Diodes DMT10H015LK3 100v n-channel enhancement mode mosfet Datasheet

DMT10H015LK3
Green
100V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
BVDSS
100V
Features
RDS(ON) Max
ID
TC = +25°C
15mΩ @ VGS = 10V
52.7A
18mΩ @ VGS = 6V
48A
25mΩ @ VGS = 4.5V
40A
100% Unclamped Inductive Switching (UIS) Test in Production –
Ensures More Reliable and Robust End Application

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
Low RDS(ON) – Minimizes Power Losses
Low QG – Minimizes Switching Losses
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Description
This new generation MOSFET features low on-resistance and fast
switching, making it ideal for high efficiency power management
applications.
Applications




Power Management Functions
DC-DC Converters
Backlighting



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

Top View
Case: TO252 (DPAK)
Case Material: Molded Plastic, ―Green‖ Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – Matte Tin Annealed over Copper Leadframe
Solderable per MIL-STD-202, Method 208
Weight: 0.33 grams (Approximate)
Pin Out Top View
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMT10H015LK3-13
Notes:
Case
TO252 (DPAK)
Packaging
2,500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
T115LK
YYWW
DMT10H015LK3
Document number: DS38736 Rev. 4 - 2
= Manufacturer’s Marking
T115LK = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 18 = 2018)
WW = Week Code (01 to 53)
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DMT10H015LK3
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
100
Unit
V
VGSS
±20
V
ID
52.7
42.1
A
Pulsed Drain Current (10s Pulse, Duty Cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 6)
IDM
150
A
IS
48
A
Pulsed Body Diode Forward Current (10s Pulse, Duty Cycle = 1%)
Avalanche Current, L = 3mH
Avalanche Energy, L = 3mH
ISM
150
A
IAS
7.5
85
A
mJ
Drain-Source Voltage
VDSS
Gate-Source Voltage
TC = +25°C
TC = +70°C
Continuous Drain Current, VGS = 10V
EAS
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Total Power Dissipation (Note 5)
PD
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Steady State
RθJA
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
PD
RθJA
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
Value
1.8
Unit
W
69
2.9
°C/W
W
42
°C/W
RθJC
2
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
100
—
—
—
—
—
—
1
±100
V
µA
nA
VGS = 0V, ID = 1mA
VDS = 80V, VGS = 0V
VGS = 20V, VDS = 0V
VGS(TH)
RDS(ON)
VSD
—
10.7
13.1
18.2
—
3.5
15
18
25
1.3
V
Static Drain-Source On-Resistance
1.4
—
—
—
—
VDS = VGS, ID = 250µA
VGS = 10V, ID = 20A
VGS = 6V, ID = 20A
VGS = 4.5V, ID = 5A
VGS = 0V, IS = 20A
CISS
COSS
CRSS
RG
QG
QGS
QGD
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
1871
261
6.9
0.75
33.3
6.9
5.1
6.5
7.0
19.7
8.1
37.9
51.9
—
—
—
—
—
—
—
—
—
—
—
—
—
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
mΩ
V
Test Condition
pF
VDS = 50V, VGS = 0V
f = 1MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
VDD = 50V, ID = 10A,
VGS = 10V
ns
VDD = 50V, VGS = 10V,
ID = 10A, RG = 6Ω
ns
nC
IF = 10A, di/dt = 100A/µs
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMT10H015LK3
Document number: DS38736 Rev. 4 - 2
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DMT10H015LK3
30
30.0
25
VGS = 4.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VDS = 10V
VGS = 4.5V
25.0
VGS=5.0V
20.0
VGS = 6.0V
VGS = 10.0V
15.0
10.0
VGS = 3.5V
5.0
20
15
125℃
10
85℃
5
25℃
150℃
VGS = 3.0V
-55℃
0.0
0
0
0.5
1
1.5
2
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
3
1
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (W)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(mΩ)
30
VGS = 4.5V
20
VGS = 6.0V
15
10
VGS = 10V
5
0
0.08
0.06
0.04
0.02
0
VGS = 10V
0.025
150℃
0.02
125℃
0.015
85℃
25℃
-55℃
0
0
5
10
15
20
25
30
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Junction Temperature
DMT10H015LK3
Document number: DS38736 Rev. 4 - 2
4
8
12
16
20
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(W)
0.03
ID = 20A
0
5
10
15
20
25
30
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
0.005
5
0.1
0
0.01
2
2.5
3
3.5
4
4.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
Figure 1. Typical Output Characteristic
25
1.5
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2.4
2.2
VGS = 10V, ID = 20A
2
1.8
1.6
1.4
1.2
VGS = 6V, ID = 20A
1
0.8
0.6
-50
-25
0
25
50
75
100 125
TJ, JUNCTION TEMPERATURE (℃)
150
Figure 6. On-Resistance Variation with Junction
Temperature
January 2018
© Diodes Incorporated
0.03
0.025
VGS = 6V, ID = 20A
0.02
0.015
0.01
VGS = 10V, ID = 20A
0.005
0
-50
3.5
3
ID = 1mA
2.5
2
ID = 250μA
1.5
1
0.5
0
-50
-25
0
25
50
75
100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Junction
Temperature
30
-25
0
25
50
75
100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
10000
f=1MHz
CT, JUNCTION CAPACITANCE (pF)
VGS = 0V
25
Is, SOURCE CURRENT (A)
4
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (W)
DMT10H015LK3
20
15
TJ = 85oC
10
TJ = 125oC
TJ = 25oC
TJ = 150oC
5
TJ = -55oC
Ciss
1000
Coss
100
Crss
10
1
0
0
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
0
1.5
10
20
30
40
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
1000
10
RDS(ON) LIMITED
6
4
VDS = 50V, ID = 10A
2
PW =1µs
100
ID, DRAIN CURRENT (A)
8
VGS (V)
50
10
1
0.1
Plz help
to replace Fig 12 by
PW =10µs
PW =100µs
attachment.
Thx.
TJ(MAX)=150℃
TC=25℃
Single Pulse
DUT on infinite
heatsink
VGS=10V
PW =1ms
PW =10ms
PW =100ms
PW =1s
0.01
0
0
5
10
15
20
Qg (nC)
25
30
35
Document number: DS38736 Rev. 4 - 2
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
1000
Figure 12. SOA, Safe Operation Area
Figure 11. Gate Charge
DMT10H015LK3
0.1
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DMT10H015LK3
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.7
D=0.5
D=0.3
D=0.9
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJC(t) = r(t) * RθJC
RθJC = 2℃/W
Duty Cycle, D = t1 / t2
D=Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
t1, PULSE DURATION TIME (sec)
0.1
1
10
Figure 13. Transient Thermal Resistance
DMT10H015LK3
Document number: DS38736 Rev. 4 - 2
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DMT10H015LK3
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
E
A
b3
7° ± 1°
c
L3
D
A2
L4
e
H
b(3x)
b2(2x)
Gauge Plane
0.508
D1
E1
Seating Plane
a
L
A1
TO252 (DPAK)
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b 0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c
0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
e
2.286
E 6.45 6.70 6.58
E1 4.32
H 9.40 10.41 9.91
L 1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0°
10°
All Dimensions in mm
2.74REF
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
X1
Dimensions
C
X
X1
Y
Y1
Y2
Y1
Y2
C
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
DMT10H015LK3
Document number: DS38736 Rev. 4 - 2
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2018, Diodes Incorporated
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DMT10H015LK3
Document number: DS38736 Rev. 4 - 2
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