure 1. XLLGA6 (Top View) A B0 B1 S Figure 2. Logic Diagram Function Table Input S Function L A = B0 H A = B1 © Semiconductor Components Industries, LLC, 2015 December, 2015 − Rev. 1 1 Publication Order Number: NLAS3257/D NLAS3257 Table 1. MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage −0.5 to +5.5 V VIN Control Input Voltage (S Pin) −0.5 to +5.5 V VI/O Switch Input / Output Voltage (A, B0, B1 Pins) −0.5 to +5.5 V VIN < GND −50 mA VI/O < GND or VI/O > VCC ±50 mA IIK Control Pin DC Input Diode Current (S Pin) IOK Switch I/O Port DC Diode Current (A, B0, B1 Pins) IO On−State Switch Current ±128 mA Continuous Current Through VCC or GND ±150 mA ICC DC Supply Current per Supply Pin ±150 mA IGND DC Ground Current per Ground Pin ±150 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C JA Thermal Resistance (Note 1) XLLGA6 466 °C/W PD Power Dissipation in Still Air at 85°C (Note 1) XLLGA6 269 mW MSL Moisture Sensitivity FR Flammability Rating VESD ILATCHUP Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Mode (Note 2) Machine Mode (Note 3) Charged Device Mode (Note 4) Latchup Performance Above VCC and Below GND at 85°C (Note 5) >6000 >200 N/A V ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/ JESD22−A114−A 3. Tested to EIA/ JESD22−A115−A 4. Tested to JESD22−C101−A 5. Tested to EIA / JESD78. Table 2. RECOMMENDED OPERATING CONDITIONS Symbol VCC VI VI/O Parameter Min Max Unit 1.65 4.5 V Control Pin Input Voltage (S Pin) 0 4.5 V Switch Input / Output Voltage (A, B0, B1 Pins) 0 VCC V −40 +85 °C 0 0 20 DC ns/V Positive DC Supply Voltage TA Operating Free−Air Temperature t / V Input Transition Rise or Fall Rate Control Input Switch I/O Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 NLAS3257 Table 3. DC ELECTRICAL CHARACTERISTICS (Typical: T = 25°C, VCC = 3.3 V) TA = −405C to +855C VCC (V) Min Control Input, High Voltage (S Pin) 2.7 3.3 4.2 0.8 1.0 1.25 VIL Control Input, Low Voltage (S Pin) 2.7 3.3 4.2 IIN Control Input, Leakage Current (S Pin) Symbol Parameter VIH Test Conditions Typ Max Unit V 0.3 0.4 0.5 V 0 ≤ VIN ≤ VCC 1.65 − 4.5 ±0.5 ±1.0 A IB0/B1_OFF Off State Leakage Current (B0/B1 Pins) VIN = VIL or VIH VB0 and VB1 = 0.3 V VA = 4 V 4.5 ±20 ±100 nA IA_ON On State Leakage Current (A Pin) VIN = VIL or VIH VB0 = 0.3 V or 4 V with VB1 = Floating or VB1 = 0.3 V or 4 V with VB0 = Floating VA = 0.3 V or 4.0 V 4.5 ±20 ±100 nA VIN = 0 or 4.5 V 0 ±100 nA 1.0 A 2.0 3.0 mA IPower_OFF Power Off Leakage Current (S Pin) ICC Quiescent Supply Current (VCC Pin) VIN = VCC or GND, VIS = VCC or GND, ILoad = 0 A 1.65 − 4.5 ICC Additional Quiescent Supply Current (VCC Pin) VIN = VCC or GND, VIS = VCC or GND, ILoad = 0 A 3.3 4.2 0.1 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Table 4. ON RESISTANCE (Typical: T = 25°C) TA = −405C to +855C Symbol Min Typ Max Test Conditions VCC (V) ON−Resistance ION = 8 mA, VIS = 0 V to VCC 2.7 3.3 4.2 9.3 8.7 7.5 RFLAT ON−Resistance Flatness ION = 8 mA, VIS = 0 V to VCC 2.7 3.3 4.2 3.6 3.3 2.9 RON Delta ON− Resistance ION = 8 mA, VIS = 0 V to VCC 2.7 3.3 4.2 0.8 0.7 0.5 RON Parameter www.onsemi.com 3 Unit NLAS3257 AC ELECTRICAL CHARACTERISTICS Table 5. TIMING/FREQUENCY (Typical: T = 25°C, VCC = 3.3 V, RL = 50 , CL = 5 pF, f = 1 MHz) TA = −405C to +855C Symbol Parameter tPD Propagation Delay, A to Bn or Bn to A Test Condition VCC (V) Min Typ 1.65 − 4.5 Max Unit 0.25 ns tON Turn−ON Time (See Figures 4 and 5) 1.65 − 4.5 12 30 ns tOFF Turn−OFF Time (See Figures 4 and 5) 1.65 − 4.5 8.0 25 ns tBBM Break−Before−Make Time (See Figure 3) 1.65 − 4.5 BW −3 dB Bandwidth CL = 5 pF 1.65 − 4.5 2.0 ns 900 MHz Table 6. ISOLATION (Typical: T = 25°C, VCC = 3.3 V, RL = 50 , CL = 5 pF) TA = −405C to +855C Symbol Parameter OIRR OFF−Isolation XTALK Non−Adjacent Channel Crosstalk Min Typ Max Test Condition VCC (V) Unit f = 240 MHz (See Figure 6) 1.65 − 4.5 −21 dB f = 240 MHz 1.65 − 4.5 −21 dB Table 7. CAPACITANCE (Typical: T = 25°C, VCC = 3.3 V, f = 1 MHz) TA = −405C to +855C Symbol Parameter Test Condition Min Typ Max Unit CIN Control Input Capacitance S pin 2.0 pF CON ON Capacitance Switch ON A to B0 A to B1 7.5 pF COFF OFF Capacitance Switch OFF B0 OFF B1 OFF 2.5 pF www.onsemi.com 4 NLAS3257 VCC DUT VCC Input Output GND VOUT 0.1 F 50 tBMM 35 pF 90% 90% of VOH Output Switch Select Pin GND Figure 3. tBBM (Time Break−Before−Make) VCC Input DUT VCC 0.1 F 50% 0V Output VOUT Open 50% 50 VOH 90% 35 pF 90% Output VOL Input tON tOFF Figure 4. tON/tOFF VCC VCC Input DUT Output 50 50% VOUT Open 50% 0V VOH 35 pF Output Input tOFF Figure 5. tON/tOFF www.onsemi.com 5 10% 10% VOL tON NLAS3257 50 Reference DUT Transmitted Input Output 50 Generator 50 Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. ǒVVOUT Ǔ for VIN at 100 kHz IN VOUT Ǔ for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log ǒ VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 Figure 6. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DEVICE ORDERING INFORMATION Device NLAS3257CMX2TCG Package Shipping† XLLGA6 − 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 6 NLAS3257 PACKAGE DIMENSIONS XLLGA6 1.0x1.0, 0.35P CASE 713AD ISSUE O ÇÇ ÇÇ PIN ONE REFERENCE 0.05 C 2X 0.05 C 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO THE PLATED TERMINALS AND IS MEASURED BETWEEN 0.15 AND 0.25 MM FROM THE TERMINAL TIPS. 4. COPLANARITY APPLIES TO ALL OF THE TERMINALS. A B D E DIM A A1 b D E e e2 L L1 TOP VIEW 0.05 C A 0.05 C A1 SIDE VIEW NOTE 4 SEATING PLANE C RECOMMENDED SOLDERING FOOTPRINT* 0.35 PITCH L1 e 6X 1 2 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.17 0.23 1.00 BSC 1.00 BSC 0.35 BSC 0.60 BSC 0.27 0.33 0.05 REF L 5X 0.50 3 PACKAGE OUTLINE e2 6 5 4 6X BOTTOM VIEW 1.25 1 0.55 b 0.07 M C A B 0.05 M C 6X 0.22 DIMENSIONS: MILLIMETERS NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NLAS3257/D