Formosa LFM120-MHT Chip schottky barrier rectifier Datasheet

Chip Schottky Barrier Rectifier
Formosa
MS
LFM120-MHT THRU LFM140-MHT
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
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TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-12164X
2013/12/17
Revised Date
-
Revision
A
Page.
7
Chip Schottky Barrier Rectifier
Formosa
MS
LFM120-MHT THRU LFM140-MHT
1.0A Surface Mount Schottky Barrier
Rectifiers - 20V-40V
Package outline
Features
• Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
•
•
SOD-123HT
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Low power loss, high efficiency.
High current capability, l ow forward voltage drop.
High surge capability.
Guardring for overvoltage protection.
Ultra high-speed switching.
Silicon epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Suffix "-H" indicates Halogen free parts, ex. LFM120-MHΤ-H
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.055(1.4)
0.039(1.0)
0.024(0.6)
0.031(0.8) Typ.
0.083(2.1)
Mechanical data
0.075(1.9)
0.004(0.10)Typ.
0.016(0.4)Typ.
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123HT
• Terminals :Plated terminals, solderable per MIL-STD-750,
0.051(1.3)
0.043(1.1)
0.032(0.8)
0.024(0.6)
0.0335(0.85)
0.0296(0.75)
0.047(1.2)
0.039(1.0)
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
0.047(1.2)
0.039(1.0)
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics (AT
PARAMETER
o
T A=25 C unless otherwise noted)
CONDITIONS
Forward rectified current
See Fig.1
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
Symbol
MIN.
TYP.
O
V R = V RRM T J = 100 C
Diode junction capacitance
f=1MHz and applied 4V DC reverse voltage
Storage temperature
1.0
A
I FSM
30
A
V RMS*2
(V)
*3
VR
(V)
LFM120-MHT
20
14
20
LFM130-MHT
30
21
30
LFM140-MHT
40
28
40
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*4
VF
(V)
Operating
temperature
T J, ( OC)
0.2
IR
mA
10
CJ
T STG
*1
V RRM
(V)
SYMBOLS
UNIT
IO
O
V R = V RRM T J = 25 C
Reverse current
MAX.
pF
160
O
+175
-65
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
0.45
-55 to +125
Page 2
*4 Maximum forward voltage@I F =1.0A
Document ID
Issued Date
DS-12164X
2013/12/17
Revised Date
-
Revision
A
Page.
7
Rating and characteristic curves (LFM120-MHT THRU LFM140-MHT)
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE
FIG.2-TYPICAL FORWARD
50
1.0
0.8
0.6
0.4
0.2
0
0
20
40
60
80
100
120
140
160
180
200
LEAD TEMPERATURE,(°C)
PEAK FORWARD SURGE CURRENT,(A)
FIG.3-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
INSTANTANEOUS FORWARD CURRENT,(A)
AVERAGE FORWARD CURRENT,(A)
CHARACTERISTICS
1.2
10
3.0
1.0
TJ=25 C
Pulse Width 300us
1% Duty Cycle
0.1
8.3ms Single Half
TJ=25 C
Sine Wave
.01
JEDEC method
.1
.3
.5
.7
.9
1.1
1.3
1.5
FORWARD VOLTAGE,(V)
FIG.5 - TYPICAL REVERSE
CHARACTERISTICS
100
NUMBER OF CYCLES AT 60Hz
REVERSE LEAKAGE CURRENT, (mA)
FIG.4-TYPICAL JUNCTION CAPACITANCE
JUNCTION CAPACITANCE,(pF)
700
600
500
400
300
200
10
1.0
TJ=75 C
.1
TJ=25 C
100
0
.01
.05
.1
.5
1
5
10
50
100
REVERSE VOLTAGE,(V)
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.01
0
20
40
60
80
100 120 140
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
Page 3
Document ID
Issued Date
DS-12164X
2013/12/17
Revised Date
-
Revision
A
Page.
7
Chip Schottky Barrier Rectifier
Formosa
MS
LFM120-MHT THRU LFM140-MHT
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
Symbol
1
2
1
2
Marking
Type number
Marking code
LFM120-MHT
LFM130-MHT
LFM140-MHT
12L
13L
14L
Suggested solder pad layout
SOD-123HT
0.036 (0.90)
0.044 (1.10)
0.048 (1.20)
0.075 (1.90)
0.036 (0.90)
0.028 (0.70)
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
DS-12164X
2013/12/17
Revised Date
-
Revision
A
Page.
7
Chip Schottky Barrier Rectifier
Formosa
MS
LFM120-MHT THRU LFM140-MHT
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOD-123HT
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.00
3.85
1.10
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
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TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
DS-12164X
2013/12/17
Revised Date
-
Revision
A
Page.
7
Chip Schottky Barrier Rectifier
Formosa
MS
LFM120-MHT THRU LFM140-MHT
Reel packing
PACKAGE
REEL SIZE
SOD-123HT
7"
COMPONENT
SPACING
REEL
(pcs)
(m/m)
4.0
3,000
BOX
(pcs)
30,000
INNER
BOX
REEL
DIA,
CARTON
SIZE
CARTON
APPROX.
GROSS WEIGHT
(m/m)
(m/m)
(m/m)
(pcs)
(kg)
183*123*183
178
382*257*387
240,000
9.0
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<3 C /sec
o
o
Time 25 C to Peak Temperature
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<6minutes
Page 6
Document ID
Issued Date
DS-12164X
2013/12/17
Revised Date
-
Revision
A
Page.
7
Chip Schottky Barrier Rectifier
Formosa
MS
LFM120-MHT THRU LFM140-MHT
High reliability test capabilities
Item Test
Conditions
Reference
O
MIL-STD-750D
METHOD-2031
O
MIL-STD-202F
METHOD-208
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16" ± 1/32"
2. Solderability
at 245 ± 5 C for 5 sec.
3. High Temperature Reverse Bias
V R=80% rate at T J=125 C for 168 hrs.
4. Forward Operation Life
Rated average rectifier current at T A=25 C for 500hrs.
MIL-STD-750D
METHOD-1038
O
MIL-STD-750D
METHOD-1027
O
O
5. Intermittent Operation Life
6. Pressure Cooker
T A = 25 C, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
O
15P SIG at T A=121 C for 4 hrs.
O
MIL-STD-750D
METHOD-1051
O
7. Temperature Cycling
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
9. Humidity
at T A=85 C , RH=85% for 1000hrs.
10. High Temperature Storage Life
at 175 C for 1000 hrs.
MIL-STD-750D
METHOD-4066-2
MIL-STD-750D
METHOD-1021
O
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MIL-STD-750D
METHOD-1031
O
Page 7
Document ID
Issued Date
DS-12164X
2013/12/17
Revised Date
-
Revision
A
Page.
7
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